David K Hong

US Patent:

6477450, Nov 5, 2002

Filed:

Feb 13, 2001

Appl. No.:

09/782644

Inventors:

John J. Rodden - Los Altos CA
Homer D. Stevens - Redwood City CA
David P. Hong - Redwood City CA
Philip C. Hirschberg - Fremont CA

Assignee:

Space Systems/Loral, Inc. - Palo Alto CA

International Classification:

G06F 700

US Classification:

701 13, 701 4, 244164

Abstract:

An attitude control system comprising a controller and a noise screen device coupled to the controller. The controller is adapted to control an attitude of a vehicle carrying an actuator system that is adapted to pulse in metered bursts in order to generate a control torque to control the attitude of the vehicle in response to a control pulse. The noise screen device is adapted to generate a noise screen signal in response to the control pulse that is generated when an input attitude error signal exceeds a predetermined deadband attitude level. The noise screen signal comprises a decaying offset signal that when combined with the attitude error input signal results in a net attitude error input signal away from the predetermined deadband level to reduce further control pulse generation.

US Patent:

6456753, Sep 24, 2002

Filed:

Jul 7, 2000

Appl. No.:

09/611425

Inventors:

Dale A. Gee - Los Gatos CA
Madhav Y. Reddy - Cupertino CA
Sascha Hallstein - San Jose CA
Dilip K. Paul - Bethesda MD
Vipul D. Badoni - San Jose CA
David M. Hong - San Jose CA

Assignee:

Nayna Networks - Milpitas CA

International Classification:

G02B 626

US Classification:

385 18, 385 17

Abstract:

An apparatus for switching one of a plurality of optical signals from a plurality of optical fibers. The apparatus has an input fiber bundle housing comprising an outer side and an inner side. The input fiber bundle housing has a plurality of sites oriented in a spatial manner on the outer side for coupling to a plurality of input optical fibers. Each of the input optical fibers is capable of transmitting an optical signal. The apparatus also has a first mirror array disposed facing the inner side of the input fiber bundle housing. The first mirror array includes a plurality of mirrors. Each of the mirrors corresponds to one of the sites on the outer side of the input fiber bundle housing. A second mirror array is disposed facing the first mirror array. The second mirror array is also disposed around a periphery of the input fiber bundle. The second mirror array also has a plurality of mirrors, where each of the mirrors is capable of directing at least one signal from one of the mirrors on the first mirror array.

US Patent:

20220315412, Oct 6, 2022

Filed:

Jun 17, 2022

Appl. No.:

17/842810

Inventors:

- Santa Clara CA, US
Chiung C. Lo - San Jose CA, US
Martin George Lim - Hillsborough CA, US
Wen-Chien Chen - New Taipei City, TW
Michael David Housholder - San Jose CA, US
David Hong - Los Altos CA, US

Assignee:

xMEMS Labs, Inc. - Santa Clara CA

International Classification:

B81B 3/00

Abstract:

A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.

US Patent:

20230023306, Jan 26, 2023

Filed:

Sep 29, 2022

Appl. No.:

17/955562

Inventors:

- Santa Clara CA, US
Chiung C. Lo - San Jose CA, US
Martin George Lim - Hillsborough CA, US
Wen-Chien Chen - New Taipei City, TW
Michael David Housholder - San Jose CA, US
David Hong - Los Altos CA, US

Assignee:

xMEMS Labs, Inc. - Santa Clara CA

International Classification:

B81B 3/00

Abstract:

A manufacturing method for a device includes: providing a wafer including a first layer and a second layer; forming and patterning an actuating material formed on the wafer; patterning the first layer of the wafer to form a trench line; and removing a first part of the second layer. The first layer forms a film structure including a membrane. A slit is formed within and penetrates through the membrane because of the trench line. The film structure is actuated to form a vent temporarily because of the slit. An ear canal and an ambient of a wearable sound device are to be connected via the vent temporarily opened. The slit divides the membrane into a first membrane portion and a second membrane portion. A difference between the displacements of these two membrane portions is larger than a thickness of the membrane when the vent is formed.

US Patent:

20210403986, Dec 30, 2021

Filed:

May 18, 2021

Appl. No.:

17/323834

Inventors:

- Redwood City CA, US
Lily BLAIR - Redwood City CA, US
Timothy A. BLAUWKAMP - Redwood City CA, US
Peter J. EUGSTER - Redwood City CA, US
Desiree HOLLEMON - Redwood City CA, US
David K. HONG - Redwood City CA, US
Trupti KAWLI - Redwood City CA, US
Mark Alec KOWARSKY - Redwood City CA, US
Martin M.S. LINDNER - Redwood City CA, US
Michael J. ROSEN - Redwood City CA, US
Damek SPACEK - Redwood City CA, US
Igor D. VILFAN - Redwood City CA, US

Assignee:

KARIUS, INC. - Redwood City CA

International Classification:

C12Q 1/689
C12Q 1/70
C12Q 1/6806
C12Q 1/6883

Abstract:

Provided herein are fragment length profiles of nucleic acid libraries, methods of generating fragment length profiles of nucleic acid libraries and methods of using fragment length profiles for diagnostics and/or prognostics. The application further provides methods, compositions and kits for determining the infection stage or the site of localization in a subject.

US Patent:

20210377679, Dec 2, 2021

Filed:

Sep 2, 2020

Appl. No.:

17/009789

Inventors:

- Santa Clara CA, US
Yuan-Shuang Liu - Hsinchu County, TW
David Hong - Los Altos CA, US

International Classification:

H04R 29/00
H04R 1/28

Abstract:

An acoustic testing method includes providing an electrical signal to a wafer, receiving a sound wave generated by the acoustic transducer according to the electrical signal, and generating a sensing result for determining an acoustic functionality of the acoustic transducer. The wafer includes a plurality of acoustic transducers, and the electrical signal is provided to an acoustic transducer within the wafer.

US Patent:

20210297787, Sep 23, 2021

Filed:

May 31, 2021

Appl. No.:

17/334831

Inventors:

- Santa Clara CA, US
David Hong - Los Altos CA, US
Jemm Yue Liang - Sunnyvale CA, US
Lei Chen - Hayward CA, US
Hai-Hung Wen - Hsinchu County, TW
Martin George Lim - Hillsborough CA, US
Wen-Chien Chen - New Taipei City, TW
Hsien-Ken Liao - Taichung City, TW
Chun-I Chang - Hsinchu County, TW

International Classification:

H04R 17/00
H04R 3/00
H04R 1/02
H04R 31/00
H04R 7/04
H04R 7/18

Abstract:

A package structure includes a housing and a sound producing chip. The sound producing chip is disposed within the housing. The sound producing chip includes a membrane and an actuator. The membrane includes a coupling plate and a spring structure connected to the coupling plate. The actuator is configured to receive a driving signal to actuate the membrane. The spring structure is situated between the coupling plate and the actuator. The coupling plate is actuated to move by the actuator via the spring structure.

US Patent:

20210092500, Mar 25, 2021

Filed:

Nov 28, 2019

Appl. No.:

16/699078

Inventors:

- Los Altos CA, US
David Hong - Los Altos CA, US
Lei Chen - Hayward CA, US
Jemm Yue Liang - Sunnyvale CA, US

International Classification:

H04R 1/02
H04R 31/00

Abstract:

A package structure of a sound producing device includes a base, a cap, a chip and a chamber. The cap is disposed on the base. The chip is disposed on the base, the chip includes a thin film structure and an actuator configured to actuate the thin film structure to generate a plurality of air pulses, and the cap and the chip are on a same side of the base. The chamber is formed by the base and the cap or formed by the base, the cap and the chip; the thin film structure is disposed in the chamber. One of the base or the cap has a sound outlet opening connected to the chamber, and the air pulses propagate outwards through the sound outlet opening.