Chih Hao Chou

US Patent:

20190283204, Sep 19, 2019

Filed:

Mar 13, 2019

Appl. No.:

16/351954

Inventors:

- Santa Clara CA, US
Dominic J. Benvegnu - La Honda CA, US
Chih Chung Chou - San Jose CA, US
Nicholas Wiswell - Sunnyvale CA, US
Thomas H. Osterheld - Mountain View CA, US
Jeonghoon Oh - Saratoga CA, US

International Classification:

B24B 37/013
B24B 49/12
B24B 37/04
H01L 21/66

Abstract:

A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.

US Patent:

20170274495, Sep 28, 2017

Filed:

Mar 10, 2017

Appl. No.:

15/456413

Inventors:

- Santa Clara CA, US
Hui CHEN - Burlingame CA, US
King Yi HEUNG - Union City CA, US
Chih Chung CHOU - San Jose CA, US
Edwin C. SUAREZ - Fremont CA, US
Garrett Ho Yee SIN - San Jose CA, US
Charles C. GARRETSON - Sunnyvale CA, US
Jeonghoon OH - Saratoga CA, US

International Classification:

B24B 37/10
H01L 21/687
H01L 21/67
B24B 37/20
B24B 57/02

Abstract:

A polishing module includes a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.

US Patent:

20170274497, Sep 28, 2017

Filed:

Mar 10, 2017

Appl. No.:

15/456320

Inventors:

- Santa Clara CA, US
Hui CHEN - Burlingame CA, US
King Yi HEUNG - Union City CA, US
Wei-Cheng LEE - Los Altos Hills CA, US
Chih Chung CHOU - San Jose CA, US
Edwin C. SUAREZ - Fremont CA, US
Garrett Ho Yee SIN - San Jose CA, US
Charles C. GARRETSON - Sunnyvale CA, US
Jeonghoon OH - Saratoga CA, US

International Classification:

B24B 37/26
B24B 37/30

Abstract:

A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.