Mark D Wyatt

US Patent:

7092855, Aug 15, 2006

Filed:

May 30, 2003

Appl. No.:

10/449308

Inventors:

Mark James Wyatt - Chino Hills CA, US
Erik Martin Pedersen - Sierra Madre CA, US
Luigi Sartor - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G06F 17/50
B05D 3/12

US Classification:

703 1, 703 2, 118410, 118688, 118712

Abstract:

A method of designing and the resulting thermally stable heated coating die apparatus, the die apparatus including a die having a die geometry and a heating system with heaters and temperature sensors. The method and resultant apparatus provides minimized temperature gradients, flat die lip faces in a die to roll plane and a flat die in a plane perpendicular to die flat lip faces and parallel to substrate width. The method optimizes simultaneously: die geometry, placement of the heaters, placement of temperature sensors, and shielding from operating conditions, using heat transfer and structural numerical modeling and statistical analysis while considering die functionality characteristics, minimum increment of temperature measurement and control accuracy related to minimum acceptable deviation from flatness, coating die material of construction relative to thermo-structural material properties, and desirable coating die material properties.

US Patent:

7160094, Jan 9, 2007

Filed:

May 21, 2004

Appl. No.:

10/850893

Inventors:

Mark Wyatt - Chino Hills CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

B29C 47/16

US Classification:

425141, 425190, 425381, 425465, 425466

Abstract:

A die assembly () having a first die part (), which includes a first lip () that, in combination with a second lip (), defines a feed gap (). The first die part () also includes a rear portion (), a front portion (), a slot () between these portions (), and a gap-setting device () that is mechanically movable within the slot () so as to enable the movement of the front portion () relative to the rear portion (). The first lip () is carried by the front portion (), whereby movement of the front portion () in one direction moves the first lip () relative to the second lip (), thereby adjusting the feed gap (). The geometries of the slot () and the gap-setting device () are such that movement in a second opposite direction is limited to a known position, thereby providing a registration position for the front portion () of the first die part () and thereby providing a registration position for the first lip ().

US Patent:

7534300, May 19, 2009

Filed:

Oct 31, 2007

Appl. No.:

11/982692

Inventors:

Mark James Wyatt - Chino Hills CA, US
Erik Martin Pedersen - Sierra Madre CA, US
Luigi Sartor - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

B05C 3/02

US Classification:

118410, 118667, 118419

Abstract:

A method of designing and the resulting thermally stable heated coating die apparatus, the die apparatus including a die having a die geometry and a heating system with heaters and temperature sensors. The method and resultant apparatus provides minimized temperature gradients, flat die lip faces in a die to roll plane and a flat die in a plane perpendicular to die flat lip faces and parallel to substrate width. The method optimizes simultaneously: die geometry, placement of the heaters, placement of temperature sensors, and shielding from operating conditions, using heat transfer and structural numerical modeling and statistical analysis while considering die functionality characteristics, minimum increment of temperature measurement and control accuracy related to minimum acceptable deviation from flatness, coating die material of construction relative to thermo-structural material properties, and desirable coating die material properties.

US Patent:

7361226, Apr 22, 2008

Filed:

Aug 18, 2005

Appl. No.:

11/208287

Inventors:

Mark James Wyatt - Chino Hills CA, US
Erik Martin Pedersen - Sierra Madre CA, US
Luigi Sartor - Pasadena CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

B05C 11/00

US Classification:

118667, 118302, 118410, 118419, 4253791

Abstract:

A method of designing and the resulting thermally stable heated coating die apparatus, the die apparatus including a die having a die geometry and a heating system with heaters and temperature sensors. The method and resultant apparatus provides minimized temperature gradients, flat die lip faces in a die to roll plane and a flat die in a plane perpendicular to die flat lip faces and parallel to substrate width. The method optimizes simultaneously: die geometry, placement of the heaters, placement of temperature sensors, and shielding from operating conditions, using heat transfer and structural numerical modeling and statistical analysis while considering die functionality characteristics, minimum increment of temperature measurement and control accuracy related to minimum acceptable deviation from flatness, coating die material of construction relative to thermo-structural material properties, and desirable coating die material properties.

US Patent:

20130022797, Jan 24, 2013

Filed:

Sep 27, 2012

Appl. No.:

13/628076

Inventors:

Avery Dennison Corporation - Pasadena CA, US
Richard D. PASTOR - Chardon OH, US
Craig W. POTTER - Mentor OH, US
Richard A. PREVITY - Chardon OH, US
Mitchell J. RACKOVAN - Madison OH, US
Mark J. WYATT - Chino Hills CA, US
William W. CONE - Weeki Wachee FL, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

G09F 3/04
B32B 33/00
B32B 3/06
B32B 27/08

US Classification:

428201, 428343, 4281951, 428352

Abstract:

A label for application to a surface having at least one compound curve is provided. The label comprises a heat shrinkable film having an inner surface and outer surface and a layer of pressure sensitive adhesive on the inner surface of the heat shrinkable film.

US Patent:

20140048196, Feb 20, 2014

Filed:

Aug 16, 2013

Appl. No.:

13/968484

Inventors:

Mark J. WYATT - Chino Hills CA, US
Erik M. PEDERSEN - Sierra Madre CA, US
Ronald HAYCOX - Painesville OH, US
Raymond NEWNES - Mentor OH, US
John LYALL - Cheshire, GB
Shawn ROSS - Parma OH, US
Nick McCLELLEN - Parma OH, US
Jeremy BOCKMULLER - Hiram OH, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

B65C 9/26

US Classification:

156 60, 156580, 1565831

Abstract:

A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label and/or the label itself onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. The label processors include particular exhaust assemblies and air diffuser assemblies.

US Patent:

20150217893, Aug 6, 2015

Filed:

Aug 16, 2013

Appl. No.:

14/421909

Inventors:

- Glendale CA, US
Mark J. Wyatt - Chino Hills CA, US
Erik M. Pedersen - Sierra Madre CA, US
Ronald Haycox - Painesville OH, US
Raymond Newnes - Mentor OH, US
John Lyall - Cheshire, GB
Shawn Ross - Parma OH, US
Nick McClellen - Parma OH, US
Jeremy Bockmuller - Hiram OH, US

International Classification:

B65C 9/00
B65C 9/24
B65C 9/26
B65C 3/14

Abstract:

A deformable label processor and related methods are described. The processor is heated and urged against a label, such as a heat transfer label, to apply one or more designs from the label and/or the label itself onto a container or other surface. The processor and methods are well suited for application of labels onto compound curved surfaces. The label processors include particular exhaust assemblies and air diffuser assemblies.

US Patent:

20150183544, Jul 2, 2015

Filed:

Dec 15, 2014

Appl. No.:

14/570278

Inventors:

- Glendale CA, US
Mark J. WYATT - Chino Hills CA, US
Radha SEN - Glendale CA, US
Yuan Yuan ZHANG - San Dimas CA, US

International Classification:

B65C 3/08
B65C 9/22
B65C 9/26
B65C 9/00

Abstract:

According to an aspect, the present invention is directed to a method for applying a label to a substrate. The method includes applying an ink layer to a transfer mechanism; applying a binding layer to the ink layer; and contacting the binding layer to the substrate such that the binding layer and the ink layer are substantially removed from the transfer mechanism.