William B Shepherd

US Patent:

44159536, Nov 15, 1983

Filed:

Jul 13, 1981

Appl. No.:

6/282397

Inventors:

William C. Shepherd - San Dimas CA

International Classification:

F21V 704

US Classification:

362 32

Abstract:

A tree-simulating illuminated decorative device, which includes an upper frame member, a plurality of light-conducting rod shaped elements having first axial extremities carried on an upper frame member, a lamp mounted proximate to the upper frame member for illuminating the first axial extremity of each of the rod shaped elements, and a plurality of sprays of optic fibers. A spray is in light communicating relationship with each of the rod shaped elements. In another form of the invention a tree-simulating illuminated decorative device includes an upper frame member and a plurality of light-conducting bough members, each having a first axial extremity fixed to the upper frame member. The locus of the connections between each of the light-conducting bough elements and the upper frame members may be a circle. The light-conducting elements may extend both downwardly and radially outwardly from the upper frame member.

US Patent:

59060433, May 25, 1999

Filed:

Jun 30, 1997

Appl. No.:

8/884823

Inventors:

James J. D. Lan - Fremont CA
Steve S. Chiang - Saratoga CA
William H. Shepherd - Placitas NM
Paul Y. F. Wu - San Jose CA

Assignee:

Prolinx Labs Corporation - San Jose CA

International Classification:

H01K 310

US Classification:

29852

Abstract:

In one embodiment, the steps for forming an electrical conductor between conductive layers of a printed circuit board include the following steps: (1) applying a first dielectric material on a first conductive layer; (2) forming a number of via holes at each of the predetermined locations in the first dielectric material at which an electrical conductor is to be formed; (3) selectively applying a second dielectric material to at least fill each of the via holes, to form a composite dielectric layer; (4) applying a second conductive layer on the composite dielectric layer; (5) etching the first conductive layer to form a first electrode; (6) etching the second conductive layer to form a second electrode; and (7) applying a programming voltage across the second dielectric material in each of the via holes to form an electrical conductor in each of the via holes, each electrical conductor connecting an electrode in the first conductive layer to an electrode in the second conductive layer.

US Patent:

43353002, Jun 15, 1982

Filed:

Aug 27, 1980

Appl. No.:

6/181867

Inventors:

William C. Shepherd - San Dimas CA

International Classification:

G06C 100

US Classification:

235123

Abstract:

Apparatus for recording and visually indicating the consumption of nutrients which includes a frame having first and second elongated members disposed in spaced relationship and a plurality of wires intermediate the first and second members which are in generally mutually parallel relationship. A plurality of beads is carried on each of the wires and a blocking member is provided for constraining the beads on each wire from moving past an arbitrary line defining first and second axial sections of each of the wires. The frame includes members disposed in generally rectangular relationship, and the first and second members of the frame may be disposed in generally parallel relationship. The frame may include a box having a hinged cover.

US Patent:

59628154, Oct 5, 1999

Filed:

Jan 18, 1995

Appl. No.:

8/374941

Inventors:

James J. D. Lan - Fremont CA
Steve S. Chiang - Saratoga CA
William H. Shepherd - Placitas NM
Paul Y. F. Wu - San Jose CA

Assignee:

Prolinx Labs Corporation - San Jose CA

International Classification:

H01R 909

US Classification:

174262

Abstract:

A multilayered structure, such as a printed circuit board, includes a first conductive layer and a second conductive layer that are separated from each other by a dielectric layer. The dielectric layer is formed of a first material, such as a photoimagible polyimide and epoxy resin. The dielectric layer has a number of via holes that extend from the first conductive layer to the second conductive layer. The via holes are filled with a second material having a breakdown voltage less than a breakdown voltage of the first material included in the dielectric layer to form an antifuse. The second material in the via holes can be, for example, a conductive epoxy resin or a polymer loaded with conductive particles (also referred to as "conductive paste").

US Patent:

59060425, May 25, 1999

Filed:

Oct 4, 1995

Appl. No.:

8/538886

Inventors:

James J. D. Lan - Fremont CA
Steve S. Chiang - Saratoga CA
William H. Shepherd - Placitas NM
Paul Y. F. Wu - San Jose CA
John Y. Xie - San Jose CA

Assignee:

Prolinx Labs Corporation - San Jose CA

International Classification:

H01K 310

US Classification:

29852

Abstract:

A micro filled material includes a binding material and optionally includes a number of particles. The binding material and the particles can be formed of any conductive or nonconductive material. Using such a micro filled via material, an electrical conductor is formed in a substrate for supporting one or more electronic components using the following steps: placing the micro filled via material between two conductive layers at various locations in a substrate at which an electrical conductor is to be formed; and optionally programming the micro filled via material to reduce the resistance of, or to form an electrical conductor.

US Patent:

6034427, Mar 7, 2000

Filed:

Jan 28, 1998

Appl. No.:

9/014693

Inventors:

James J. D. Lan - Fremont CA
Steve S. Chiang - Saratoga CA
Paul Y. F. Wu - San Jose CA
William H. Shepherd - Placitas NM
John Y. Xie - San Jose CA
Hang Jiang - Milpitas CA

Assignee:

Prolinx Labs Corporation - San Jose CA

International Classification:

H01L 2312

US Classification:

257698

Abstract:

An integrated circuit (IC) package substrate has a dielectric layer and a micro filled via formed substantially in the center of a hole in the dielectric layer. The IC package substrate has at least one chip bonding pad and one ball attach pad that are electrically coupled to each other by the micro filled via. The micro filled via is formed of a material called a "micro filled via material" that includes a binding material and optionally includes a number of particles (between 0%-90% by volume) dispersed in the binding material. The binding material can be any material, such as a polymer that is either conductive or nonconductive. The particles can be formed of any conductive material, such as a conductive polymer or a conductive metal (e. g. copper or gold). An electrical conductor can be originally formed simply by contact between conductive particles located adjacent to each other.

US Patent:

52365506, Aug 17, 1993

Filed:

Apr 24, 1992

Appl. No.:

7/874194

Inventors:

Norman E. Abt - Burlingame CA
William H. Shepherd - Placitas NM

Assignee:

National Semiconductor Corporation - Santa Clara CA

International Classification:

B44C 122
C23F 100

US Classification:

156643

Abstract:

The present invention provides a process for patterning ruthenium. A layer of ruthenium is formed on a substrate. The ruthenium is masked. The ruthenium is exposed to an oxygen plasma.

US Patent:

57675759, Jun 16, 1998

Filed:

Oct 17, 1995

Appl. No.:

8/543982

Inventors:

James J. D. Lan - Fremont CA
Steve S. Chiang - Saratoga CA
Paul Y. F. Wu - San Jose CA
William H. Shepherd - Placitas NM
John Y. Xie - San Jose CA
Hang Jiang - Milpitas CA

Assignee:

Prolinx Labs Corporation - San Jose CA

International Classification:

H01L 2312

US Classification:

257701

Abstract:

An integrated circuit (IC) package substrate has a dielectric layer and a micro filled via formed substantially in the center of a hole in the dielectric layer. The IC package substrate has at least one chip bonding pad and one ball attach pad that are electrically coupled to each other by the micro filled via. The micro filled via is formed of a material called a "micro filled via material" that includes a binding material and optionally includes a number of particles (between 0%-90% by volume) dispersed in the binding material. The binding material can be any material, such as a polymer that is either conductive or nonconductive. The particles can be formed of any conductive material, such as a conductive polymer or a conductive metal (e. g. copper or gold). An electrical conductor can be originally formed simply by contact between conductive particles located adjacent to each other.