Justin Brask - Portland OR, US Paul Sears - Beaverton OR, US Jack Kavalieros - Portland OR, US Mark Doczy - Beaverton OR, US Matthew Metz - Hillsboro OR, US Suman Datta - Beaverton OR, US Uday Shah - Portland OR, US Robert Chau - Beaverton OR, US
International Classification:
H01L021/461
US Classification:
438748000, 438753000
Abstract:
A wafer may be rotated while etching to displace bubbles that may form, for example, from a reaction between silicon and water. As a result, a hydrophobic layer, which would otherwise be created by the bubbles, cannot form, resulting in a more uniform etch rate in some embodiments.