Lijun N Jiang from 2737 Capella Way, Thousand Oaks, CA 91362, age 55

Us Patents

Huygens' Box Methodology For Signal Integrity Analysis
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US Patent:

8146043, Mar 27, 2012
Filed:

Mar 5, 2010
Appl. No.:

12/718309
Inventors:

Lijun Jiang - Poughquag NY, US
Jason D. Morsey - Hopewell Junction NY, US
Barry J. Rubin - Croton-On-Hudson NY, US
Weng C. Chew - Champaign IL, US
Yuan Liu - Champaign IL, US
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

G06F 17/50
US Classification:

716125, 716124, 716131, 716136, 703 13
Abstract:

A method for performing a signal integrity analysis on an integrated circuit (IC) that includes a plurality of scatterers by dividing the scatterers into subgroups using a nested Huygens' equivalence principle algorithm and solving a set of equations realized thereby with a reduced coupling matrix. The method includes decomposing the IC design into a plurality of small non-overlapping circuit sub-domains, wherein each of the sub-domains is formed as a small, enclosed region. Each sub-domain is analyzed independently of the other sub-domains using only electric fields to represent the interactions of each sub-domains with the other sub-domains as equivalent currents on equivalent surfaces of the plurality of sub-domains. Neighboring equivalent sub-domains are grouped together to form larger sub-domains using equivalent currents on equivalent surfaces to represent the interactions of the sub-domains. The steps of analyzing and grouping the sub-domains are repeated until the grouping approaches a box comprising the entire domain, and that the domain interactions between every sub-domain have been analyzed.

Huygens' Box Methodology For Signal Integrity Analysis
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US Patent:

20090089021, Apr 2, 2009
Filed:

Sep 27, 2007
Appl. No.:

11/862434
Inventors:

Lijun Jiang - Poughquag NY, US
Jason D. Morsey - Hopewell Junction NY, US
Barry J. Rubin - Croton-on-Hudson NY, US
Weng C. Chew - Champaign IL, US
Yuan Liu - Champaign IL, US
Assignee:

International Business Machines Corporation - Armonk NY
International Classification:

G06F 17/10
G06G 7/48
US Classification:

703 2
Abstract:

A method for performing a signal integrity analysis on an integrated circuit (IC) that includes a plurality of scatterers by dividing the scatterers into subgroups using a nested Huygens' equivalence principle algorithm and solving a set of equations realized thereby with a reduced coupling matrix. The method includes decomposing the IC design into a plurality of small non-overlapping circuit sub-domains, wherein each of the sub-domains is formed as a small, enclosed region. Each sub-domain is analyzed independently of the other sub-domains using only electric fields to represent the interactions of each sub-domains with the other sub-domains as equivalent currents on equivalent surfaces of the plurality of sub-domains. Neighboring equivalent sub-domains are grouped together to form larger sub-domains using equivalent currents on equivalent surfaces to represent the interactions of the sub-domains. The steps of analyzing and grouping the sub-domains are repeated until the grouping approaches a box comprising the entire domain, and that the domain interactions between every sub-domain have been analyzed.

Double-Layer Integral Using A Static Green's Function And Rectangular Basis
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US Patent:

20090144685, Jun 4, 2009
Filed:

May 29, 2007
Appl. No.:

11/754539
Inventors:

Lijun Jiang - Poughquag NY, US
Jason D. Morsey - Hopewell Junction NY, US
International Classification:

G06F 17/50
US Classification:

716 8
Abstract:

The present invention a new closed-form double-layer integral for a rectangular basis. It is valid for both self integrals and non-self integrals. In general, the approach of the present invention contains only six (6) terms and is much simpler than indirect closed-form results, which has 24 terms.

Methodology For Thermal Modeling Of On-Chip Interconnects Based On Electromagnetic Simulation Tools
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US Patent:

20090164183, Jun 25, 2009
Filed:

Feb 26, 2008
Appl. No.:

12/037753
Inventors:

Howard Smith - Beacon NY, US
Lijun Jiang - Poughquag NY, US
Alina Deutsch - Chappaqua NY, US
Kaushik Chanda - Fishkill NY, US
Barry Jay Rubin - Croton-on-Hudson NY, US
Jason Gill - Lagrange NY, US
Seshadri K. Kolluri - Goleta CA, US
Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:

G06G 7/122
US Classification:

703 6
Abstract:

A method and apparatus for thermal modeling of on-chip interconnects using electromagnetic tools to determine a temperature profile across the interconnect structure and the temperature at each node of an equivalent thermal circuit derived from an electrical model.