Peter F Desimone

US Patent:

20030030454, Feb 13, 2003

Filed:

Aug 13, 2001

Appl. No.:

09/928299

Inventors:

Peter DeSimone - Cranston RI, US

International Classification:

G01R031/02

US Classification:

324/754000

Abstract:

An enhanced probe plate assembly for a circuit board test fixture is disclosed. A conductive surface or surfaces is laminated to the underside of a probe plate assembly located between an electrical test system and circuit board under test. These conductive surface(s) of the probe plate assembly provide an improved interface between the signal probes and personality pins of the circuit board test fixture and can be used for grounding planes, voltage sources, and common interconnection grids. The enhanced probe plate assembly results in increased signal quality due to reduced signal path length, less crosstalk and signal loss between personality pin and signal probe connections, and perfect alignment of personality pins and signal probes through the conductive surface. It is emphasized that this abstract is provided to comply with the rules requiring an abstract, which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.