Lori M Carroll

US Patent:

6740544, May 25, 2004

Filed:

May 14, 2002

Appl. No.:

10/145503

Inventors:

Floyd Strouse - Tempe AZ
Lori D. Carroll Shearer - Scottsdale AZ
Brant Besser - Mesa AZ

Assignee:

Freescale Semiconductor, Inc. - Schaumburg IL

International Classification:

H01L 2144

US Classification:

438118, 257772, 420555

Abstract:

A method for attaching a die ( ) to a substrate ( ) is provided. In accordance with the method, a die and a substrate are provided which are to be connected to each other across first and second surfaces. The first and second surfaces are contacted with a liquid solder composition ( ) having a maximum melting temperature T , of less than about 100 C. The liquid solder composition is contacted with a freezing agent ( or ) such that a second composition is formed which has a maximum melting temperature T , wherein T -T is at least about 25Â C.