Suzanne Y Wong

US Patent:

7367836, May 6, 2008

Filed:

Jul 13, 2004

Appl. No.:

10/889804

Inventors:

Henry Wong - Tempe AZ, US
Suzanne M. Wong - Tempe AZ, US

Assignee:

Emerson Network Power-Embedded Computing, Inc. - Madison WI

International Classification:

H01R 13/64

US Classification:

439378

Abstract:

A rear transition module () includes a connector () in an RP0 mechanical envelope (), and an RTM alignment and keying mechanism () in the RP0 mechanical envelope of the rear transition module that uniquely corresponds to a first signal path configuration () in a corresponding connector () on a backplane () of a VXS multi-service platform system chassis (), where the rear transition module is coupled to operate within the VXS multi-service platform system chassis having a VMEbus network () and a switched fabric () coincident on the backplane.

US Patent:

20030058600, Mar 27, 2003

Filed:

Sep 21, 2001

Appl. No.:

09/957999

Inventors:

Thomas Bertram - Phoenix AZ, US
Patrick Richardson - Tempe AZ, US
Suzanne Wong - Tempe AZ, US

International Classification:

H02H009/06

US Classification:

361/117000

Abstract:

An apparatus including a front panel () and a bezel () coupled to the front panel () and having a gasket (), where the gasket () is affixed to the bezel () and electrically couples the bezel () to the front panel (). Bezel () can be a mezzanine card bezel, a common mezzanine card bezel, and the like. A method of electrically coupling a front panel () to a bezel () includes providing a front panel () having an inner surface () defining a cut-out (). Also, providing a bezel () having a perimeter (), where the inner surface () of the cut-out () is designed to receive the bezel (). Affixing a gasket () to the perimeter () of bezel () an the inner surface () receiving the bezel () where the gasket () is designed to be coupled to the inner surface (), and electrically coupling the bezel () to the front panel () through the gasket ().

US Patent:

20030067757, Apr 10, 2003

Filed:

Oct 5, 2001

Appl. No.:

09/972393

Inventors:

Patrick Richardson - Tempe AZ, US
Suzanne Wong - Tempe AZ, US

International Classification:

H05K007/14
H05K007/18

US Classification:

361/799000

Abstract:

An apparatus for shield a device () includes a surface () where the device () is coupled to the surface () and the device produces electromagnetic energy (). At least one grounded pad () is coupled to the surface () and a finger stock () is removably coupled to the grounded pad (). A conductive heat sink () is coupled to the finger stock (), where the conductive heat sink () operates to shield the electromagnetic energy () produced by the device (). A method of shielding electromagnetic energy () includes placing at least one grounded pad () on a surface () and removably coupling a finger stock () to the grounded pad (). Thereafter, coupling a conductive heat sink () to the finger stock () so that the finger stock () restorably compresses such that the conductive heat sink () couples to the device ().

US Patent:

20080207064, Aug 28, 2008

Filed:

May 5, 2008

Appl. No.:

12/115162

Inventors:

Henry Wong - Tempe AZ, US
Suzanne M. Wong - Tempe AZ, US

Assignee:

EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC. - Madison WI

International Classification:

H01R 13/46
H01R 9/24

US Classification:

439884

Abstract:

A rear transition module () includes a connector () in an RP0 mechanical envelope (), and an RTM alignment and keying mechanism () in the RP0 mechanical envelope of the rear transition module that uniquely corresponds to a first signal path configuration () in a corresponding connector () on a backplane () of a VXS multi-service platform system chassis (), where the rear transition module is coupled to operate within the VXS multi-service platform system chassis having a VMEbus network () and a switched fabric () coincident on the backplane.

US Patent:

20150070848, Mar 12, 2015

Filed:

Sep 11, 2013

Appl. No.:

14/023521

Inventors:

- Tempe AZ, US
Suzanne Marye WONG - Tempe AZ, US

Assignee:

EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC. - Tempe AZ

International Classification:

H05K 7/20

US Classification:

361720

Abstract:

A circuit board assembly for installation in a cabinet includes a first standards based size first mounting frame portion having a PCB mounted thereto. A second mounting frame portion is connected to the first mounting frame portion having no portion of the PCB connected thereto. A combination size of the first and second mounting frames defines a larger second standards based size. Multiple heat transfer components may be connected to the first or second mounting frame portion provide a conduction/convection cooling path. The first mounting frame portion may include a first false board edge and the second mounting frame portion includes one or more false board edge(s) positioned laterally and oppositely directed to the first false board edge. The first and second false board edges are slidably received in opposed slots created in a cabinet.