James Kevin Rutledge

US Patent:

8336722, Dec 25, 2012

Filed:

Feb 9, 2010

Appl. No.:

12/702571

Inventors:

Steven A. Cardwell - Sunnyvale TX, US
James C. Rutledge - Flower Mound TX, US

International Classification:

A47B 47/00

US Classification:

211191, 211 594, 211183, 137312, 108 5, 108 20

Abstract:

A pallet rack and method for use of same are disclosed. Three panel frames interconnected by two parallel cross members define two lower pallet receiving areas and two upper pallet receiving areas. A catch tray is disposed beneath the two upper pallet receiving areas to catch and redirect fluid and debris to prevent cross-contamination between pallets. The catch tray includes a primary tray and a slidable dependent tray extendably coupled to the primary tray. The slidable dependent tray extends from a retracted position within the primary tray to an extended position having a general decline from the first panel frame to the second panel frame to furnish a slanted surface therebetween. Retraction of the dependent tray provides clearance for fork lift tines to access the rear upper pallet receiving area.

US Patent:

58605851, Jan 19, 1999

Filed:

May 31, 1996

Appl. No.:

8/658907

Inventors:

James L. Rutledge - Austin TX
Kenneth Kaskoun - Berlin, DE
James Jen-Ho Wang - Berlin, DE

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2160

US Classification:

228254

Abstract:

A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

US Patent:

61665568, Dec 26, 2000

Filed:

May 28, 1998

Appl. No.:

9/086072

Inventors:

James Wang - Berlin, DE
James L. Rutledge - Austin TX
Kenneth Kaskoun - Berlin, DE

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01R 3126
G01R 3102

US Classification:

324765

Abstract:

A test substrate (30) including a plurality of solder bumps (38) is used to test a die (10) which can be used as either a wire-bonded device or a flip-chip device. Die (10) includes test pads (14) which are redundant electrical connections to bond pads (12). The solder bumps make contact with the test pads of the device during testing. On separating the test substrate and die, the bumps remain on the test substrate if the die is to be wire bonded, or are transferred to the die if the die is to be flip-chip mounted to a next-level package substrate. Whether the bumps are transferred or not is determined by the relative areas of the solder receiving pads/studs (26 and 36) on the test substrate die. Common process flows and even die layouts can be used for the two different device types, thereby saving manufacturing and design costs.

US Patent:

40184501, Apr 19, 1977

Filed:

Jun 30, 1975

Appl. No.:

5/591652

Inventors:

James T. Rutledge - Dallas TX

International Classification:

A63H 500

US Classification:

280289R

Abstract:

A bicycle noise making attachment consisting of an elongated member shaped to loosely receive a bicycle fender brace and having a slotted end lug adapted to be clampingly held by the same clamping nut employed to secure the wheel fender brace to the associated wheel axle bolt. The member itself is somewhat vibratory and has a vibratory integral noise-generating flap which extends between the wheel spokes and is vibrated by the spokes as the wheel rotates.

US Patent:

60014938, Dec 14, 1999

Filed:

Jun 1, 1998

Appl. No.:

9/088026

Inventors:

James L. Rutledge - Austin TX
Kenneth Kaskoun - Berlin, DE
James Jen-Ho Wang - Berlin, DE

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2912

US Classification:

428620

Abstract:

A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

US Patent:

D2467771, Dec 27, 1977

Filed:

Jan 9, 1976

Appl. No.:

5/647878

Inventors:

James T. Rutledge - Dallas TX

International Classification:

D1211

US Classification:

D12114