Aaron Trent Ward

US Patent:

6627098, Sep 30, 2003

Filed:

Mar 16, 2001

Appl. No.:

09/811188

Inventors:

Daniel G. Custer - Caldwell ID
Aaron Trent Ward - Kuna ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 536

US Classification:

216 88, 451288, 451388, 451398, 134 254, 15634512, 15634514

Abstract:

Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization. The second surface of the backing plate is a fixed, permanent surface.

US Patent:

6716802, Apr 6, 2004

Filed:

Apr 22, 1999

Appl. No.:

09/298160

Inventors:

Dan G. Custer - Caldwell ID
Aaron Trent Ward - Kuna ID
Shawn M. Lewis - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

C02F 120

US Classification:

510108, 510175, 95241, 95254, 210220, 210900

Abstract:

The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface. In another aspect the invention includes a method of polishing a substrate surface comprising: a) providing a polishing slurry between a substrate surface and a polishing pad; b) polishing the substrate surface with the polishing slurry; and c) removing the polishing slurry from the substrate surface, the removing comprising: i) providing a liquid; ii) removing a first gas from the liquid to reduce a total dissolved gas concentration in the liquid; iii) after the removing, dissolving a second gas in the liquid to increase the total dissolved gas concentration in the liquid; iv) after the dissolving, providing the liquid between the substrate surface and the polishing pad to displace the polishing slurry from the substrate surface.

US Patent:

6719823, Apr 13, 2004

Filed:

Oct 15, 2002

Appl. No.:

10/271522

Inventors:

Dan G. Custer - Caldwell ID
Aaron Trent Ward - Kuna ID
Shawn M. Lewis - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B01D 1900

US Classification:

95 46, 95254, 95263, 95265, 96 6

Abstract:

The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface.

US Patent:

6787055, Sep 7, 2004

Filed:

Jun 9, 2003

Appl. No.:

10/457883

Inventors:

Daniel G. Custer - Caldwell ID
Aaron Trent Ward - Kuna ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B44C 122

US Classification:

216 92, 451 28, 451 41, 451269, 511313

Abstract:

Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization. The second surface of the backing plate is a fixed, permanent surface.

US Patent:

7014535, Mar 21, 2006

Filed:

Sep 7, 2004

Appl. No.:

10/935839

Inventors:

Daniel G. Custer - Caldwell ID, US
Aaron Trent Ward - Kuna ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 5/36

US Classification:

451 41, 451285, 451286, 451287, 451288, 438689

Abstract:

Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization. The second surface of the backing plate is a fixed, permanent surface.

US Patent:

7052375, May 30, 2006

Filed:

Jul 29, 2005

Appl. No.:

11/193259

Inventors:

Daniel G. Custer - Caldwell ID, US
Aaron Trent Ward - Kuna ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 5/36

US Classification:

451 63, 451288, 451388, 451398, 216 88, 134 254, 15634512

Abstract:

Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization. The second surface of the backing plate is a fixed, permanent surface.

US Patent:

7160179, Jan 9, 2007

Filed:

Jul 29, 2005

Appl. No.:

11/193087

Inventors:

Daniel G. Custer - Caldwell ID, US
Aaron Trent Ward - Kuna ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B44C 1/22

US Classification:

451 41, 451 28, 451285, 451388, 216 92

Abstract:

Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization. The second surface of the backing plate is a fixed, permanent surface.

US Patent:

6007406, Dec 28, 1999

Filed:

Dec 4, 1997

Appl. No.:

8/984730

Inventors:

Dan G. Custer - Caldwell ID
Aaron Trent Ward - Kuna ID
Shawn M. Lewis - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 700

US Classification:

451 36

Abstract:

The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface. In another aspect the invention includes a method of polishing a substrate surface comprising: a) providing a polishing slurry between a substrate surface and a polishing pad; b) polishing the substrate surface with the polishing slurry; and c) removing the polishing slurry from the substrate surface, the removing comprising: i) providing a liquid; ii) removing a first gas from the liquid to reduce a total dissolved gas concentration in the liquid; iii) after the removing, dissolving a second gas in the liquid to increase the total dissolved gas concentration in the liquid; iv) after the dissolving, providing the liquid between the substrate surface and the polishing pad to displace the polishing slurry from the substrate surface.