George Y Chen

US Patent:

6834119, Dec 21, 2004

Filed:

Apr 3, 2001

Appl. No.:

09/825266

Inventors:

George Q. Chen - San Jose CA

Assignee:

STMicroelectronics, Inc. - Carrollton TX

International Classification:

G06K 900

US Classification:

382154, 382201, 382218, 356419

Abstract:

An image processing system detects a plurality of image features in a first image corresponding to a first view of a scene, and a plurality of image features in a second image corresponding to a second view of the scene. The second image deviates from the first image as a result of camera relative motion. The system determines a two-view correspondence resulting in a potential match set having a maximum average strength of correspondence based at least in part on the total number of matching neighbor candidate image features. Additionally, a multiple-view correspondence between images results in a potential match set based at least in part on a computation of reprojection error for matched points that resulted from a projective reconstruction of the potential match set.

US Patent:

7046352, May 16, 2006

Filed:

Dec 19, 2002

Appl. No.:

10/325023

Inventors:

Aditya Dayal - Sunnyvale CA, US
David S. Alles - Los Altos CA, US
George Q. Chen - Fremont CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G01N 21/00

US Classification:

3562371, 3562372, 3562374, 3562375

Abstract:

The present invention discloses methods of conducting surface inspections using summed light. One method includes the steps of measuring summed light intensity values for the substrate, generating comparison values for the substrate, and then comparing the measured summed light intensity values with the comparison values to determine whether there are defects in the substrate. In another embodiment, a method includes the steps of generating a reference cluster using measured summed light intensity values for selected portions of the inspection surface. Other summed light intensity values are measured and then compared with the reference cluster. Using this comparison, a determination is made as to whether a defect is present. Another embodiment uses a constant baseline signal which is compared to actual light intensity values to determine whether a substrate defect is present. In yet another embodiment a substrate is inspected for the presence of defects by conducting a pixel-by-pixel summed light inspection of the substrate.

US Patent:

7051305, May 23, 2006

Filed:

Apr 27, 2004

Appl. No.:

10/832760

Inventors:

Hien T. Ha - Sunnyvale CA, US
George J. Chen - Union City CA, US
Robert E. Mains - Morgan Hill CA, US

Assignee:

Sun Microsystems, Inc. - Santa Clara CA

International Classification:

G06F 17/50
G01R 27/26
G01R 27/28

US Classification:

716 6, 716 4, 716 5, 324628, 324677

Abstract:

A method of estimating delay which includes configuring a first signal path and second signal path such that the first signal path is a victim signal path and the second signal path is an aggressor signal path, calculating Miller factors between the victim signal path and the aggressor signal path for a plurality of edge combinations between a victim signal edge and an aggressor signal edge, and using the Miller factors to perform a timing analysis.

US Patent:

7126681, Oct 24, 2006

Filed:

Apr 23, 2003

Appl. No.:

10/421626

Inventors:

George Q. Chen - Fremont CA, US
Yu Cao - Cupertino CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G01N 21/00

US Classification:

3562374, 3562375

Abstract:

A method and apparatus for inspecting specimens or patterned transmissive substrates, such as photomasks, for unwanted particles and features, particularly those associated with contacts, including irregularly shaped contacts. A specimen is illuminated by a laser through an optical system comprised of a laser scanning system, individual transmitted and/or reflected light collection optics and detectors collect and generate signals representative of the light transmitted by the substrate. The defect identification of the substrate is performed using those transmitted light signals. Defect identification is performed using an inspection algorithm by comparing image feature representations of a test specimen with a reference specimen, and using a boundary computer and flux comparison device to establish tight boundaries around contacts and compute flux differences between the test and reference specimen contacts. Defect sizes are reported as ratio of flux difference, and entire contacts are highlighted for review.

US Patent:

7167185, Jan 23, 2007

Filed:

Mar 24, 2003

Appl. No.:

10/396228

Inventors:

Yen-Wen Lu - Los Altos CA, US
George Q. Chen - Fremont CA, US

Assignee:

KLA- Tencor Technologies Corporation - San Jose CA

International Classification:

G09G 5/02

US Classification:

345596, 345590, 382149

Abstract:

Faster and more accurate techniques for displaying images are described. The techniques can be applied in various applications that include semiconductor fabrication processes. The invention uses preprocessed images to generate a user-selected image in order to increase the speed of image processing. The invention displays the pixels forming an image using grayscale shading in order to improve the accuracy of displaying the patterns used in photolithography processes. The techniques of the present invention can be used to display images that represent lithography patterns stored within memory devices or to display images captured by inspection or metrology devices.

US Patent:

7197722, Mar 27, 2007

Filed:

Sep 30, 2004

Appl. No.:

10/956608

Inventors:

Alan Wong - San Jose CA, US
Jeff Drautz - Rio Rancho NM, US
Joseph D. Shindler - Gaston OR, US
Max Lau - San Ramon CA, US
George Chen - Los Gatos CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 17/50

US Classification:

716 2, 716 19, 716 20, 716 21, 703 14

Abstract:

The present invention describes a method including: determining field-clustering scheme; selecting initial sample plan; establishing initial model of overlay, the initial model of overlay comprising components; and establishing efficient model of overlay from the initial model of overlay including: constructing matrices; identifying redundant components and eliminating the redundant components; and identifying highly-correlated components and determining whether to eliminate the highly-correlated components.

US Patent:

7285781, Oct 23, 2007

Filed:

Jul 7, 2004

Appl. No.:

10/886387

Inventors:

Gary X. Cao - Santa Clara CA, US
George Chen - Los Gatos CA, US
Brandon L. Ward - San Jose CA, US
Nancy J. Wheeler - Mountain View CA, US
Alan Wong - San Jose CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G01N 23/00
G03F 7/20
G03F 7/00
G03F 7/40

US Classification:

250311, 250306, 250307, 250310, 25049222, 2504923, 430310, 430313, 430314, 430317, 430323, 356634, 356635, 356636, 438 8, 438 16, 438584

Abstract:

A CD-SEM (critical dimension-scanning electron microscope) system may utilize a technique for characterizing and reducing shrinkage carryover due to CD-SEM measurements. The system may identify the affects of CD-SEM measurements on the resist and adjust the operating parameters for a particular resist to avoid or significantly reduce shrinkage carryover. In this manner, the system may obtain more reliable CD measurements and avoid damage to the measured feature.

US Patent:

7499156, Mar 3, 2009

Filed:

Oct 19, 2006

Appl. No.:

11/584714

Inventors:

George Q. Chen - Fremont CA, US
Yu Cao - Cupertino CA, US

Assignee:

KLA-Tencor Technologies Corporation - Milpitas CA

International Classification:

G01N 21/00

US Classification:

3562374, 3562375

Abstract:

A method and apparatus for inspecting specimens or patterned transmissive substrates, such as photomasks, for unwanted particles and features, particularly those associated with contacts, including irregularly shaped contacts. A specimen is illuminated by a laser through an optical system comprised of a laser scanning system, individual transmitted and/or reflected light collection optics and detectors collect and generate signals representative of the light transmitted by the substrate. The defect identification of the substrate is performed using those transmitted light signals. Defect identification is performed using an inspection algorithm by comparing image feature representations of a test specimen with a reference specimen, and using a boundary computer and flux comparison device to establish tight boundaries around contacts and compute flux differences between the test and reference specimen contacts. Defect sizes are reported as ratio of flux difference, and entire contacts are highlighted for review.