Kenneth Lee Jackson

US Patent:

20080036098, Feb 14, 2008

Filed:

Jun 14, 2006

Appl. No.:

11/424159

Inventors:

Julius A. Kovats - Manitou Springs CO, US
Kenneth M. Jackson - Colorado Springs CO, US

Assignee:

ATMEL CORPORATION - San Jose CA

International Classification:

H01L 23/48
H01L 23/52
H01L 29/40

US Classification:

257780

Abstract:

A universal interconnect device for mounting and interconnecting a semiconductor integrated circuit die in preparation for mounting to another substrate such as a printed circuit board. The device consists of a laminate substrate having a first surface upon which the integrated circuit die may be mounted. Underlying and surrounding the die mount area is a plurality of substantially concentric electrically-conductive paths. Each of the plurality of paths is electrically isolated from each other and at least one of the plurality of electrically-conductive paths is located near an outer periphery of the laminate substrate. A plurality of vias traverse the laminate substrate a plurality of bonding features is mounted on a second surface of the substrate. Each of the bonding features is electrically isolated both from one another and from the plurality of paths but is electrically connectable to one or more of the paths through the plurality of vias.