Scott D Carroll

US Patent:

D492575, Jul 6, 2004

Filed:

Dec 16, 2002

Appl. No.:

29/172653

Inventors:

Scott T. Carroll - Lakeside CA
Kenneth E. Wing - Alpine CA
Khoi V. Nguyen - San Diego CA

Assignee:

Hitek Power Corp. - Santee CA

International Classification:

0805

US Classification:

D 8354

US Patent:

D495586, Sep 7, 2004

Filed:

Feb 3, 2004

Appl. No.:

29/198687

Inventors:

Scott T. Carroll - Lakeside CA
Kenneth E. Wing - Alpine CA
Khoi V. Nguyen - San Diego CA

Assignee:

Hitek Power Corp. - Santee CA

International Classification:

0805

US Classification:

D 8354

US Patent:

8564986, Oct 22, 2013

Filed:

Feb 6, 2008

Appl. No.:

12/526034

Inventors:

Kenneth E. Wing - Alpine CA, US
Scott T. Carroll - Lakeside CA, US

International Classification:

H02M 7/10

US Classification:

363 61, 363126

Abstract:

A current mode output control can have a current mode (CM) region of the high voltage output curve (VI) slope controlled by component selection and arrangement in the construction of high voltage power supplies. The controlled CM current slope output, the tapped multiplier feedback network, and the subsequent output voltage correction network, yields a power supply with the desired VM and CM output characteristics that is significantly less expensive to construct and more efficient than a power supply built using conventional construction techniques.

US Patent:

8627563, Jan 14, 2014

Filed:

Feb 6, 2008

Appl. No.:

12/526032

Inventors:

Kenneth E. Wing - Alpine CA, US
Scott T. Carroll - Lakeside CA, US

Assignee:

LHV Power, Inc. - Santee CA

International Classification:

H05K 3/30

US Classification:

29841, 29832, 29846, 439378, 43962015

Abstract:

A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.

US Patent:

20070219932, Sep 20, 2007

Filed:

Mar 14, 2007

Appl. No.:

11/717924

Inventors:

Scott T. Carroll - Lakeside CA, US
Kenneth E. Wing - Alpine CA, US

International Classification:

G01R 21/133

US Classification:

705412

Abstract:

The present invention is directed to a method of providing current energy consumers with a method by which they are able to pay for renewable energy from Cooperative Energy Farms and Virtual Net Metering. Power Output Data is sent to the Ratepayer via Internet. Power Out-put Data is sent to the Utility Company from the Cooperative Energy Farms. This system provides the average power consumer to invest in renewable energy without the prohibitive expense and without having to move their residences to windy or south facing hills for wind turbines or solar energy grids. The privately owned energy generation plots (Cooperative Energy Farm) provides a continuous source of energy sent in to the pre-existing energy grid. This energy would be paid for by largely urban rate payers and would act to provide renewable energy sources without the expense and destructive results of fossil fuel usage.

US Patent:

20070289129, Dec 20, 2007

Filed:

Aug 1, 2005

Appl. No.:

11/659544

Inventors:

Kenneth Wing - Alpine CA, US
Scott Carroll - Lakeside CA, US

International Classification:

H05K 3/30

US Classification:

029855000, 029841000

Abstract:

A method for the selective encapsulation of electronic components on a printed circuit board comprising, in one embodiment, the steps of delivering the printed circuit board to an encapsulating nest at room temperature; damming the target areas with a dam resin having a latent curing agent and deposited in the shape of walls of predetermined heights, according to the desired fill heights; dispensing a fill resin to fill the dammed areas; and curing the dam and fill resins for a suitable amount of time. In a different embodiment, the invention comprises the additional steps of laying resin beads, each in a position corresponding to the footprint of each target component; and of positioning the target components over the beads and soldering the components.

US Patent:

20080248669, Oct 9, 2008

Filed:

Apr 5, 2008

Appl. No.:

12/098424

Inventors:

Kenneth E. Wing - Alpine CA, US
Scott T. Carroll - Lakeside CA, US

International Classification:

H01R 4/60

US Classification:

439207

Abstract:

The present invention is directed to a connector housing for high voltage wires, either single ended or double ended with an integrated connector. Other features of the present invention include integration of a deep recessed high voltage connector contact for an arc and leakage resistant high voltage connection point, use of a female socket pin embedded at the base of the connector. The socket pin is co-molded into the connection end of the body, or it is co-molded or press fitted into a hole at the end of the connector housing.

US Patent:

20100302746, Dec 2, 2010

Filed:

Feb 6, 2008

Appl. No.:

12/526030

Inventors:

Kenneth E. Wing - Alpine CA, US
Scott T. Carroll - Lakeside CA, US

Assignee:

LHV POWER CORPORATION - Santee CA

International Classification:

H05K 7/00
H01R 12/30
H05K 3/00

US Classification:

361760, 439 78, 29829

Abstract:

A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.