Phillip J Ball

US Patent:

7068056, Jun 27, 2006

Filed:

Jul 18, 2005

Appl. No.:

11/184216

Inventors:

Byron H. Gibbs - McKinney TX, US
Phillip H. Ball - Richardson TX, US
Adolphus E. McClanahan - Garland TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G01R 31/02

US Classification:

324754

Abstract:

In one embodiment, a method for probing a wafer includes providing a plurality of pressure sensors on a surface of a probe card holding tray, positioning a probe card of a testhead relative to a prober supporting a wafer, engaging the probe card with the probe card holding tray, receiving a plurality of pressure signals from respective pressure sensors, and comparing the pressure signals to determine if the probe card is substantially parallel with the prober.

US Patent:

20060071679, Apr 6, 2006

Filed:

Oct 4, 2004

Appl. No.:

10/958777

Inventors:

Byron Gibbs - McKinney TX, US
Adolphus McClanahan - Garland TX, US
Phillip Ball - Richardson TX, US

International Classification:

G01R 31/26

US Classification:

324765000

Abstract:

According to one embodiment of the invention, a method for probing a wafer includes positioning a testhead relative to a prober supporting a wafer in a testing position. The method also includes receiving at least one prober signal identifying the angular position of the prober and at least one testhead signal identifying the angular position of the testhead. The at least one prober signal and the at least one testhead signal are processed to determine if the testhead is substantially parallel with the prober, and output is provided to allow for adjustment of the position of the testhead in response to determining that the testhead is not substantially parallel with the prober.