Michael James Todd

US Patent:

6740246, May 25, 2004

Filed:

Apr 17, 2001

Appl. No.:

09/836645

Inventors:

Andrew Zachary Glovatsky - Plymouth MI
Robert Edward Belke - West Bloomfield MI
Marc Alan Straub - Dearborn Heights MI
Michael George Todd - Anaheim Hills CA

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

H01B 1300

US Classification:

216 18, 216 15, 29829, 29846

Abstract:

A method for making multi-layer electronic circuit boards having âblindâ type apertures which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits.

US Patent:

56540817, Aug 5, 1997

Filed:

Jul 5, 1995

Appl. No.:

8/498207

Inventors:

Michael G. Todd - South Lyon MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B32B 900

US Classification:

428209

Abstract:

In a method of producing an integrated circuit assembly, an IC device is metallurgically bonded to a supporting substrate. The mounting of the IC device to the substrate also includes a polymeric underfill body adhesively bonding the IC device to the substrate. The polymeric underfill body is formed of a curable underfill composition comprising epoxy resin, anhydride curing agent for the epoxy resin, amine catalyst and a minor amount of an additional component selected from alkyl-substituted imidazole and phenyl-substituted imidazole. Such additional component may act as a catalyst, as used with an amine catalyst known catalyst for the polymerization reaction of the epoxy resin with the anhydride curing agent, may act as a co-catalyst. The polymeric underfill body has improved glass transition temperature values and improved coefficient of thermal expansion values to provide good thermal stress cycling life for the integrated circuit assembly. The additional component, such as N-methyl-imidazole, is used in minor amount, such as from 0. 05 to 5.

US Patent:

58376097, Nov 17, 1998

Filed:

Jan 16, 1997

Appl. No.:

8/784886

Inventors:

Michael George Todd - South Lyon MI
Robert Edward Belke - West Bloomfield MI
Andrew Zachary Glovatsky - Ypsilanti MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H01L 2144

US Classification:

438678

Abstract:

A fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part comprises: pretreating the surface of the part; pad-printing a surface catalyst in a solvent carrier onto the surface in the shape of a desired circuit pattern; and applying an electroless copper deposit onto the surface catalyst, thereby providing a copper layer on the surface in the desired circuit pattern shape.

US Patent:

59946482, Nov 30, 1999

Filed:

Mar 27, 1997

Appl. No.:

8/826461

Inventors:

Andrew Z. Glovatsky - Ypsilanti MI
Michael G. Todd - South Lyon MI
Cuong Van Pham - Northville MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H05K 332

US Classification:

174260

Abstract:

An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

US Patent:

56390106, Jun 17, 1997

Filed:

Aug 31, 1995

Appl. No.:

8/521765

Inventors:

Michael G. Todd - South Lyon MI
Mayank R. Parikh - Canton MI
Jorge D. Santana - Sao Paulo, BR
Mauricio Ciocler - Sao Paulo, BR

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H05K 334

US Classification:

228175

Abstract:

A method for attaching a surface mount device to a circuit board includes applying a heat curable adhesive to the circuit board, applying solder paste with a predetermined melting temperature to the circuit board, placing the surface mount device on the adhesive, placing the circuit board into an oven where the circuit board is continuously heated to a first temperature until the adhesive is sufficiently cured so that it withstands reflow of the solder paste then to a second temperature to melt the solder paste.

US Patent:

57025843, Dec 30, 1997

Filed:

Jul 1, 1996

Appl. No.:

8/675308

Inventors:

Lakhi N. Goenka - Ann Arbor MI
Michael G. Todd - South Lyon MI
Andrew Z. Glovatsky - Ypsilanti MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

C25D 554
C25D 556
B05D 304

US Classification:

205158

Abstract:

A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.

US Patent:

59090120, Jun 1, 1999

Filed:

Oct 21, 1996

Appl. No.:

8/730618

Inventors:

Michael George Todd - South Lyon MI
Charles Frederick Schweitzer - Novi MI
Robert Edward Belke - West Bloomfield MI
Tianmin Zheng - Ann Arbor MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H05K 111

US Classification:

174266

Abstract:

A gas assisted injection molded part includes internal cavities extending between two surfaces of the part. The cavities are plated for electrical conductivity after a surface cleaning and etching process. The part may be an automobile instrument panel wherein the internal cavities are plated to create a series of "bus" conductor lines. These lines carry power, ground and/or electrical signals over relatively large distances, allowing other components to attach at points along the structure eliminating the need for discrete wiring and wire harness interconnect assemblies.

US Patent:

61001783, Aug 8, 2000

Filed:

Feb 28, 1997

Appl. No.:

8/808403

Inventors:

Michael George Todd - South Lyon MI
Andrew Zachary Glovatsky - Ypsilanti MI
Peter Joseph Sinkunas - Canton MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

H01L 214763
H01L 2100

US Classification:

438622

Abstract:

A three-dimensional multi-layer electronic device and method for manufacturing same, wherein the device comprises a three-dimensional substrate including a conductive trace on at least one surface of the substrate, a thin layer of dielectric material substantially covering a desired portion of the conductive trace(s) on the substrate, the dielectric layer including vias at selected locations, and applying a coating of conductive material on the dielectric layer and in the vias, and defining a conductive trace in the material to thereby form a multi-layer, interconnected three-dimensional electronic device. Additional layers of dielectric material and conductive traces may be similarly applied to create the desired number of circuit layers. Molded-in structural features, and/or vias may be defined in the appropriate layers to accommodate the attachment and/or interconnection of other electronic devices to the device.