William J Bond

US Patent:

6738736, May 18, 2004

Filed:

Oct 6, 2000

Appl. No.:

09/684154

Inventors:

William C. Bond - Kildeer IL

Assignee:

Accenture LLP - Palo Alto CA

International Classification:

G06F 760

US Classification:

703 2, 700100, 709 4

Abstract:

A method for providing an estimate for building a capacity modeling and planning function in an information technology organization includes conducting the tasks involved in building the capacity modeling and planning function. The tasks include the planning, analyzing, designing, building, testing, and deploying the capacity modeling and planning function. Each task includes process, organization, and technology infrastructure elements.

US Patent:

7031158, Apr 18, 2006

Filed:

Oct 29, 2003

Appl. No.:

10/695712

Inventors:

Eduardo Leon - Lisle IL, US
Walter Harwood - Streamwood IL, US
William Bond - Cary IL, US
Frank Hernandez - Schaumburg IL, US
Avinash K. Vaidya - Riverwoods IL, US

Assignee:

Charles Industries, Ltd. - Rolling Meadows IL

International Classification:

H05K 7/20

US Classification:

361700, 16510433, 174 151, 361690, 361703

Abstract:

An enclosure for electronic components is provided. The enclosure includes an electronics housing that has at least one slot for receiving one or more electronic components. The slot is defined by a plurality of walls. A heat pipe thermal management system is associated with the slot. The heat pipe system includes a heat pipe having a first portion embedded into one of the walls defining the slot for conducting heat from the wall to a second portion of the heat pipe extending out of the electronics housing. At least one cooling fin is carried by the second portion of the heat pipe such that heat from the heat pipe is conducted into the fin and the fin dissipates the heat to the ambient atmosphere outside of the electronics housing.