Eric T Browne

US Patent:

20150216080, Jul 30, 2015

Filed:

Jan 30, 2014

Appl. No.:

14/168206

Inventors:

- Schenectady NY, US
Stefan Schroeder - Munich, DE
Piniwan Thiwanka Bandara Wijekoon - Munich, DE
Eric Ayres Browne - Latham NY, US

Assignee:

General Electric Company - Schenectady NY

International Classification:

H05K 7/20
F28D 15/02

Abstract:

A subsea power module includes an outer pressure compensated vessel defining an interior chamber and one or more heat generating electrical components disposed within the interior chamber. The outer pressure compensated vessel is configured to maintain a pressure within the interior chamber substantially the same as an ambient pressure outside the outer pressure compensated vessel. Each of the electrical components may be disposed within an inner chamber of a pressure vessel disposed within the interior chamber of the outer pressure compensated vessel. Each of the one or more heat generating electrical components is configured to transfer heat generated within the interior chamber of the outer pressure compensated vessel through the wall defining the interior chamber to a fluid, such as seawater, surrounding the outer pressure compensated vessel.

US Patent:

20140160677, Jun 12, 2014

Filed:

Dec 10, 2012

Appl. No.:

13/709469

Inventors:

- Schenectady NY, US
Raj Bahadur - Schenectady NY, US
Eric Ayres Browne - Watervliet NY, US
Gary Dwayne Mandrusiak - Latham NY, US

Assignee:

GENERAL ELECTRIC COMPANY - Schenectady NY

International Classification:

F28F 13/18
H01L 23/46
H05K 7/20
H01L 21/50

US Classification:

361689, 438122, 165133, 16510421, 16510433

Abstract:

An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.