Eun Jung Kim

Address:

590 S Ogden Dr, Los Angeles, CA 90036

VIN:

1HGCP3F87AA013249

Make:

HONDA

Model:

ACCORD

Year:

2010

Address:

4460 Wilshire Blvd APT 408, Los Angeles, CA 90010

VIN:

19UUA66208A026907

Make:

ACURA

Model:

TL

Year:

2008

US Patent:

6857501, Feb 22, 2005

Filed:

Sep 21, 2000

Appl. No.:

10/089008

Inventors:

Eun Sok Kim - Torrance CA, US

Assignee:

The United States of America as represented by the Secretary of the Navy - Washington DC

International Classification:

H04R007/00
H04R031/00

US Classification:

181158, 181164, 181167, 381173, 381190, 381191, 381423, 381426, 29594, 216 2, 216 99

Abstract:

A micromachined acoustic transducer comprising a parylene diaphragm piezoelectric transducer. The parylene diaphragm has far lower stiffness than the silicon nitride. The method for fabricating the parylene diaphragm acoustic transducer utilizes a prestructured disphragm layer utilizing silicon nitride which is compatible with high temperature semiconductor process. A silicon nitride layer is patterned and partially removed after forming the parylene diaphragm layer in order to enhance the structural qualities of the parylene diaphragm. The diaphragm may be flat or dome-shaped.

US Patent:

D513093, Dec 20, 2005

Filed:

Sep 15, 2004

Appl. No.:

29/213296

Inventors:

Eun Suk Kim - Garden Grove CA, US

International Classification:

2803

US Classification:

D28 59

US Patent:

7332127, Feb 19, 2008

Filed:

Jul 11, 2002

Appl. No.:

10/194996

Inventors:

Eun Sok Kim - Torrance CA, US
Jae Wan Kwon - Los Angeles CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

B01L 3/02

US Classification:

422100, 422 63, 422 65

Abstract:

A DNA probe synthesis system may include a target holder for holding a target chip, an ejector array chip, a wash and dry station, and conveyance means for moving the target holder and the chip between the ejector array chip and the wash and dry station. The ejector array chip may include ejectors, reservoirs for containing DNA bases, and microchannels all on the same substrate. The ejectors may be Self Focusing Acoustic Transducers (SFATs).

US Patent:

7481112, Jan 27, 2009

Filed:

Sep 30, 2005

Appl. No.:

11/240804

Inventors:

Eun Sok Kim - Rancho Palos Verdes CA, US
Qiang Zou - Alhambra CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

G01P 15/12
G01P 9/04

US Classification:

7351433, 7350412

Abstract:

A MEMS silicon inertial sensor formed of a mass that is supported and constrained to vibrate in only specified ways. The sensors can be separately optimized from the support, to adjust the sensitivity separate from the bandwidth. The sensor can sense three dimensionally, or can only sense in a single plane.

US Patent:

7719170, May 18, 2010

Filed:

Jan 11, 2008

Appl. No.:

12/013413

Inventors:

Eun Sok Kim - Rancho Palos Verdes CA, US
Hongyu Yu - Los Angeles CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

H01L 41/08

US Classification:

310335

Abstract:

Techniques, apparatus and systems that use an acoustic transducer with a Fresnel lens to focus an acoustic wave for various applications, including acoustic droplet ejectors.

US Patent:

7824630, Nov 2, 2010

Filed:

Feb 19, 2008

Appl. No.:

12/033845

Inventors:

Eun Sok Kim - Torrance CA, US
Jae Wan Kwon - Los Angeles CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

G01N 1/10
B01L 3/02

US Classification:

422180, 422100, 422 63, 422 65

Abstract:

A DNA probe synthesis system may include a target holder for holding a target chip, an ejector array chip, a wash and dry station, and conveyance means for moving the target holder and the chip between the ejector array chip and the wash and dry station. The ejector array chip may include ejectors, reservoirs for containing DNA bases, and microchannels all on the same substrate. The ejectors may be Self Focusing Acoustic Transducers (SFATs).

US Patent:

8216434, Jul 10, 2012

Filed:

Mar 3, 2008

Appl. No.:

12/041577

Inventors:

Tzung K. Hsiai - Santa Monica CA, US
Gopikrishnan Soundararajan - Alisa Viejo CA, US
Eun Sok Kim - Rancho Palos Verdes CA, US
Hongyu Yu - Mesa AZ, US
Mahsa Rouhanizadeh - Newport Beach CA, US
Christina Tiantian Lin - Santa Rosa CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

C23C 14/34

US Classification:

20419215, 20419217, 438 50, 438 54, 438694, 438706, 438712, 438724, 438753, 438757, 216 2, 216 58, 216 66, 216 99

Abstract:

A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.

US Patent:

7360422, Apr 22, 2008

Filed:

Sep 30, 2005

Appl. No.:

11/241869

Inventors:

Asad Madni - Los Angeles CA, US
Qiang Zou - Los Angeles CA, US
Eun Sok Kim - Rancho Palos Verdes CA, US
Lynn Costlow - Clayton CA, US
Jim Vuong - Northridge CA, US
Roger Wells - Yorba Linda CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

G01P 9/04
G01P 15/12

US Classification:

7350412, 7350416, 7351433

Abstract:

A MEMS silicon inertial sensor formed of a mass that is supported and constrained to vibrate in only specified ways. The sensors can be separately optimized from the support, to adjust the sensitivity separate from the bandwidth. The sensor can sense three dimensionally, or can only sense in a single plane. Vibration cancellation may be provided.