Robert K Heck

US Patent:

7507256, Mar 24, 2009

Filed:

Dec 14, 2005

Appl. No.:

11/300069

Inventors:

Robert K. Heck - Memphis TN, US
Stephen A. Hazebrouck - Winona Lake IN, US

Assignee:

Depuy Products, Inc. - Warsaw IN

International Classification:

A61F 2/38

US Classification:

623 2015, 623 2242, 623 2324

Abstract:

A modular implant system allows a surgeon to secure an implant assembly to thee diaphysis of a long bone. The system includes a set of anatomically-designed diaphyseal fitting modular implant components. One end of each diaphyseal implant component is a Morse taper post for connection to another implant component such as a modular articular component, a segmental component or an intercalary component. The other end of each diaphyseal component is a tapered porous surface. In some sizes, the tapered porous surface includes a plurality of steps. The tapered porous surface is received with a tapered bore in the bone diaphysis that is prepared to match the size and shape of the tapered porous surface. The diaphyseal implant is easy to insert and remove, does not bind before fully seating, is designed to prevent stress shielding and provides the surgeon with a host of stem options with its modularity.

US Patent:

7867282, Jan 11, 2011

Filed:

Dec 14, 2005

Appl. No.:

11/302571

Inventors:

Robert K. Heck - Memphis TN, US
Stephen A. Hazebrouck - Winona Lake IN, US

Assignee:

Depuy Products, Inc. - Warsaw IN

International Classification:

A61F 2/30
A61F 2/36

US Classification:

623 2346, 623 2036, 623 2242, 623 2315, 623 2321, 606 62, 606 63

Abstract:

A modular implant system includes a set of anatomically-designed diaphyseal fitting and filling modular implant components and adapters for connection to another implant component such as a modular articular component, a segmental component or an intercalary component. The other end of each diaphyseal component is a tapered porous surface. The tapered porous surface is received with a tapered bore in the bone diaphysis that is prepared to match the size and shape of the tapered porous surface. The diaphyseal implant is easy to insert and remove, does not bind before fully seating, and is designed to prevent stress shielding. The diaphyseal sleeve eliminates the long lever arm created when fixation occurs only at the tip of the stem, and should therefore eliminate related stem loosening.

US Patent:

8100982, Jan 24, 2012

Filed:

Dec 14, 2005

Appl. No.:

11/302804

Inventors:

Robert K. Heck - Memphis TN, US
Stephen A. Hazebrouck - Winona Lake IN, US

Assignee:

Depuy Products, Inc. - Warsaw IN

International Classification:

A61F 2/38

US Classification:

623 2035

Abstract:

A modular implant system includes a set of anatomically-designed diaphyseal fitting and filling modular implant components and collars. The diaphyseal component connects with a selected intramedullary stem and with a selected collar component. The collar component connects to another implant component such as a modular articular component, a segmental component or an intercalary component. The diaphyseal component has a tapered porous surface that is received with a tapered bore in the bone diaphysis that is prepared to match the size and shape of the tapered porous surface. The collar component has a porous surface for tissue ingrowth, such as the periosteum, to seal the intramedullary canal. The diaphyseal implant is easy to insert and remove, does not bind before fully seating to prevent stress shielding, and eliminates the long lever arm created when fixation occurs only at the tip of the stem, and should eliminate related stem loosening.