Michael Mueller - Alameda CA, US Jim Cheng - Berkeley CA, US Albert Pisano - Danville CA, US
Assignee:
The Regents of the University of California - Oakland CA
International Classification:
G01J 5/00
US Classification:
2503381
Abstract:
An organic material can be used in a modified strain gauge for IR transduction, resulting in an organic IR sensor. Infrared radiation incident on the organic material modulates a displacement of the material in order to detect the presence and intensity of IR radiation. This innovative design doesn't require cooling, and is sensitive to 9 and 3 μm—wavelengths that are emitted by mammals and forest fires, respectively. In addition, a photomechanical polymer can be used in a transistor based on a thin-film transistor (TFT), also resulting in an IR sensor. Through careful synthesis of the polymers, the photomechanical response of the transistor can be tailored to certain IR bands for detection purposes.
Method And Apparatus For Handling Bus Master And Direct Memory Access (Dma) Requests At An I/O Controller
Neil W Songer - Santa Clara CA James P. Kardach - Saratoga CA Sung-Soo Cho - Sunnyvale CA Jim S. Cheng - Cupertino CA Debra T. Cohen - Sunnyvale CA John W. Horigan - Mountain View CA Nader Raygani - San Jose CA Seyed Yahay Sotoudeh - Santa Clara CA David I. Poisner - Folsom CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 1300
US Classification:
395728
Abstract:
A computer system that implements a direct memory access (DMA) request passing protocol. The computer system may comprise a Peripheral Component Interconnect (PCI) bus that includes an electrical interface as specified by a PCI Local Bus standard. The PCI bus is coupled to at least one DMA agent and a DMA controller. The DMA agent issues DMA requests to the DMA controller using the electrical interface of the PCI bus. According to one embodiment, a system I/O controller receives the DMA requests and passes them on to the DMA controller, which arbitrates the DMA requests and passes back a grant to the system I/O controller. The system I/O controller uses the electrical interface of the PCI bus to pass the grant to the DMA agent. The same DMA request passing protocol may be implemented in any bus having an electrical interface that specifies a unique request signal line for each bus agent of the bus.
Method And Apparatus For Handling Bus Master Channel And Direct Memory Access (Dma) Channel Access Requests At An I/O Controller
James P. Kardach - Saratoga CA Sung-Soo Cho - Sunnyvale CA Jim S. Cheng - Cupertino CA Debra T. Cohen - Sunnyvale CA John W. Horigan - Mountain View CA Nader Raygani - San Jose CA Seyed Yahay Sotoudeh - Santa Clara CA David I. Poisner - Folsom CA Neil W. Songer - Santa Clara CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 1300
US Classification:
395728
Abstract:
A computer system that implements a direct memory access (DMA) request passing protocol. The computer system may comprise a Peripheral Component Interconnect (PCI) bus that includes an electrical interface as specified by a PCI Local Bus standard. The PCI bus is coupled to at least one DMA agent and a DMA controller. The DMA agent issues DMA requests to the DMA controller using the electrical interface of the PCI bus. According to one embodiment, a system I/O controller receives the DMA requests and passes them on to the DMA controller, which arbitrates the DMA requests and passes back a grant to the system I/O controller. The system I/O controller uses the electrical interface of the PCI bus to pass the grant to the DMA agent. The same DMA request passing protocol may be implemented in any bus having an electrical interface that specifies a unique request signal line for each bus agent of the bus.
Chip-Scale Sensing Device For Low Density Material And Method Of Making Same
- Newark CA, US Jim Chih-Min Cheng - Fremont CA, US Richard Ian Olsen - Truckee CA, US
International Classification:
G01N 27/407 G01N 27/404 G01N 27/30 G01N 27/416
Abstract:
An electrochemical sensor device that is efficiently and economically produced at the chip level for a variety of applications is disclosed. In some aspects, the device is made on or using a wafer technology whereby a sensor chamber is created by said wafer and a gas port allows for a working electrode of the sensor to detect certain gases. Large scale production is possible using wafer technology where individual sensors are produced from one or more common wafers. Integrated circuits are made in or on the wafers in an integrated way so that the wafers provide the substrate for the integrated circuitry and interconnects as well as providing the definition of the chambers in which the gas sensors are disposed.
Chip-Scale Sensing Device For Low Density Material
- Newark CA, US Jim Chih-Min Cheng - Fremont CA, US Richard Ian Olsen - Truckee CA, US
International Classification:
G01N 27/407 G01N 27/30 G01N 27/416
Abstract:
An electrochemical sensor device that is efficiently and economically produced at the chip level for a variety of applications is disclosed. In some aspects, the device is made on or using a wafer technology whereby a sensor chamber is created by said wafer and a gas port allows for a working electrode of the sensor to detect certain gases. Large scale production is possible using wafer technology where individual sensors are produced from one or more common wafers. Integrated circuits are made in or on the wafers in an integrated way so that the wafers provide the substrate for the integrated circuitry and interconnects as well as providing the definition of the chambers in which the gas sensors are disposed.
- Newark CA, US Jim Chih-Min Cheng - Fremont CA, US Eric Paul Lee - Mountain View CA, US
International Classification:
G01N 27/407
Abstract:
An electrochemical gas sensor device with small physical footprint is disclosed. The electrodes within the element are arranged about the electrolyte such that the electrical impedance of the sensor is minimized. This results in a fast stabilization after detecting gasses and enables rapid changes in bias voltage to target different gasses. Gasketing elements, or alternative designs, are included to eliminate the diffusion of gasses between the electrodes within the cell.
- Berkeley CA, US Jim Chih-Min Cheng - Berkeley CA, US
International Classification:
F28D 15/04 H01L 23/427 H05K 7/20
Abstract:
Aspects of the invention include microcooling system that provides a simple, unitary, two dimensional construct with capacity to remove heat effectively from the internal structures of microelectronic devices.
Name / Title
Company / Classification
Phones & Addresses
Jim Cheng President
Cha Latte USA Inc
729 S Stoneman Ave, Alhambra, CA 91801
Jim Cheng Principal
Jc Trucking Local Trucking Operator
2321 Bartlett St, Oakland, CA 94601
Jim Cheng Chief Executive Officer
Chillflux, Inc Mfg Electrical Equipment/Supplies
1517 Francisco St, Berkeley, CA 94703
Jim Cheng Family And General Dentistry, Partner
Aborn Family Dental Hospital & Health Care · Dentist's Office · Cosmetic Dentist · Denture Labs · Dentures · Dentists · Periodontics · Oral Surgeons
1950 Aborn Rd, San Jose, CA 95121 (408)2706301
Jim Cheng Vice President-operations
A5Tek Corporation Internet Products & Services
1600 Wyatt Dr, Santa Clara, CA 95054 (408)9880899, (408)7520899
Jim Cheng Manager, Secretary, Branch Manager
C B Group Inc Whl Plumbing Electrical and Heating Supplies
435 Valencia St, San Francisco, CA 94103 (415)5513580
a5tek
vp of operations
a5tek 1999 - 2009
VP of operations
Interests:
A5tek is digital sinage software developer, please first watch
www.a5tek.com. We are looking for partners, resellers and integrators that are going to use. Looking forward to hear from you.
I would be remiss to not recognize the great teamwork of the Administration, the Virginia Economic Development Partnership, the Martinsville-Henry County Economic Development Corporation and the Mid-Atlantic Broadband Cooperative, who all worked together to ensure that ICF International picked Henry County, said Jim Cheng, ViVirginia Secretary of Commerce and Trade Jim Cheng, Virginia Secretary of Technology Jim Duffey and Virginia Deputy Secretary of Commerce and Trade for Rural Economic Development Mary Rae Carter also played an integral role in the project.