Thomas Patrick Myers

US Patent:

53360664, Aug 9, 1994

Filed:

Dec 2, 1992

Appl. No.:

7/984985

Inventors:

Thomas M. Myers - Austin TX
James R. Mensing - Austin TX

International Classification:

F04B 3910

US Classification:

4175551

Abstract:

A balloon pump includes a cylinder having an outlet end and a piston adapted to reciprocate within the cylinder. One-way outlet and inlet valves are associated with the pump for allowing air to exit the cylinder outlet end only when the piston moves toward the outlet end and enter the cylinder only when the piston reciprocates away from the cylinder outlet end. An elongated piston drive member or base is connected at one end to the piston with the other end extending out of the cylinder at the end opposite the cylinder outlet end. A biasing arrangement acts between the cylinder and the piston to bias the piston away from the outlet end of the cylinder. With the pump positioned vertically and supported on the elongated piston drive member, the biasing arrangement raises the cylinder to perform a return stroke so that the pump may be operated simply by pushing down on the cylinder.

US Patent:

51227533, Jun 16, 1992

Filed:

Dec 20, 1990

Appl. No.:

7/631111

Inventors:

Thomas K. Myers - Austin TX
John D. Ferguson - San Diego CA

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

G01R 3102

US Classification:

324537

Abstract:

A method of testing electrical circuits on a substrate for detecting shorts and opens. A plurality of electrical networks in which each network has one or more nodes are tested by selectively electrically charging certain nodes and selectively testing other nodes for detecting shorts and opens between the nodes. The method of testing allows various levels of testing to be performed for detecting more and greater different kinds of possible defects.

US Patent:

D3224716, Dec 17, 1991

Filed:

Oct 19, 1989

Appl. No.:

7/424147

Inventors:

Thomas M. Myers - Austin TX

US Classification:

D23231

US Patent:

51986124, Mar 30, 1993

Filed:

Apr 15, 1991

Appl. No.:

7/684996

Inventors:

Thomas R. Myers - Austin TX

Assignee:

Tracor Aerospace, Inc. - Austin TX

International Classification:

F42C 2100

US Classification:

102293

Abstract:

An electronic countermeasure (ECM) simulator which fits into the housing of any actual ECM payload device and substitutes electrical components for the chaff, flares or other countermeasures which are emitted into the environment. The ECM payload simulator electrically verifies firing ability for any ECM dispensing system using a magnetic indicator which sets when the electrical signal required to fire an actual ECM payload device operates properly. The magnetic indicator can be viewed, tested and reset by a ground crew upon return of the aircraft to ground. The magnetic indicator has a parallel resistor so that the aircraft's arsenal inventorying device will indicate an unfired ECM payload device. An optional radio frequency (RF) transmitter may be substituted for the magnetic indicator to send coded transmissions to a radar site while in flight. Additionally, an electrical circuit may be added to measure amplitude and duration of the electrical firing signal and to prevent feedback into the ECM dispensing system.

US Patent:

51929139, Mar 9, 1993

Filed:

Mar 16, 1992

Appl. No.:

7/851716

Inventors:

Rama R. Goruganthu - Austin TX
Thomas K. Myers - Austin TX
Andrew W. Ross - Austin TX

Assignee:

Microelectronics and Computer Technology Corporation - Austin TX

International Classification:

G01R 3100

US Classification:

324537

Abstract:

A method of electrically testing an electrical component containing a plurality of networks with at least one node. The method uses segmented, charge limiting testing to charge the nodes and detect shorted or disconnected nodes while preventing accumulated charges in the networks from making uncharged nodes appear charged. The method is well suited for voltage contrast electron beam testing of unpopulated high density multichip modules and interconnect substrates.