Richard Chester Ross

Address:

58 Greenbriar Dr, Dallas, PA 18612

VIN:

1FMEU73EX7UB79821

Make:

FORD

Model:

EXPLORER

Year:

2007

US Patent:

7475479, Jan 13, 2009

Filed:

Sep 14, 2006

Appl. No.:

11/520271

Inventors:

Richard J. Ross - Skippack PA, US

International Classification:

B21D 47/00
B23P 11/00

US Classification:

29898, 2952501

Abstract:

A mounting assembly that is used to attach an alternate material railing system to an underlying flat surface. The mounting assembly attaches to the underlying flat surface so that the mounting assembly extends vertically upwardly from the flat surface. A hollow post from the railing system is then placed over the mounting assembly and is attached to the mounting assembly. The mounting assembly therefore acts as an intermediate connector that joins a hollow post to an underlying flat surface. The mounting assembly itself has a base plate and a vertical structure extending upwardly from the base plate. The base plate is attached to the underlying flat surface with a mechanical fastener. The hollow post of the synthetic railing system is placed over the mounting assembly, wherein the vertical structure engages the inside of the hollow post and holds the hollow post in a vertical orientation.

US Patent:

8153474, Apr 10, 2012

Filed:

Oct 13, 2010

Appl. No.:

12/903761

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX

International Classification:

H01L 21/52

US Classification:

438107, 438108, 438118, 438128, 257E215

Abstract:

A method of manufacturing a protected package assembly: providing a protective modular package cover in accordance with a modular design; selectively applying an adhesive to the cross member of each subassembly receiving section of the protective modular package cover that will receive a subassembly to form an adhesive layer of the protective modular package cover; encapsulating the one or more subassemblies in the subassembly receiving sections on the selectively applied adhesive layer to generate a protected package assembly; and controlling application of a distributed downward clamping force applied to the top surfaces of the subassemblies received by the protective modular package cover and useful for mounting the protected package assembly to a core through activation of fastener elements and cross members of the subassembly receiving sections.

US Patent:

8158983, Apr 17, 2012

Filed:

Dec 23, 2008

Appl. No.:

12/317635

Inventors:

Karl W. Beeson - Princeton NJ, US
Scott M. Zimmerman - Basking Ridge NJ, US
William R. Livesay - San Diego CA, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

H01L 33/00
H01L 31/101

US Classification:

257 72, 257 59, 257291, 257432, 257E33005, 257E31054, 257 88

Abstract:

A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.

US Patent:

8283769, Oct 9, 2012

Filed:

Oct 13, 2010

Appl. No.:

12/903734

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX

International Classification:

H01L 21/00

US Classification:

257690, 257692, 257718, 257E21705, 257E23194, 257E23185, 257E23193, 257E33059

Abstract:

A protective modular package cover has first and second fastening sections located at opposing first and second ends with one or more subassembly receiving sections disposed thereto and is configured to fasten the protective modular package cover to a core. Each fastening section has a foot surface located on a bottom surface of a fastening section and configured to make contact with the core, a mounting hole configured to receive a fastener, and a torque element. Each subassembly receiving section is configured to receive a subassembly and has a cross member formed along the underside of the protective modular package cover. Activation of the first torque element transfers a downward clamping force generated at the fastening element to a top surface of one or more subassemblies disposed in the one or more subassembly receiving sections via the cross member of each of the one or more subassembly receiving sections.

US Patent:

8558438, Oct 15, 2013

Filed:

Feb 27, 2009

Appl. No.:

12/380439

Inventors:

Scott M. Zimmerman - Basking Ridge NJ, US
Karl W. Beeson - Princeton NJ, US
William R. Livesay - San Diego CA, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

H01R 11/30
H01R 11/11

US Classification:

313 51, 313485, 313503, 362581

Abstract:

Reflector designs for a large area panel light source create induced draft cooling means adjacent to the panel light source. The panel light source has a wavelength conversion element on a solid state light source for emitting light of a first and second wavelength to form a broader emission spectrum of light from the panel light source.

US Patent:

8560104, Oct 15, 2013

Filed:

Oct 13, 2010

Appl. No.:

12/903772

Inventors:

Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US

Assignee:

STMicroelectronics, Inc. - Coppell TX
RJR Polymers, Inc. - Oakland CA

International Classification:

G06F 19/00

US Classification:

700 98

Abstract:

A method of designing a modular package: determining a package outline of a modular package assembly from package outline design data; determining seating plane and overall package length characteristics of the assembly from seating plane and package length design data; the design tool calculating minimum package height of the modular package assembly from the seating plane and package length design data; designing the dimensions and configuration of one or more subassemblies from subassembly design data; defining dimensions and configuration of a plurality of mechanical layers of a protective modular package cover given the defined package outline, the seating plane, overall package length, the minimum package height, and the subassemblies; defining an adhesive deposition strategy to join mechanical layers of the cover; designing the cover in accordance with the dimensions and configuration of the mechanical layers; and incorporating the assembly and the adhesive deposition strategy into a manufacturing assembly process.

US Patent:

8575641, Nov 5, 2013

Filed:

Aug 10, 2012

Appl. No.:

13/572608

Inventors:

Scott M. Zimmerman - Basking Ridge NJ, US
William R. Livesay - San Diego CA, US
Richard L. Ross - Del Mar CA, US
Eduardo DeAnda - San Diego CA, US

Assignee:

Goldeneye, Inc - San Diego CA

International Classification:

H01L 33/64

US Classification:

257 98, 257E33075

Abstract:

Solid state light sources based on LEDs mounted on or within thermally conductive luminescent elements provide both convective and radiative cooling. Low cost self-cooling solid state light sources can integrate the electrical interconnect of the LEDs and other semiconductor devices. The thermally conductive luminescent element can completely or partially eliminate the need for any additional heatsinking means by efficiently transferring and spreading out the heat generated in LED and luminescent element itself over an area sufficiently large enough such that convective and radiative means can be used to cool the device.

US Patent:

8609470, Dec 17, 2013

Filed:

Apr 16, 2012

Appl. No.:

13/506383

Inventors:

Karl W. Beeson - Princeton NJ, US
Scott M. Zimmerman - Basking Ridge NJ, US
William R. Livesay - San Diego CA, US
Richard L. Ross - Del Mar CA, US

Assignee:

Goldeneye, Inc. - San Diego CA

International Classification:

H01L 21/50
H01L 21/56

US Classification:

438125, 438 26, 438 34, 438 64, 438110, 257E21499, 257E21504

Abstract:

A substrate-free semiconducting sheet has an array of semiconducting elements dispersed in a matrix material. The matrix material is bonded to the edge surfaces of the semiconducting elements and the substrate-free semiconducting sheet is substantially the same thickness as the semiconducting elements.