Qing Wang

US Patent:

20100258786, Oct 14, 2010

Filed:

Apr 5, 2010

Appl. No.:

12/753942

Inventors:

Qing Hua WANG - Evanston IL, US
Mark C. Hersam - Evanston IL, US

Assignee:

NORTHWESTERN UNIVERSITY - Evanston IL

International Classification:

H01L 51/30
H01L 51/40

US Classification:

257 29, 438 99, 977734, 257 40, 257 77, 257E51024

Abstract:

Self-assembled organic monolayers on epitaxial graphene are described. The organic molecules are perylene derivatives including 3,4,9,10-perylene-tetracarboxylic dianhydride (PTCDA) molecules arranged in a herringbone phase and/or molecules are of the following formula:wherein Rand Rare alkyl groups. The organic monolayers can be patterned. Metal oxides can also be deposited on the organic monolayers. Methods of forming the self-assembled organic monolayers are also described.

US Patent:

20110039372, Feb 17, 2011

Filed:

Aug 13, 2010

Appl. No.:

12/856101

Inventors:

Peter V. Loeppert - Hoffman Estates IL, US
Denise P. Czech - Schaumburg IL, US
Lawrence A. Grunert - Lombard IL, US
Kurt B. Friel - Sycamore IL, US
Qing Wang - Bloomingdale IL, US

International Classification:

H01L 21/78

US Classification:

438114, 257E21599

Abstract:

A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.

US Patent:

20140037120, Feb 6, 2014

Filed:

Jul 29, 2013

Appl. No.:

13/953209

Inventors:

Qing Wang - Carol Stream IL, US
Sandra F. Vos - East Dundee IL, US

Assignee:

Knowles Electronics, LLC - Itasca IL

International Classification:

H04R 23/00

US Classification:

381355

Abstract:

A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base.

US Patent:

20150166335, Jun 18, 2015

Filed:

Feb 26, 2015

Appl. No.:

14/632428

Inventors:

- Itasca IL, US
Denise P. Czech - Schaumburg IL, US
Lawrence A. Grunert - Lombard IL, US
Kurt B. Friel - Sycamore IL, US
Qing Wang - Hanover Park IL, US

International Classification:

B81C 1/00

Abstract:

A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.