Jason A Woods

US Patent:

8161451, Apr 17, 2012

Filed:

Nov 12, 2009

Appl. No.:

12/617667

Inventors:

Jason Woods - Parker CO, US

Assignee:

EchoStar Technologies L.L.C. - Englewood CO

International Classification:

G06F 17/50

US Classification:

716137, 716100

Abstract:

Disclosed is a layout tool that verifies the operability of a printed circuit board design. Electrical parameters may be calculated for wire traces that are laid out for a given design. Based on the voltage drop calculations and the voltage and current requirement of the various system components, the layout tool may determine if a given system component will remain within its required operating range. The layout tool may additionally be operable to verify proper spacing between traces that make up a differential signal and to verify that certain pins of integrated circuit are properly connected.

US Patent:

8589857, Nov 19, 2013

Filed:

Mar 16, 2012

Appl. No.:

13/422890

Inventors:

Jason Woods - Parker CO, US

Assignee:

EchoStar Technologies L.L.C. - Englewood CO

International Classification:

G06F 17/50

US Classification:

716137, 716100

Abstract:

Disclosed is a layout tool that verifies the operability of a printed circuit board design. Electrical parameters may be calculated for wire traces that are laid out for a given design. Based on the voltage drop calculations and the voltage and current requirement of the various system components, the layout tool may determine if a given system component will remain within its required operating range. The layout tool may additionally be operable to verify proper spacing between traces that make up a differential signal and to verify that certain pins of integrated circuit are properly connected.

US Patent:

20130340449, Dec 26, 2013

Filed:

May 2, 2013

Appl. No.:

13/886131

Inventors:

Alliance For Sustainable Energy, LLC - , US
Jason D. WOODS - Boulder CO, US

Assignee:

ALLIANCE FOR SUSTAINABLE ENERGY, LLC - Golden CO

International Classification:

F25B 15/00

US Classification:

62 92, 62271, 62 94

Abstract:

An apparatus for conditioning an inlet air stream. A first stage is provided with a dehumidifier cooling an air stream input by absorption of water vapor from the input air stream. A second stage is provided with an indirect evaporative cooler to receive a cooled portion of the input air stream and sensibly cool the received portion of the input air stream to a temperature range near the dew point temperature. A first portion of the sensibly cooled air stream is exhausted to a cooled space while a second portion is directed to a wet side of the indirect evaporative cooler and receives heat to sensibly cool the input air stream. A flow channel for the second portion of the sensibly cooled air stream in the indirect evaporative cooler is defined by a surface of a separation wall covered with wicking material acting to wick a stream of liquid coolant.

US Patent:

20200232662, Jul 23, 2020

Filed:

Apr 7, 2020

Appl. No.:

16/842076

Inventors:

- Golden CO, US
Jason David WOODS - Boulder CO, US
Eric Jason BONNEMA - Littleton CO, US
Ramin Teimouri FARAMARZI - Pacific Palisades CA, US

International Classification:

F24F 5/00

Abstract:

A system comprising a first plurality of microchannels, a second plurality of microchannels in thermal communication with the first plurality of microchannels such that the first plurality of microchannels and second plurality of microchannels form a heat exchanger, and a phase change composite in thermal communication with the heat exchanger and methods of operating are disclosed herein.

US Patent:

20180340738, Nov 29, 2018

Filed:

May 29, 2018

Appl. No.:

15/991275

Inventors:

- Golden CO, US
Jason David WOODS - Boulder CO, US
Eric Jason BONNEMA - Littleton CO, US
Ramin Teimouri FARAMARZI - Pacific Palisades CA, US

International Classification:

F28D 7/00
F28D 15/02
F28D 20/02

Abstract:

A system comprising a first plurality of microchannels, a second plurality of microchannels in thermal communication with the first plurality of microchannels such that the first plurality of microchannels and second plurality of microchannels form a heat exchanger, and a phase change composite in thermal communication with the heat exchanger and methods of operating are disclosed herein.

US Patent:

20140260398, Sep 18, 2014

Filed:

Mar 13, 2013

Appl. No.:

13/801395

Inventors:

ALLIANCE FOR SUSTAINABLE ENERGY, LLC - , US
Jason WOODS - Boulder CO, US
Ron JUDKOFF - Golden CO, US

Assignee:

ALLIANCE FOR SUSTAINABLE ENERGY, LLC - Golden CO

International Classification:

F25B 15/00

US Classification:

62271, 165185

Abstract:

A separator plate assembly for use in an indirect evaporative cooler (IEC) with an air-to-air heat exchanger. The assembly includes a separator plate with a first surface defining a dry channel and a second surface defining a wet channel. The assembly includes heat transfer enhancements provided on the first surface for increasing heat transfer rates. The heat transfer enhancements may include slit fins with bodies extending outward from the first surface of separator plate or may take other forms including vortex generators, offset strip fins, and wavy fins. In slit fin implementations, the separator plate has holes proximate to each of the slit fins, and the separator plate assembly may include a sealing layer applied to the second surface of the separator plate to block air flow through the holes. The sealing layer can be a thickness of adhesive, and a layer of wicking material is applied to the adhesive.