Timothy F Compton

US Patent:

6893476, May 17, 2005

Filed:

Dec 9, 2002

Appl. No.:

10/315398

Inventors:

Junaid Ahmed Siddiqui - Richmond VA, US
Timothy Frederick Compton - Casa Grande AZ, US

Assignee:

DuPont Air Products Nanomaterials LLC - Tempe AZ

International Classification:

C09G001/02
C09G001/04

US Classification:

51307, 51308, 51309, 51298, 106 3, 106 11

Abstract:

A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods for chemical mechanical planarization are disclosed. In one method (Method A), the CMP slurry composition employed in the method comprises comprise an abrasive and a dispersed hybrid organic/inorganic particle. In another method (Method B), the CMP slurry composition employed in the method comprises comprise an abrasive and an alkyne compound. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated methods (A and B) for metal CMP applications (e. g. , tungsten CMP).

US Patent:

7153335, Dec 26, 2006

Filed:

Oct 10, 2003

Appl. No.:

10/683232

Inventors:

Junaid Ahmed Siddiqui - Richmond VA, US
Timothy Frederick Compton - Casa Grande AZ, US
Bin Hu - Chandler AZ, US
Robin Edward Richards - Phoenix AZ, US

Assignee:

Dupont Air Products Nanomaterials LLC - Tempe AZ

International Classification:

C09G 1/02
C09G 1/04
C09K 13/14
B24B 1/00

US Classification:

51307, 51309, 106 3, 106 11, 438692, 438693, 252 791, 252 794

Abstract:

A composition and associated method for chemical mechanical planarization (or other polishing) are described which afford high tantalum to copper selectivity in copper CMP and which are tunable (in relation to polishing performance). The composition comprises an abrasive and an N-acyl-N-hydrocarbonoxyalkyl aspartic acid compound and/or a tolyltriazole derivative.

US Patent:

7247179, Jul 24, 2007

Filed:

Aug 9, 2004

Appl. No.:

10/914113

Inventors:

Junaid Ahmed Siddiqui - Richmond VA, US
Timothy Frederick Compton - Casa Grande AZ, US

Assignee:

DuPont Air Products Nanomaterials LLD - Tempe AZ

International Classification:

C09G 1/02
C09G 1/04

US Classification:

51307, 51308, 51309, 51298, 106 3, 106 11

Abstract:

A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods for chemical mechanical planarization are disclosed. In one method (Method A), the CMP slurry composition employed in the method comprises comprise an abrasive and a dispersed hybrid organic/inorganic particle. In another method (Method B), the CMP slurry composition employed in the method comprises comprise an abrasive and an alkyne compound. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated methods (A and B) for metal CMP applications (e. g. , tungsten CMP).

US Patent:

7316977, Jan 8, 2008

Filed:

Aug 23, 2006

Appl. No.:

11/508427

Inventors:

Junaid Ahmed Siddiqui - Richmond VA, US
Timothy Frederick Compton - Casa Grande AZ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

H01L 21/302
H01L 21/461
C11D 7/32
C09K 13/00

US Classification:

438693, 438690, 438692, 510175, 252 791

Abstract:

A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a ketoxime compound and water. The composition may also contain an abrasive and/or a per compound oxidizing agent. The composition affords tunability of removal rates for metal, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e. g. , step 2 copper CMP processes).

US Patent:

7351662, Apr 1, 2008

Filed:

Sep 22, 2005

Appl. No.:

11/233110

Inventors:

Junaid Ahmed Siddiqui - Richmond VA, US
Robin Edward Richards - Phoenix AZ, US
Timothy Frederick Compton - Casa Grande AZ, US

Assignee:

DuPont Air Products Nanomaterials LLC - Tempe AZ

International Classification:

H01L 21/302

US Classification:

438690, 438691, 438692, 252 795

Abstract:

A low solids-content slurry for polishing (e. g. , chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishing even though the slurry has low solids-content. The slurry comprises a bicarbonate salt, which acts as a catalyst for increasing removal rates of dielectric films during polishing of these substrates.

US Patent:

7514363, Apr 7, 2009

Filed:

Aug 29, 2005

Appl. No.:

11/212628

Inventors:

Gautam Banerjee - Chandler AZ, US
Timothy Frederick Compton - Casa Grande AZ, US
Junaid Ahmed Siddiqui - Richmond VA, US
Ajoy Zutshi - Chandler AZ, US

Assignee:

DuPont Air Products NanoMaterials LLC - Tempe AZ

International Classification:

H01L 21/302
H01L 21/461

US Classification:

438692, 438691, 438693, 252 792, 252 794

Abstract:

A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, benzenesulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords tunability of removal rates for metal, barrier layer materials, and dielectric layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e. g. , step 2 copper CMP processes).

US Patent:

7678702, Mar 16, 2010

Filed:

Aug 24, 2006

Appl. No.:

11/509223

Inventors:

Timothy Frederick Compton - Casa Grande AZ, US
Junaid Ahmed Siddiqui - Richmond VA, US
Ajoy Zutshi - Chandler AZ, US

Assignee:

Air Products and Chemicals, Inc. - Allentown PA

International Classification:

H01L 21/302
H01L 21/461

US Classification:

438691, 438692, 438693, 438695, 257E2123, 257E21304

Abstract:

A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains a boron surface-modified abrasive, a nitro-substituted sulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords high removal rates for barrier layer materials in metal CMP processes. The composition is particularly useful in conjunction with the associated method for metal CMP applications (e. g. , step 2 copper CMP processes).

US Patent:

7691287, Apr 6, 2010

Filed:

Jan 31, 2007

Appl. No.:

11/700526

Inventors:

Junaid Ahmed Siddiqui - Richmond VA, US
Timothy Frederick Compton - Casa Grande AZ, US
Robin Edward Richards - Tucson AZ, US

Assignee:

DuPont Air Products NanoMaterials LLC - Allentown PA

International Classification:

C09K 13/00

US Classification:

252 791, 438692

Abstract:

A method of polishing a substrate with a polishing composition comprising an oxidizing agent and abrasive particles having a surface, said surface of the abrasive particles being at least partially modified with 1) at least one stabilizer compound comprising aluminum, boron, tungsten, or both, said stabilizer compound being bound via a covalent bond to said abrasive particles, and 2) an organic chelating compound, said chelating compound being bound via a covalent bond to said stabilizer compound. The organic chelating compounds include one or more of 1) a nitrogen-containing moiety and between one and five other polar groups; 2) a sulfur-containing moiety and between one and five other polar groups; and 3) between two and five polar groups selected from carboxylic acid groups or salts thereof and hydroxyl groups.