Neil J. Goldfine - Newton MA Kevin G. Rhoads - Andover MA Karen E. Walrath - Arlington MA David C. Clark - Arlington MA
Assignee:
Jentek Sensors, Incorporated - Waltham MA
International Classification:
G01N 2772
US Classification:
324232, 32420717, 324227, 324230, 324233, 324239
Abstract:
A system for characterizing coatings and substrates of a material under test. A sensor is positioned against a coated sample which is to be measured to obtain phase and magnitude measurements. Penetration depth of the magnetic waves of the sensor is a function of frequency. Measurements are made at each of a plurality of signal frequencies. The measured phase and magnitude data is applied with respect to a frequency independent parameter, such as conductivity, using a grid method. The conductivities of the coating and the substrate are determined by the limits of conductivity with respect to frequency. With the assumed conductivities of the coating and substrate, the sensor is once again placed over the material, and coating thickness and lift-off are determined. By examining the coating thickness versus frequency the accuracy of the measurement can be determined, since actual coating thickness does not vary with frequency in the material. Through iterative approximations, conductivity can then be accurately determined.
Active Method And System Of Establishing Electrical Contact
A system for electrically contacting a semiconductor wafer during implanting of the wafer includes one or more pairs of closely spaced contacts located adjacent the semiconductor wafer and a driving circuit connected to the contacts to provide a discharge from one contact to the semiconductor wafer and from the semiconductor wafer to the other contact of each pair of contacts. The contacts can be spaced apart from the wafer and the tips of the contacts closest to the wafer may have sharp points to aid in the establishment of corona at lower drive voltages. Alternately, the contacts may be rounded and may contact the wafer. The driving circuit may be adapted from a pulsed discharge circuit, such as a Kettering ignition circuit, a capacitance discharge ignition circuit, or a blocking oscillator circuit. Alternately, the driving circuit may be adapted from a continuous discharge circuit, such as a Tesla coil circuit.
Electrostatic Clamping Of Gallium Arsenide And Other High Resistivity Materials
Kevin Rhoads - Andover MA, US Grant Larsen - Gloucester MA, US
Assignee:
Varian Semiconductor Equipment Associates, Inc.
International Classification:
H01H001/00
US Classification:
361/234000
Abstract:
A method for electrostatic clamping of a high resistivity workpiece includes the steps of positioning a high resistivity workpiece on a clamping surface of an electrostatic clamp, the electrostatic clamp including electrodes underlying and electrically isolated from the clamping surface, and applying AC clamping voltages to the electrodes for electrostatically clamping the workpiece in a fixed position on the clamping surface. The AC clamping voltages have a frequency in a range of about 0.00175 Hz to 10 Hz and more preferably have a frequency in a range of about 1 Hz to 6 Hz.
High Accuracy Calibration-Free Electrical Parameter Measurements Using Differential Measurement With Respect To Immersion Depth
Donald R. Sadoway - Belmont MA Kevin G. Rhoads - Andover MA Naomi A. Fried - Cambridge MA Susan L. Schiefelbein - Boston MA
Assignee:
Massachusetts Institute of Technology - Cambridge MA
International Classification:
G01N 2702
US Classification:
324447
Abstract:
An apparatus and method for measuring electrical parameters of a medium such as electrical conductivity and dielectric constant between a pair of electrodes are disclosed. The medium can be a liquid, gas, powder, etc. , and the electrodes can be coaxial metallic circular cylinders. To compute electrical conductivity, the device is immersed in the medium to an immersion depth and the conductance across the electrodes is determined. The measurement is repeated at at least one additional immersion depth. By obtaining a differential conductance measurement with respect to the immersion depth, the effects of fringe conductances are eliminated from the measurement. The device can also be used to determine dielectric constant of the material by obtaining a differential capacitance measurement with respect to immersion depth. The device need not be calibrated by performing resistance measurements in a known standard solution. Also, because the electrodes can be purely metallic and include no dielectric material, the device can be used to perform measurements in highly corrosive media whose compositions would be altered upon contact with dielectric materials.
A security tag used with an electronic security system comprises a dielectric substrate having first and second opposite principal surfaces and a resonant circuit capable of resonating at a frequency within a detection frequency range. The resonant circuit is formed, in part, by a first conductive area on the first substrate surface and a second conductive area on the second substrate surface, the two conductive areas being generally aligned with one another to establish a capacitor with the substrate therebetween forming the capacitor dielectric. A third conductive area is provided on one of the principal substrate surfaces proximate to but not electrically connected to one of the two capacitor plates. The third conductive area is electrically connected to the other capacitor plate. A portion of the third conductive area is spaced from a portion of the one capacitor plate by a predetermined minimum distance whereby upon the application of electromagnetic energy to the tag at a frequency generally corresponding to the resonant frequency of the resonant circuit and at or above a predetermined minimum energy level, an electric arc extends between the spaced portions of the third conductive area and the one capacitor plate creating a persistent conductive bridge which connects the two plates of the capacitor in a short circuit.
Algorithmics since Jun 2011
Integration Engineer
Lockheed Martin Jul 2007 - Jun 2011
Member Engineering Staff
Pegasystems May 2006 - Aug 2006
Intern
Anteon May 2005 - Jul 2005
Summer Intern
Education:
Rensselaer Polytechnic Institute 2003 - 2007
BS, Electrical Engineering
Skills:
Testing Linux Software Engineering Software Development Integration Unix Java C++ Sql Quality Assurance Python Matlab Systems Engineering Project Management Windows 7 Microsoft Office Lotus Notes Laboratory Skills Windows Xp Pro Circuit Design C Basalmiq Shell Scripting
Interests:
Economic Empowerment Civil Rights and Social Action Politics Education Poverty Alleviation Science and Technology Human Rights Health
Harvard University
Head Men's and Women's Golf Coach
Harvard University
Head Women's Golf Coach
Country Club
Director of Instruction
Pga of America Sep 2001 - Feb 2003
Instructor
Education:
University of California, Los Angeles 1990 - 1995
Bachelors, Bachelor of Arts, History
Skills:
Teaching Sports Event Planning Sports Management Coaching Sports Marketing Public Speaking Fundraising Higher Education Event Management Sports Coaching Community Outreach Social Media Research
Kevin G. Rhoads Engineering, Inc since Nov 1989
Principal
Dartmouth College - Hanover, NH Jan 2003 - Jan 2013
Engineer, Lynch Rocket Laboratory
Varian Semiconductor - Gloucester, MA. 1999 - 2002
Principal EE, Team Leader for Ion Implanter Electro-Static Platen
MIT - Cambridge, Massachusetts Sep 1983 - Jun 2002
Instructor
Jentek Sensors, Inc - Waltham MA Jun 1994 - Oct 1999
Engineer
Education:
Massachusetts Institute of Technology 1969 - 1989
Ph.D., Electrical Engineering and Computer Science
Skills:
Mathematics Optics Physics Numerics Measurement Systems Signal Conditioning Systems Engineering Electromechanics C Analog Circuit Design 8051 Microcontroller Algorithms Numerical Simulation Quasistatic Field Theory Numerical Analysis Matlab Sensors Electronics Modeling 68K Assembly Image Processing Engineering Continuum Electromechanics Signal Processing Embedded Systems Labview Manufacturing Design of Experiments Electrical Engineering Vacuum Failure Analysis Electrical Field Theory Robotics Semiconductors Simulations 8051 Assembly X86 Assembly Research Machine Learning Metrology Electro Mechanical High Performance Computing R&D Materials Science Systems Programming
Brandi Prchal, Ray Winter, Crystal Filbert, Cindy Hardten, Jennifer Myrick, Jessie Allison, David Trimble, Victoria Washburn, Lillian Rooney, Steven Strobel