Michael E Mcclure

US Patent:

7109635, Sep 19, 2006

Filed:

Jun 14, 2004

Appl. No.:

10/867172

Inventors:

Michael T. McClure - Winter Park FL, US
Jack Chocola - Lake Mary FL, US
Kevin K. Lin - Apopka FL, US
George Grama - Oviedo FL, US

Assignee:

Sawtek, Inc. - Orlando FL

International Classification:

H01L 41/08

US Classification:

310313R, 310340, 310344

Abstract:

An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.

US Patent:

7635636, Dec 22, 2009

Filed:

Aug 1, 2006

Appl. No.:

11/461587

Inventors:

Michael T. McClure - Winter Park FL, US
Jack Chocola - Lake Mary FL, US
Kevin K. Lin - Apopka FL, US
George Grama - Oviedo FL, US

Assignee:

Triquint Semiconductor, Inc. - Orlando FL

International Classification:

H01L 21/46
H01L 21/30

US Classification:

438455, 438106, 438456, 438458, 438459, 438464

Abstract:

An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.