Corey A. Peterson - Grafton WI, US Martha A. Maxwell - Milwaukee WI, US Bruce W. Weiss - Whitefish Bay WI, US
Assignee:
Rockwell Automation Technologies, Inc. - Mayfield Heights OH
International Classification:
H05K 3/00 B05D 3/02 B05C 11/00 B05C 5/00
US Classification:
427 992, 118663, 118300
Abstract:
A conformal coating system and method for coating a printed circuit board (PCB) is provided. The system comprises a coating station configured to coat the PCB with a coating material and without cleaning the PCB with a saponifier. A surface energy of the PCB is maintained above a target surface energy at least through the cleaning station to promote adhesion of the coating material.
Systems And Methods For Manufacturing Industrial Automation Drives
Kevin G. Stachowiak - Germantown WI, US Kevin L. Baumann - Cedarburg WI, US Raymond G. Sladky - Grafton WI, US Gary R. Krenke - Germantown WI, US John C. Boetcher - Richfield WI, US Brian R. Krueger - Brown Deer WI, US Robert M. Michalski - West Bend WI, US Paul J. Grosskreuz - West Bend WI, US Joseph William Budill - Grayslake IL, US Brian C. Frank - Cedarburg WI, US Martha A. Maxwell - Milwaukee WI, US
Assignee:
ROCKWELL AUTOMATION TECHNOLOGIES, INC. - Mayfield Heights OH
International Classification:
H05K 7/14
US Classification:
361759, 3122232, 2952501
Abstract:
A system for manufacturing an industrial automation drive includes a carrier frame configured to hold one or more semiconductor devices for use in the industrial automation drive. The carrier frame includes a set of fasteners disposed around an internal wall of the carrier frame such that each fastener of the set of fasteners includes an angled edge and a horizontal edge. Each fastener of the set of fasteners is configured to toollessly couple a power circuit board having the semiconductor devices to the carrier frame by bending from a first position when the power circuit board is pushed against the angled edge and returning to the first position when the power circuit board is pushed past the horizontal edge.
Soldering Strategies For Printed Circuit Board Assemblies
Martha A. Maxwell - Milwaukee WI, US Corey A. Peterson - Grafton WI, US John N. Bluma - Milwaukee WI, US
International Classification:
H05K 3/34 H05K 7/00
US Classification:
361777, 29840
Abstract:
Disclosed herein is a method for forming solder joints including providing a printed circuit board having a first outer surface, a second outer surface opposite the first outer surface, and a plurality of conductive interconnect traces. The printed circuit board supports on the first outer surface at least one electronic component having a plurality of leads, and further includes a plurality of through-hole clusters. Each through-hole cluster is associated with a single lead and includes a central hole portion surrounded by a plurality of other hole portions. A plurality of solder joints is formed by subsequently moving the printed circuit board over a wave soldering tank filled with solder. Each solder joint is formed between a respective lead inserted in the central hole portion of a respective through-hole cluster and a corresponding one of the plurality of conductive interconnect traces. Each solder joint is formed by solder which is wicked up by the through-hole cluster to extend from the second surface to the first surface.
Aurora Health Care Sep 2016 - Oct 2017
Print Production Specialist
Marquette University Sep 2016 - Oct 2017
Project Specialist
Traction Factory May 2012 - Jul 2015
Traffic Manager
Stephan & Brady Jan 2007 - Mar 2012
Traffic Manager
Versant Jan 2003 - Sep 2006
Traffic and Print Production Manager
Sandi Anderson, Richard Peterson, Janet Trook, Don Hoefs, Tom Fitchett, Marilyn Beach, Charles Hawkins, Harry Large, Elane Smidt, Shona Sorensen, L.d. Meyer
Martha Maxwell told investigators her husband had duct-taped her mouth and tortured her with electric wires in their upstairs bedroom before drugging her. The next thing I remember is waking up in Parkland Hospital, she said.