Stephen Gilbert - San Francisco CA, US Kaushal Singh - Santa Clara CA, US Sanjeev Aggarwal - Plano TX, US Stevan Hunter - Fort Collins CO, US
International Classification:
C23C016/00 B05D005/12
US Classification:
427/255280, 427/126300
Abstract:
Improved methods of forming PZT thin films that are compatible with industry-standard chemical vapor deposition production techniques are described. These methods enable PZT thin films having thicknesses of 70 nm or less to be fabricated with high within-wafer uniformity, high throughput and at a relatively low deposition temperature. In one aspect, a source reagent solution comprising a mixture of a lead precursor, a titanium precursor and a zirconium precursor in a solvent medium is provided. The source reagent solution is vaporized to form a precursor vapor. The precursor vapor is introduced into a chemical vapor deposition chamber containing the substrate. In another aspect, before deposition, the substrate is preheated during a preheating period. After the preheating period, the substrate is disposed on a heated susceptor during a heating period, after which a PZT film is formed on the heated substrate.
Method For Forming A Paraelectric Semiconductor Device
Stephen Gilbert - San Francisco CA, US Sanjeev Aggarwal - Plano TX, US Scott Summerfelt - Garland TX, US Stevan Hunter - Fort Collins CO, US
International Classification:
H01L021/00 H01L021/8242 H01L021/31 H01L021/469
US Classification:
438/003000, 438/778000, 438/785000, 438/240000
Abstract:
A method is provided for forming a paraelectric semiconductor device by depositing a seed layer on an oxide electrode using a paraelectric material precursor and depositing a paraelectric layer on the seed layer using the paraelectric material precursor.