Bing Dr Wu

US Patent:

7326754, Feb 5, 2008

Filed:

Oct 12, 2005

Appl. No.:

11/248490

Inventors:

Nikola A. Nikolic - Princeton NJ, US
Ruzhi Zhang - Somerset NJ, US
Osama M. Musa - Hillsborough NJ, US
Hwail Jin - La Palma CA, US
Bing Wu - Marina Del Rey CA, US
David Shenfield - Fountain Valley CA, US

International Classification:

C08F 136/56
C08F 136/02
C08F 236/56
C08F 236/10

US Classification:

5253309, 5253261, 5253319, 525282

Abstract:

This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

US Patent:

20030232926, Dec 18, 2003

Filed:

May 14, 2002

Appl. No.:

10/146387

Inventors:

Nikola Nikolic - Princeton NJ, US
Ruzhi Zhang - Somerset NJ, US
Osama Musa - Hillsborough NJ, US
Hwail Jin - La Palma CA, US
Bing Wu - Marina Del Rey CA, US
David Shenfield - Fountain Valley CA, US

International Classification:

C08L001/00
C08F267/04

US Classification:

525/242000, 525/285000

Abstract:

This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

US Patent:

20050137340, Jun 23, 2005

Filed:

Jan 27, 2005

Appl. No.:

11/044374

Inventors:

Nikola Nikolic - Princeton NJ, US
Ruzhi Zhang - Somerset NJ, US
Osama Musa - Hillsborough NJ, US
Hwail Jin - La Palma CA, US
Bing Wu - Marina Del Rey CA, US
David Shenfield - Fountain Valley CA, US

International Classification:

C08L001/00

US Classification:

525200000

Abstract:

This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

US Patent:

58079599, Sep 15, 1998

Filed:

Feb 25, 1997

Appl. No.:

8/805706

Inventors:

Bing Wu - Marina Del Rey CA
Quinn K. Tong - Belle Mead NJ
Robert W. R. Humphreys - Annandale NJ

Assignee:

National Starch and Chemical Investment Holding Corporation - Wilmington DE

International Classification:

B32B 3300
C08G 5900
C08G 6514

US Classification:

528101

Abstract:

For use in microelectronics applications, an improvement to an epoxy resin composition to reduce bleeding of the composition when it is applied to a silicon or metal substrate consists in the addition to the composition of a polyhydroxyl compound having two or three hydroxyl groups, or of a monohydroxyl compound that also contains one or more phenyl groups. The hydroxyl compound is present in the composition in a ratio by weight to the flexibilizing compound of from 1:3 to 1:10.

US Patent:

D407018, Nov 10, 1998

Filed:

Apr 25, 1997

Appl. No.:

D/070040

Inventors:

Bing T. Wu - Cerritos CA

International Classification:

0303

US Classification:

D 3 5

US Patent:

D3249433, Mar 31, 1992

Filed:

Jun 16, 1989

Appl. No.:

7/367222

Inventors:

Bing T. Wu - Cerritos CA

US Classification:

D 3 6

US Patent:

60226161, Feb 8, 2000

Filed:

Jan 23, 1998

Appl. No.:

9/012354

Inventors:

Bing Wu - Marina del Rey CA
Timothy G. Costello - Irvine CA
Kathy M. Jun - Cerritos CA

Assignee:

National Starch and Chemical Investment Holding Corporation - Wilmington DE

International Classification:

B32B 326

US Classification:

4283202

Abstract:

This invention is an improved adhesive composition prepared from at least one organic polymer resin, an inorganic filler, and a fugitive liquid, in which the liquid and organic polymer resin are each substantially insoluble in the other; and in which the improvement comprises that the at least one organic polymer resin be present in particulate form of particle size that is 25. mu. or smaller. Adhesive compositions so prepared can be used on dies-400 mil. times. 400 mil or greater on metal substrates without significant delamination.

US Patent:

57707065, Jun 23, 1998

Filed:

May 31, 1996

Appl. No.:

8/656621

Inventors:

Bing Wu - Marina Del Rey CA
Quinn K. Tong - Belle Mead NJ
Rose Ann Schultz - Princeton NJ

Assignee:

National Starch and Chemical Investment Holding Corporation - Wilmington DE

International Classification:

C08L 6300
C08K 310

US Classification:

523429

Abstract:

This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.