Michael D Todd

US Patent:

53764030, Dec 27, 1994

Filed:

Oct 1, 1991

Appl. No.:

7/769892

Inventors:

Miguel A. Capote - Carlsbad CA
Michael G. Todd - Vista CA
Nicholas J. Manesis - San Jose CA
Hugh P. Craig - Butte MT

International Classification:

B05D 512

US Classification:

427 96

Abstract:

Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits: the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.

US Patent:

55652670, Oct 15, 1996

Filed:

Jun 7, 1995

Appl. No.:

8/478453

Inventors:

Miguel A. Capote - Carlsbad CA
Michael G. Todd - Vista CA

Assignee:

Toranaga Technologies, Inc. - Carlsbad CA

International Classification:

H01B 102
H01B 122

US Classification:

428344

Abstract:

Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180. degree. and about 245. degree. C. , or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

US Patent:

55387896, Jul 23, 1996

Filed:

Jan 26, 1994

Appl. No.:

8/188658

Inventors:

Miguel A. Capote - Carlsbad CA
Michael G. Todd - Vista CA

Assignee:

Toranaga Technologies, Inc. - Carlsbad CA

International Classification:

H01B 102
H01B 122

US Classification:

428344

Abstract:

Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in the range of about 180. degree. and about 245. degree. C. , or a thermosetting material capable of B-stage curing. The preparation of the novel substrates and printed circuits using the substrates and conductive traces formed with electrically-conductive ink compositions is also described.

US Patent:

58303898, Nov 3, 1998

Filed:

Oct 17, 1994

Appl. No.:

8/324060

Inventors:

Miguel Albert Capote - Carlsbad CA
Michael George Todd - Vista CA
Nicholas John Manesis - San Jose CA
Hugh P. Craig - Butte MT

Assignee:

Toranaga Technologies, Inc. - Carlsbad CA

International Classification:

H01B 120
H01B 122

US Classification:

252512

Abstract:

Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits; the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.

US Patent:

20220404276, Dec 22, 2022

Filed:

Nov 12, 2020

Appl. No.:

17/775530

Inventors:

- Oakland CA, US
Michael Todd - San Diego CA, US

International Classification:

G01N 21/45
G01B 11/06
G01N 21/88

Abstract:

In one aspect, there is provided a system including at least one processor; and at least one memory including program code which when executed by the at least one processor causes operations including capturing an image of at least a portion of a surface of an object; generating, from the captured image, pixel intensity data; in response to generating the pixel intensity data, determining, based on a height error model, height error data, wherein the height error data indicates an uncertainty of at least one height measurement of the object; and determining, based on the height error data, whether the object satisfies a threshold criteria for acceptance of the object. Related system, methods, and articles of manufacture are also disclosed.