Sung A Lee

US Patent:

7023066, Apr 4, 2006

Filed:

Nov 20, 2001

Appl. No.:

09/989513

Inventors:

Sung Bok Lee - Chicago IL, US
Peter V. Loeppert - Hoffman Estates IL, US

Assignee:

Knowles Electronics, LLC. - Itasca IL

International Classification:

H01L 29/82

US Classification:

257415, 438 53

Abstract:

A solid-state transducer is disclosed. The transducer comprises a semi-conductor substrate forming a support structure and having an opening. A thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure is disposed over the opening. The transducer further includes a plurality of semi-conductor supports and tangential arms extending from the diaphragm edge for connecting the periphery of the diaphragm to the supports. The tangential arms permit the diaphragm to rotate relative to the supports to relieve film stress in the diaphragm. The transducer still further includes a plurality of stop bumps disposed between the substrate and the diaphragm. The stop bumps determine the separation of the diaphragm from the substrate when the transducer is biased.

US Patent:

D690183, Sep 24, 2013

Filed:

Jun 19, 2012

Appl. No.:

29/424992

Inventors:

Sung K. Lee - Glenview IL, US

International Classification:

0806

US Classification:

D 8107

US Patent:

20080142475, Jun 19, 2008

Filed:

Dec 15, 2006

Appl. No.:

11/611633

Inventors:

Peter V. Loeppert - Hoffmann Estates IL, US
Anthony Minervini - Palos Hills IL, US
Jay Cech - St. Charles IL, US
Sung B. Lee - Chicago IL, US

Assignee:

KNOWLES ELECTRONICS, LLC - Itasca IL

International Classification:

C30B 33/08

US Classification:

216 23, 216 87

Abstract:

A directed energy source is applied to a portion of a material, creating at least one altered region and leaving at least one unaltered region. The material is exposed to an etchant which removes the at least one altered region leaving substantially all of the unaltered region.

US Patent:

20080248170, Oct 9, 2008

Filed:

Apr 9, 2007

Appl. No.:

11/784585

Inventors:

Sung So Lee - Los Angeles CA, US

International Classification:

A23G 3/50

US Classification:

426110

Abstract:

A toy candy stick is provided. The candy stick according to current application is comprised of a holding ring and a cross-guard plate. A stick candy is engaged to the center of a face of the cross-guard plate. Various kind of engaging grooves are formed at the center of the face thereon, on the opposite side of the holding ring. The cross-guard plate prevents the candy from sucked into user's mouth and chuck the user's neck by accident. The holding ring provides a more solid grip of the candy.

US Patent:

20120144964, Jun 14, 2012

Filed:

Dec 14, 2011

Appl. No.:

13/326224

Inventors:

Sung K. Lee - Glenview IL, US

International Classification:

B25G 1/10

US Classification:

81489

Abstract:

A tool handle including: a body configured to receive a handle of a tool; a hand grip extending approximately perpendicular from the body; and an arm ring rotatably disposed on the body, wherein the arm ring is adapted to be placed in at least two positions, a first position in which the arm ring is generally perpendicular to the hand grip such that a user may place the user's forearm through the arm ring to grasp the hand grip and a second position in which the arm ring is generally parallel to the hand grip so as to minimize the width of the tool handle.

US Patent:

20130075836, Mar 28, 2013

Filed:

Sep 20, 2012

Appl. No.:

13/623598

Inventors:

KNOWLES ELECTRONICS, LLC - Itasca IL, US
Sung Bok Lee - Chicago IL, US

Assignee:

KNOWLES ELECTRONICS, LLC - Itasca IL

International Classification:

H01L 29/84

US Classification:

257416, 257E29324

Abstract:

A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external environment. The MEMS die is disposed on the base and over the opening. The MEMS die includes a diaphragm and a back plate and the MEMS die, the base, and the housing form a back volume. At least one vent extends through the MEMS die and not through the diaphragm. The at least one vent communicates with the back volume and the port opening and is configured to allow venting between the back volume and the external environment.

US Patent:

54923190, Feb 20, 1996

Filed:

Oct 11, 1994

Appl. No.:

8/327003

Inventors:

Sung C. Lee - Wheeling IL

International Classification:

A63B 6936

US Classification:

273181F

Abstract:

An indoor golf chip shot practice apparatus which is to be used for practicing chip shots in the game of golf. The apparatus comprises a rectangular prism shape safety net with only one opening to the side of the user, therefore, the golf ball stays inside of the safety net even in case of bad shots. The apparatus also comprises a frame to support and encompass the safety net and is designed in such a way that the golf ball rolls back on the floor of the safety net to the user after each shot.

US Patent:

59496509, Sep 7, 1999

Filed:

Sep 2, 1998

Appl. No.:

9/145847

Inventors:

Roderick A. Bulante - Torrance CA
Gary L. Duncan - Torrance CA
Troy A. Conwell - Hawthrorne CA
Dennis Quan - South Pasadena CA
John P. Stafford - Yorba Linda CA
Sung H. Lee - Valencia CA

Assignee:

Hughes Electronics Corporation - El Segundo CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

A heat sink board structure includes a thermal/structural base having a composite core layer of a mass of graphitized carbon fibers infiltrated with a first resin material matrix. The graphitized carbon fibers of the composite core are substantially unidirectional and oriented parallel to the face of the composite core layer. Transverse reinforcement layers are bonded to the oppositely disposed faces of the composite core layer. Each transverse reinforcement layer is formed of carbon fibers embedded in a resin material matrix, with the carbon fibers lying substantially in a plane of the transverse reinforcement layer and perpendicular to the carbon fibers in the composite layer. Heat generating and heat dissipating components are bonded to the thermal/structural base. Metallic contact strips are bonded to the surfaces of the transverse reinforcement layers.