Steven M Summers

US Patent:

20050194961, Sep 8, 2005

Filed:

Mar 4, 2004

Appl. No.:

10/793366

Inventors:

Steven Summers - Hudson NH, US
Thomas Horgan - Rowley MA, US

International Classification:

H01Q013/10
G01R027/00

US Classification:

324095000

Abstract:

A method and apparatus for substantially reducing the problems associated with prior methods and apparatus for measuring the RF characteristics of electronic circuitry. The method and apparatus allow “in-package” testing of microwave modules, or subassemblies, without the need for additional test fixtures. Preferably, the testing is based on a discontinuous transmission line and at least one waveguide. The discontinuous transmission line electrically isolates two or more modules so that they may be tested individually. The discontinuous transmission line may then be connected using, for example, a ribbon bond. Once the transmission line is connected, the two modules may be capable of communicating with one another. One advantage of the method and apparatus is that the RF characteristics of one or more modules may be determined in their actual operating environment. Another advantage is that there is substantially little detrimental affect on the performance of the modules and the overall circuit due to the discontinuous transmission line or waveguides.