Simon K Lu

US Patent:

7187078, Mar 6, 2007

Filed:

Sep 13, 2004

Appl. No.:

10/938594

Inventors:

Tzu-Han Lin - Hsinchu, TW
Huei-Mei Yu - Hsinchu, TW
Chia-Jen Cheng - Taoyuan, TW
Chun-Yen Lo - Taichung, TW
Li-Hsin Tseng - Taichung, TW
Boe Su - Chiayi, TW
Simon Lu - Belmont CA, US

Assignee:

Taiwan Semiconductor Manufacturing Co. Ltd. - Hsin-Chu

International Classification:

H01L 29/40

US Classification:

257748, 438614, 438615

Abstract:

Solder bump structures for semiconductor device packaging is provided. In one embodiment, a solder bump structure comprises a semiconductor substrate, the substrate has at least one contact pad and an upper passivation layer having at least one opening formed therein exposing a portion of the contact pad. At least one patterned and etched polymer layer is formed on a portion of the contact pad. At least one patterned and etched conductive metal layer is formed above the polymer layer and is aligned therewith. And at least one layer of solder material having a solder height is provided above the conductive metal layer, the layer of solder is aligned with the conductive metal layer, the layer of solder is thereafter reflown thereby creating a solder ball.

US Patent:

62822055, Aug 28, 2001

Filed:

Sep 2, 1997

Appl. No.:

8/922082

Inventors:

Simon Lu - Rowland Heights CA

International Classification:

H04L 1228
G06F 1126

US Classification:

370465

Abstract:

A digital central control unit is connected in a master/slave relationship to a plurality of audio, video, and data components, at least one of which may be an analog component. A decoder digital-to-analog unit is positioned at the input of all analog components so that signals transmitted to them from the central control unit are not decoded and converted to analog signals until after the transmission has been completed. An encoder analog-to-digital unit for converting analog signals to digital signals is positioned at the output of each analog component so that their respective analog signals are in encoded digital format when being transmitted to the central control unit. The network is thus all-digital and is therefore not subject to the limitations of networks having analog transmission lines.

US Patent:

54328640, Jul 11, 1995

Filed:

Oct 5, 1992

Appl. No.:

7/956180

Inventors:

Daozheng Lu - Dunedin FL
Simon W. Lu - Los Angeles CA

International Classification:

G06K 946

US Classification:

382118

Abstract:

The present invention provides apparatus and method for verifying the identity of a person by comparing that person's face (or selected facial features) with an image generated using data stored on an identification card, badge, tag or other escort memory carried by the person. Both automatic and manual verification apparatus are disclosed, and both employ principal component methods that reduce the amount of data required to be carried by the bearer to under 100 bytes. The process of verifying identity involves combining data from the small escort memory with other image-related data that are general in nature and that are stored at the verification location. The system of the present invention is expected to find use in a wide variety of cases where a person's identity is to be established (e. g. by a retail customer using a credit card, by a traffic officer who needs to verify the identity noted on a driver's license, by an industrial security system that regulates the access by selected personnel into a secure area of a plant or business, or by a customer of an automatic teller machine. ).