Jason E Woods

US Patent:

6765779, Jul 20, 2004

Filed:

Feb 27, 2003

Appl. No.:

10/377086

Inventors:

Robert A. Stevenson - Canyon Country CA
Jason Woods - Carson City NV
Christine A. Frysz - Columbia MD
Richard L. Brendel - Carson City NV
Haitong Zeng - Columbia MD

Assignee:

Greatbatch-Sierra, Inc. - Carson City NV

International Classification:

H01G 435

US Classification:

361302, 3613061, 607 5

Abstract:

An EMI feedthrough filter terminal assembly includes a feedthrough filter capacitor having first and second sets of electrode plates, a passageway having a first termination surface conductively coupling the first set of electrode plates, and a second termination surface exteriorly coupling the second set of electrode plates. A conductive ferrule disposed adjacent to the capacitor includes a conductive pad of an oxide resistant biostable material on a surface thereof conductively coupled to the second termination surface. A conductive terminal pin extends through the passageway in conductive relation with the first set of electrode plates, and through the ferrule in non-conductive relation. An insulator is fixed to the ferrule for conductively isolating the terminal pin from the ferrule. A hermetic seal is disposed between the insulator and the ferrule.

US Patent:

59739061, Oct 26, 1999

Filed:

Mar 17, 1998

Appl. No.:

9/040222

Inventors:

Robert A. Stevenson - Canyon Country CA
Donald K. Haskell - Minden NV
Richard L. Brendel - Carson City NV
Jason Woods - Carson City NV
Mike Louder - Carson City NV

Assignee:

Maxwell Energy Products, Inc. - San Diego CA

International Classification:

H01G 435

US Classification:

361302

Abstract:

An electromagnetic interference (EMI) filter capacitor assembly is provided for shielding and decoupling a conductive terminal pin or lead of the type used, for example, in an implantable medical device against passage of external interference signals. The EMI filter is constructed of relatively inexpensive ceramic chip capacitors which replace relatively expensive feedthrough capacitors as found in the prior art. The chip capacitors are mounted directly onto a hermetic feedthrough terminal in groups of two or more which vary in physical size, dielectric material and capacitance value so that they self-resonate at different frequencies. This "staggering" of resonant frequencies and direct installation at the hermetic terminal provides the EMI filter with sufficient broadband frequency attenuation. In one preferred form, multiple chip capacitor groupings are mounted onto a common base structure, with each capacitor grouping associated with a respective terminal pin. In another preferred form, a non-conductive substrate is provided with metalized circuit traces to better accommodate the mounting of the chip capacitors.

US Patent:

59598298, Sep 28, 1999

Filed:

Feb 18, 1998

Appl. No.:

9/027115

Inventors:

Robert A. Stevenson - Canyon Country CA
Donald K. Haskell - Minden NV
Richard L. Brendel - Carson City NV
Jason Woods - Carson City NV
Mike Louder - Carson City NV

Assignee:

Maxwell Energy Products, Inc. - San Diego CA

International Classification:

H01G 435

US Classification:

361302

Abstract:

An electromagnetic interference (EMI) filter capacitor assembly is provided for shielding and decoupling a conductive terminal pin or lead of the type used, for example, in an implantable medical device against passage of external interference signals. The EMI filter is constructed of relatively inexpensive ceramic chip capacitors which replace relatively expensive feedthrough capacitors as found in the prior art. The chip capacitors are mounted directly onto a hermetic feedthrough terminal in groups of two or more which vary in physical size, dielectric material and capacitance value so that they self-resonate at different frequencies. This "staggering" of resonant frequencies and direct installation at the hermetic terminal provides the EMI filter with sufficient broadband frequency attenuation. In one preferred form, multiple chip capacitor groupings are mounted onto a common base structure, with each capacitor grouping associated with a respective terminal pin. In another preferred form, a non-conductive substrate is provided with metalized circuit traces to better accommodate the mounting of the chip capacitors.

US Patent:

20210162220, Jun 3, 2021

Filed:

Feb 9, 2021

Appl. No.:

17/171418

Inventors:

- Clarence NY, US
Robert A. Stevenson - Canyon Country CA, US
Jason Woods - Carson City NV, US

International Classification:

A61N 1/375
H01R 13/26
A61N 1/378
H01R 13/52
H01R 4/58

Abstract:

A feedthrough for an AIMD is described. The feedthrough includes an electrically conductive ferrule having a ferrule sidewall defining a ferrule opening. The ferrule sidewall has a height. At least one recessed pocket has a depth extending part-way through the height of the ferrule. An oxide-resistant pocket-pad is nested in the recessed pocket. An electrical connection material is supported on the pocket-pad for making an oxide-resistant electrical connection to the ferrule. An insulator is hermetically sealed to the ferrule in the ferrule opening. At least one active via hole extends through the insulator with an active conductive pathway residing in and hermetically sealed to the insulator in the active via hole.

US Patent:

20160367821, Dec 22, 2016

Filed:

Aug 29, 2016

Appl. No.:

15/250210

Inventors:

- Clarence NY, US
Robert A. Stevenson - Canyon Country CA, US
Jason Woods - Carson City NV, US

International Classification:

A61N 1/375
H01G 4/40
H03H 1/00
H01G 4/35
H01G 4/228
H01R 4/60
H02G 15/013
H01G 2/02

Abstract:

A hermetically sealed filtered feedthrough assembly for an active implantable medical device includes an electrically conductive ferrule hermetically sealed by a first braze to an insulator. A conductor is hermetically sealed to and disposed through the insulator. A filter capacitor has an active electrode plate and a ground electrode plate which are disposed within and supported by a capacitor dielectric in an interleaved, partially overlapping relationship. A first passageway is disposed through the capacitor dielectric having a capacitor internal metallization which is connected to the active electrode plate. A capacitor external metallization electrically connects to the ground electrode plate. An oxide-resistant metal addition includes a conductive core with a conductive cladding of a different material. A first electrical connection is between the oxide-resistant metal addition and the capacitor external metallization. A second electrical connection is between the oxide-resistant metal addition and the ferrule.

US Patent:

20140281729, Sep 18, 2014

Filed:

May 29, 2014

Appl. No.:

14/290030

Inventors:

- Armonk NY, US
Scott Schumacher - Porter Ranch CA, US
Jason Woods - Round Rock TX, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 11/07

US Classification:

714 37

Abstract:

Embodiments disclosed herein provide a system and method for analyzing an identity hub. Particularly, a user can connect to the identity hub, load an initial set of data records, create and/or edit an identity hub configuration locally, analyze and/or validate the configuration via a set of analysis tools, including an entity analysis tool, a data analysis tool, a bucket analysis tool, and a linkage analysis tool, and remotely deploy the validated configuration to an identity hub instance. In some embodiments, through a graphical user interface, these analysis tools enable the user to analyze and modify the configuration of the identity hub in real time while the identity hub is operating to ensure data quality and enhance system performance.

US Patent:

20140168917, Jun 19, 2014

Filed:

Feb 23, 2014

Appl. No.:

14/187295

Inventors:

- Clarence NY, US
Robert A. Stevenson - Canyon Country CA, US
Christine A. Frysz - Orchard Park NY, US
Jason Woods - Carson City NV, US
Richard L. Brendel - Carson City NV, US

Assignee:

GREATBATCH LTD. - Clarence NY

International Classification:

H01G 4/35
H03H 7/00

US Classification:

361752, 174650

Abstract:

A hermetically sealed filtered feedthrough includes a chip capacitor disposed on a circuit board on a device side. A first low impedance electrical connection is between a capacitor first end metallization and a conductor which is disposed through an insulator. A second low impedance electrical connection is between the capacitor second end metallization and a ferrule or housing. The second low impedance electrical connection may include an oxide-resistant electrical connection forming the hermetic seal between the insulator and the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant electrical connection. Alternatively, the second low impedance electrical connection may include an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection between and to the second end metallization and directly to the oxide-resistant metal addition.