Stephanie S Chen

US Patent:

8000905, Aug 16, 2011

Filed:

Sep 14, 2007

Appl. No.:

11/855589

Inventors:

Stephanie Chen - Fremont CA, US
Subramanian Balakrishnan - Cupertino CA, US
Richard Wallingford - San Jose CA, US

Assignee:

KLA-Tencor Technologies Corp. - Milpitas CA

International Classification:

G01B 5/28

US Classification:

702 35

Abstract:

Computer-implemented methods, carrier media, and systems for determining sizes of defects detected on a wafer are provided. One computer-implemented method includes separating the defects into groups based on output acquired for the defects by multiple channels of an inspection system used to detect the defects on the wafer. The method also includes separating the defects in one or more of the groups into subgroups based on the output acquired for the defects by one or more of the multiple channels. In addition, the method includes determining the sizes of one or more of the defects in one or more of the subgroups separately based on the output acquired for the defects by only one of the multiple channels and a calibration parameter. The calibration parameter is different for each of the subgroups and is acquired by using another system to measure actual sizes of defects detected on other wafers.

US Patent:

8000922, Aug 16, 2011

Filed:

May 29, 2008

Appl. No.:

12/128979

Inventors:

Hong Chen - San Ramon CA, US
Michael J. Van Riet - Morgan Hill CA, US
Jason Z. Lin - Saratoga CA, US
Chris Maher - Campbell CA, US
Michal Kowalski - Santa Cruz CA, US
Barry Becker - San Jose CA, US
Stephanie Chen - Fremont CA, US
Subramanian Balakrishnan - Cupertino CA, US
Suryanarayana Tummala - Andhra Pradesh, IN

Assignee:

KLA-Tencor Corp. - San Jose CA

International Classification:

H01L 21/66

US Classification:

702123, 702127, 702155, 702134, 378137, 3562374, 3562375

Abstract:

Methods and systems for generating information to be used for selecting values for parameter(s) of a detection algorithm are provided. One method includes without user intervention performing a scan of an area of a wafer using an inspection system and default values for parameter(s) of a detection algorithm to detect defects on the wafer. The method also includes selecting a portion of the defects from results of the scan based on a predetermined maximum number of total defects to be used for selecting values for the parameter(s) of the detection algorithm. The method further includes storing information, which includes values for the parameter(s) of the detection algorithm determined for the defects in the portion. The information can be used to select the values for the parameter(s) of the detection algorithm to be used for the inspection recipe without performing an additional scan of the wafer subsequent to the scan.

US Patent:

20130035876, Feb 7, 2013

Filed:

Aug 2, 2011

Appl. No.:

13/196758

Inventors:

Junqing Huang - Fremont CA, US
Yong Zhang - Cupertino CA, US
Stephanie Chen - Fremont CA, US
Tao Luo - Fremont CA, US
Lisheng Gao - Morgan Hill CA, US
Richard Wallingford - San Jose CA, US

Assignee:

KLA-TENCOR CORPORATION - Milpitas CA

International Classification:

G01N 21/88
G06F 19/00

US Classification:

702 40

Abstract:

Methods and systems for detecting defects on a wafer are provided.

US Patent:

20200258137, Aug 13, 2020

Filed:

Feb 8, 2019

Appl. No.:

16/271596

Inventors:

- George Town, KY
Chen ZHAO - San Mateo CA, US
Stephanie CHEN - San Mateo CA, US
Jackson HUANG - San Mateo CA, US

International Classification:

G06Q 30/06

Abstract:

The present disclosure provides an apparatus for content recommendations. The apparatus includes one or more storage devices that store a set of instructions, and one or more processors configured to execute the set of instructions to cause the apparatus to receive a selection of a first item via a user interface, determine, based on a first stored relationship, scent data associated with the selected first item, determine, based on a second stored relationship, theme data corresponding to the determined scent data, select a set of second items using the determined theme data, and generate content to be displayed in the user interface. The content includes the first item and the selected set of second items and is displayed in a manner associated with the determined theme data.

US Patent:

20150178907, Jun 25, 2015

Filed:

Dec 8, 2014

Appl. No.:

14/563845

Inventors:

- Milpitas CA, US
Tao Luo - Fremont CA, US
Chaohong Wu - Mountain View CA, US
Stephanie Chen - Fremont CA, US
Lisheng Gao - Morgan Hill CA, US

International Classification:

G06T 7/00

Abstract:

Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.