Adam Jonathan Cohen

US Patent:

6475369, Nov 5, 2002

Filed:

Jan 18, 2000

Appl. No.:

09/487408

Inventors:

Adam L. Cohen - Rancho Palos Verdes CA

Assignee:

University of Southern California - Los Angeles CA

International Classification:

C25D 502

US Classification:

205135, 205118

Abstract:

An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

US Patent:

6572742, Jun 3, 2003

Filed:

Jan 20, 2000

Appl. No.:

09/488142

Inventors:

Adam L. Cohen - Rancho Palos Verdes CA

Assignee:

University of Southern California - Los Angeles CA

International Classification:

C25D 1706

US Classification:

20429705, 204224 R

Abstract:

An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

US Patent:

6613972, Sep 2, 2003

Filed:

Jan 5, 2001

Appl. No.:

09/755985

Inventors:

Adam L. Cohen - Los Angeles CA
Paul Ronney - Monrovia CA
Uri Frodis - Los Angeles CA
Lars Sitzki - Niedernhausen, DE
Eckart Meiburg - Santa Barbara CA
Steffen Wussow - Hamburg, DE

Assignee:

University of Southern California - Los Angeles CA

International Classification:

H01L 3528

US Classification:

136209, 136204, 136211, 136212

Abstract:

A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.

US Patent:

6790377, Sep 14, 2004

Filed:

Jan 28, 2000

Appl. No.:

09/493496

Inventors:

Adam L. Cohen - Rancho Palos Verdes CA

Assignee:

University of Southern California - Los Angeles CA

International Classification:

C03C 1500

US Classification:

216 94, 216 12, 216 56

Abstract:

An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

US Patent:

6951456, Oct 4, 2005

Filed:

Jul 29, 2003

Appl. No.:

10/630513

Inventors:

Adam L. Cohen - Los Angeles CA, US
Paul D. Ronney - Monrovia CA, US
Uri Frodis - Los Angeles CA, US
Lars Sitzki - Niedernhausen, DE
Eckart H. Meiburg - Santa Barbara CA, US
Steffen Wussow - Hamburg, DE

Assignee:

University of Southern California - Los Angeles CA

International Classification:

F23D014/02

US Classification:

431215, 136209, 136204, 136211, 136212, 431116, 431242, 431247, 431254, 431258, 431350, 110204

Abstract:

A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.

US Patent:

7109118, Sep 19, 2006

Filed:

May 7, 2004

Appl. No.:

10/841100

Inventors:

Adam L. Cohen - Los Angeles CA, US
Dennis R. Smalley - Newhall CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Qui T. Le - Anaheim CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

H01L 21/311

US Classification:

438697, 438692

Abstract:

A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e. g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.

US Patent:

7160429, Jan 9, 2007

Filed:

May 7, 2003

Appl. No.:

10/434103

Inventors:

Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US
Vacit Arat - La Canada Flintridge CA, US
Christopher J. Lee - Tarzana CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

C25D 5/48
C25D 5/02
C25D 5/10

US Classification:

205220, 205118, 205170, 205223

Abstract:

In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e. g. nickel), at least one sacrificial material (e. g. copper), and at least one sealing material (e. g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

US Patent:

7163614, Jan 16, 2007

Filed:

Oct 15, 2002

Appl. No.:

10/272255

Inventors:

Adam L. Cohen - Los Angeles CA, US

Assignee:

University of Southern California - Van Nuys CA

International Classification:

C25D 5/02
C25D 5/00

US Classification:

205118, 205135, 205137

Abstract:

Various embodiments of the invention provide techniques for forming structures (e. g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.