James A Foreman

US Patent:

20210210862, Jul 8, 2021

Filed:

Jan 6, 2020

Appl. No.:

16/735497

Inventors:

- Waltham MA, US
James E. Foreman - Frisco TX, US
David R. Gorman - Lucas TX, US
Darrell W. Miller - Allen TX, US

International Classification:

H01Q 17/00
H05K 9/00

Abstract:

An apparatus includes a first layer having an RF lossy material, a second layer having the RF lossy material, and a plurality of conductive or resistive pads arranged in a planar array between the first layer and the second layer. The apparatus may also include a plurality of thermal vias, where each thermal via may correspond to one of the pads, may extend through at least the first layer, and may be formed of a thermally-conductive material. Dimensions of each pad may be selected based on a desired resonant frequency band, and the desired resonant frequency band may be associated with RF energy transmitted by at least one RF source in proximity to the apparatus.