Amit Abraham

age ~40

from Beaverton, OR

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Amit Abraham Phones & Addresses

6213 SW 183Rd Ter, Beaverton, OR 97007
Hillsboro, OR
Tempe, AZ
1009 E University Dr APT 102, Tempe, AZ 85281

Wikipedia References

Amit Abraham

About:

Known for:

Counselor, Writer

Work:

Business category:

Signs

Education:

Area of science:

Human sexuality

Academic degree:

Professions and applied sciences:

Mental health

Skills & Activities:

Activity:

Indian writer

Preference:

Lesbian • Pink • Pornography

Amit Abraham

Resumes

Packaging Engineer

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Position:

Packaging Engineer at Intel Corporation

Location:

Hillsboro, Oregon

Industry:

Mechanical or Industrial Engineering

Work:

Intel Corporation since Oct 2011
Packaging Engineer
Arizona State University Aug 2008 - Apr 2011
Research Assistant
JSW Steel Ltd Aug 2006 - Dec 2007
Junior Manager

Education:

Arizona State University 2008 - 2009
MS, Mechanical Engineering R. V. College of Engineering, Bangalore 2002 - 2006
B.E., Mechanical Engineering St. Josephs PU 2001 - 2002
Pre University Certificate, Electronics Engineering

Skills:

Finite Element Analysis
Solid Mechanics
Material Characterisation
Computational Materials Science
Surface Metrology
Experimental Mechanics
Statistical Data Analysis
Design of Experiments

Languages:

Hindi

Us Patents

Solder Contacts For Socket Assemblies
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US Patent:

20160338199, Nov 17, 2016
Filed:

Dec 20, 2014
Appl. No.:

14/780501
Inventors:

- Santa Clara CA, US
Hong XIE - Phoenix AZ, US
Gregorio R. MURTAGIAN - Phoenix AZ, US
Amit ABRAHAM - Hillsboro OR, US
Alan C. MCALLISTER - Portland OR, US
Ting ZHONG - Tigard OR, US
International Classification:

H05K 1/18
H05K 3/34
H01L 23/498
H05K 3/40
H01R 12/52
H01R 33/76
Abstract:

Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.