Martha A Maxwell

US Patent:

20110143021, Jun 16, 2011

Filed:

Dec 15, 2009

Appl. No.:

12/638892

Inventors:

Corey A. Peterson - Grafton WI, US
Martha A. Maxwell - Milwaukee WI, US
Bruce W. Weiss - Whitefish Bay WI, US

Assignee:

Rockwell Automation Technologies, Inc. - Mayfield Heights OH

International Classification:

H05K 3/00
B05D 3/02
B05C 11/00
B05C 5/00

US Classification:

427 992, 118663, 118300

Abstract:

A conformal coating system and method for coating a printed circuit board (PCB) is provided. The system comprises a coating station configured to coat the PCB with a coating material and without cleaning the PCB with a saponifier. A surface energy of the PCB is maintained above a target surface energy at least through the cleaning station to promote adhesion of the coating material.

US Patent:

20130120946, May 16, 2013

Filed:

Oct 30, 2012

Appl. No.:

13/664269

Inventors:

Kevin G. Stachowiak - Germantown WI, US
Kevin L. Baumann - Cedarburg WI, US
Raymond G. Sladky - Grafton WI, US
Gary R. Krenke - Germantown WI, US
John C. Boetcher - Richfield WI, US
Brian R. Krueger - Brown Deer WI, US
Robert M. Michalski - West Bend WI, US
Paul J. Grosskreuz - West Bend WI, US
Joseph William Budill - Grayslake IL, US
Brian C. Frank - Cedarburg WI, US
Martha A. Maxwell - Milwaukee WI, US

Assignee:

ROCKWELL AUTOMATION TECHNOLOGIES, INC. - Mayfield Heights OH

International Classification:

H05K 7/14

US Classification:

361759, 3122232, 2952501

Abstract:

A system for manufacturing an industrial automation drive includes a carrier frame configured to hold one or more semiconductor devices for use in the industrial automation drive. The carrier frame includes a set of fasteners disposed around an internal wall of the carrier frame such that each fastener of the set of fasteners includes an angled edge and a horizontal edge. Each fastener of the set of fasteners is configured to toollessly couple a power circuit board having the semiconductor devices to the carrier frame by bending from a first position when the power circuit board is pushed against the angled edge and returning to the first position when the power circuit board is pushed past the horizontal edge.

US Patent:

20100110650, May 6, 2010

Filed:

Oct 31, 2008

Appl. No.:

12/262710

Inventors:

Martha A. Maxwell - Milwaukee WI, US
Corey A. Peterson - Grafton WI, US
John N. Bluma - Milwaukee WI, US

International Classification:

H05K 3/34
H05K 7/00

US Classification:

361777, 29840

Abstract:

Disclosed herein is a method for forming solder joints including providing a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces. The printed circuit board supports on the first outer surface at least one electronic component having a plurality of leads, and further includes a plurality of through-hole clusters. Each through-hole cluster is associated with a single lead and includes a central hole portion surrounded by a plurality of other hole portions. A plurality of solder joints is formed by subsequently moving the printed circuit board over a wave soldering tank filled with solder. Each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces. Each solder joint is formed by solder which is wicked up by the through-hole cluster to extend from the second surface to the first surface.

Address:

834 N 70 St, Milwaukee, WI 53213

VIN:

3VWEF71K97M063194

Make:

VOLKSWAGEN

Model:

JETTA

Year:

2007