Intel Corporation since Oct 2011
Packaging Engineer
Arizona State University Aug 2008 - Apr 2011
Research Assistant
JSW Steel Ltd Aug 2006 - Dec 2007
Junior Manager
Education:
Arizona State University 2008 - 2009
MS, Mechanical Engineering
R. V. College of Engineering, Bangalore 2002 - 2006
B.E., Mechanical Engineering
St. Josephs PU 2001 - 2002
Pre University Certificate, Electronics Engineering
Skills:
Finite Element Analysis Solid Mechanics Material Characterisation Computational Materials Science Surface Metrology Experimental Mechanics Statistical Data Analysis Design of Experiments
- Santa Clara CA, US Hong XIE - Phoenix AZ, US Gregorio R. MURTAGIAN - Phoenix AZ, US Amit ABRAHAM - Hillsboro OR, US Alan C. MCALLISTER - Portland OR, US Ting ZHONG - Tigard OR, US
Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.