Wayne Howell

US Patent:

58698965, Feb 9, 1999

Filed:

Feb 26, 1998

Appl. No.:

/031019

Inventors:

Robert Grover Baker - Delray Beach FL
Claude Louis Bertin - South Berlington VT
Wayne John Howell - Williston VT
Joseph Michael Mosley - Boca Raton FL

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2334
H01L 2302

US Classification:

257724

Abstract:

An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e. g. , CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e. g. , multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

US Patent:

59071788, May 25, 1999

Filed:

Feb 26, 1998

Appl. No.:

9/031028

Inventors:

Robert Grover Baker - Delray Beach FL
Claude Louis Bertin - South Burlington VT
Wayne John Howell - Williston VT
Joseph Michael Mosley - Boca Raton FL

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2302
H01L 2334

US Classification:

257433

Abstract:

An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e. g. , CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e. g. , multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.

US Patent:

57639434, Jun 9, 1998

Filed:

Jan 29, 1996

Appl. No.:

8/592933

Inventors:

Robert Grover Baker - Delray Beach FL
Claude Louis Bertin - South Burlington VT
Wayne John Howell - Williston VT
Joseph Michael Mosley - Boca Raton FL

Assignee:

International Business Machines Corporation

International Classification:

H01L 2302
H01L 2334

US Classification:

257686

Abstract:

An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e. g. , CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e. g. , multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.