Raymond R Brown

Address:

2756 Barrington Cir, Las Vegas, NV 89117

VIN:

1G1YY26UX75102414

Make:

CHEVROLET

Model:

CORVETTE

Year:

2007

US Patent:

42868246, Sep 1, 1981

Filed:

Dec 21, 1979

Appl. No.:

6/105920

Inventors:

Raymond C. Brown - Tarzana CA

Assignee:

Superior Industries International, Inc. - Van Nuys CA

International Classification:

B60B 700

US Classification:

301 37SS

Abstract:

An automotive vehicle wheel having a solid wheel body, provided with replaceable rows of inner and outer spokes. The spokes are purely ornamental and are readily replaceable in the event of damage. Such replaceability is made possible by providing each spoke with a spring-loaded longitudinally moveable mounting member which places such spokes in longitudinal compression so as to hold them in place upon the wheel body.

US Patent:

42264782, Oct 7, 1980

Filed:

Aug 7, 1978

Appl. No.:

5/931755

Inventors:

Raymond C. Brown - Tarzana CA

Assignee:

Superior Industries International, Inc. - Van Nuys CA

International Classification:

B60B 700

US Classification:

301 37SS

Abstract:

An automotive vehicle wheel having a solid wheel body, provided with replaceable rows of inner and outer spokes. The spokes are purely ornamental and are readily replaceable in the event of damage. Such replaceability is made possible by providing each spoke with a longitudinally moveable mounting member. The mounting member is rotated relative to its respective spoke so as to place such spokes in longitudinal compression to hold them in place on the wheel.

US Patent:

50084925, Apr 16, 1991

Filed:

Oct 20, 1989

Appl. No.:

7/424414

Inventors:

Raymond L. Brown - Fountain Valley CA
Clifford L. Shock - Santa Ana CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

H01L 2302

US Classification:

174 524

Abstract:

A high current feedthrough package comprising a plurality of alternating rings respectively comprising a thermally conductive material and an electrically conductive material. The thermally conductive rings comprise a thermally conductive ceramic material such as aluminum nitride, while the electrically conductive rings comprise a material such as molybdenum, or one of its alloys, for example. The package is thus comprised of alternating rings or laminations of aluminum nitride and molybdenum, for example, that are stacked or layered to form a wall. The layered wall is brazed in a single step onto a base. The molybdenum rings act as high current feedthroughs and comprise tabs on the inner and outer perimeter which are available for interconnection to devices disposed within the enclosure and to external circuits. The aluminum nitride rings provide electrical isolation between the feed-through rings. The high thermal conductivity of the molybdenum and aluminum nitride provides for excellent thermal dissipation from the package.

US Patent:

46455523, Feb 24, 1987

Filed:

Nov 19, 1984

Appl. No.:

6/672562

Inventors:

William A. Vitriol - Anaheim CA
Raymond L. Brown - Riverside CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

B32B 3126

US Classification:

156 89

Abstract:

We disclose a process for manufacturing multilayer circuit boards which includes providing a conductive, or an insulating substrate with a conductive pattern thereon, and then transferring and firing a glass-ceramic tape layer to the surface of the substrate. This tape layer provides both electrical isolation between the substrate and electrical conductors or electronic components which are subsequently bonded to or mounted on the top surface of the glass-ceramic tape layer. By providing vertical electrical conductors by means of vias in the tape layer prior to firing the tape layer directly on the substrate, good X and Y lateral dimensionally stability of the tape material is maintained. In addition, a high quality thick film glass-ceramic electrical interconnect structure is achieved at a relatively low manufacturing cost.

US Patent:

46935207, Sep 15, 1987

Filed:

Feb 21, 1986

Appl. No.:

6/831503

Inventors:

Raymond C. Brown - Tarzana CA

Assignee:

Superior Industries International, Inc. - Van Nuys CA

International Classification:

B60B 704

US Classification:

301 37SS

Abstract:

An automotive vehicle wheel having a solid body that includes a hub and a radially outwardly extending bolt-on flange that merges into a tire-receiving rim wherein the flange is formed with a plurality of pockets or windows and a set of spoke elements is disposed within all or some of the pockets or windows.

US Patent:

41791630, Dec 18, 1979

Filed:

Nov 27, 1978

Appl. No.:

5/963952

Inventors:

Raymond C. Brown - Tarzana CA

Assignee:

Superior Industries International, Inc. - Van Nuys CA

International Classification:

B60B 704

US Classification:

301 37SS

Abstract:

A simulated wire spoke wheel assembly for use with a conventional solid steel wheel. The assembly includes a wire spoke basket having a row of inner spokes and a row of outer spokes. Such wire spoke basket is releasably secured to the exterior of a steel wheel by a single bolt extending through an exterior cap. The single bolt retains the entire assembly in place upon the steel wheel. Such assembly may be readily removed when it is desired to change the wheel, as in the event of a flat tire.

US Patent:

52058964, Apr 27, 1993

Filed:

Feb 3, 1992

Appl. No.:

7/829665

Inventors:

Raymond L. Brown - Fountain Valley CA
Gerald B. Smith - Huntington Beach CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

B23K 1700
B23K 2000

US Classification:

156297

Abstract:

Discrete solder preforms (28, 14a, 14b, 14c) are quickly and accurately placed on substrates (10) to be soldered by means of a foil sheet (24) apertured (26) with the pattern of preform placement. The foil sheet has a vacuum drawn through its apertures, and a number of discrete solder preforms are randomly projected from a vibratory membrane (38) up against the foil to be attached to the foil at each of its apertures. Then the foil sheet with its vacuum attached solder preforms (28, 14a, 14b, 14c) is moved into registration with the flux pattern (12a, 12b, 12c) pre-printed on the substrate (10), and all of the vacuum attached preforms are simultaneously positioned down upon the flux areas of the substrate where they remain when the vacuum is released. Planarity of the thin foil is maintained by a flat somewhat rigid but porous backing member (32) secured to the foil.

US Patent:

51646994, Nov 17, 1992

Filed:

Dec 17, 1990

Appl. No.:

7/628813

Inventors:

Hal D. Smith - Rancho Palos Verdes CA
Robert F. McClanahan - Valencia CA
Andrew A. Shapiro - Orange CA
Raymond Brown - Fountain Valley CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

H01C 1012

US Classification:

338310

Abstract:

Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.