William P Wolf

US Patent:

20110106205, May 5, 2011

Filed:

Apr 21, 2010

Appl. No.:

12/764140

Inventors:

Markus W. Reiterer - Plymouth MN, US
Andrew J. Thom - Maple Grove MN, US
Lea A. Nygren - Bloomington MN, US
William D. Wolf - Plymouth MN, US

Assignee:

MEDTRONIC, INC. - Minneapolis MN

International Classification:

A61N 1/375
H02G 3/18

US Classification:

607 37, 174667, 607 2

Abstract:

A feedthrough assembly, as well as a method of forming a feedthrough assembly, including a metallic ferrule, and a biocompatible, non-conductive, high-temperature, co-fired insulator engaged with the metallic ferrule at an interface between the ferrule and the insulator. The insulator includes a first surface at the interface and a second surface internal to the insulator. At least one conductive member may be disposed at the second surface, wherein at least the first surface of the insulator is devoid of surface cracks greater than 30 μm. The first surface of the insulator may also be devoid of a surface roughness greater than 0.5 μm.

US Patent:

58702725, Feb 9, 1999

Filed:

May 6, 1997

Appl. No.:

8/852198

Inventors:

Lynn M. Seifried - Minneapolis MN
Joseph F. Lessar - Coon Rapids MN
William D. Wolf - Minneapolis MN
Mary A. Fraley - Minnetonka MN
Kevin K. Tidemand - East Bethel MN
David B. Engmark - Bethel MN
Ronald F. Hoch - Andover MN
Craig L. Wiklund - Bloomington MN

Assignee:

Medtronic Inc. - Minneapolis MN

International Classification:

H01G 435
H01G 4008

US Classification:

361302

Abstract:

A capacitive filter feedthrough assembly and method of making the same are disclosed for shielding an implantable medical device such as pacemaker or defibrillator from electromagnetic interference or noise. A ferrule is adapted for mounting onto a conductive device housing by welding, soldering, brazing or gluing, and supports a terminal pin for feedthrough passage to a housing interior. A capacitive filter is mounted at the inboard side of a device housing, with capacitive filter electrode plate sets coupled respectively to the housing and the terminal pin by an electrically conductive combination of solder and brazing. In one embodiment of the invention, multiple capacitive filters are provided in an array within a common base structure, where each capacitive filter is associated with a respective terminal pin.

US Patent:

20100010560, Jan 14, 2010

Filed:

Mar 4, 2009

Appl. No.:

12/397785

Inventors:

William J. Taylor - Anoka MN, US
Lynn M. Seifried - Minneapolis MN, US
William D. Wolf - St. Louis Park MN, US
Andrew J. Ries - Lino Lakes MN, US
John E. Kast - Hugo MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

A61N 1/02

US Classification:

607 36

Abstract:

Methods and apparatuses are provided for an electrical device that employs a feedthrough including a hermetic seal that seals an interior region of the electrical device. The electrical device includes an electrical contact disposed within the interior region of the electrical device, and a wire terminal that includes an encircled portion that is encircled by the feedthrough, and a first end that electrically connects with said electrical contact. When the electrical device is constructed, the first end of the wire terminal is coated with a conductive metal that is more resistant to oxidation than the wire terminal. The first end of the wire terminal is secured to the electrical contact using a mechanical device such as a crimping connector or a spring connector.

US Patent:

20090163974, Jun 25, 2009

Filed:

Mar 4, 2009

Appl. No.:

12/397774

Inventors:

William J. Taylor - Anoka MN, US
Lynn M. Seifried - Minneapolis MN, US
William D. Wolf - St. Louis Park MN, US
Andrew J. Ries - Lino Lakes MN, US
John E. Kast - Hugo MN, US

Assignee:

Medtronic, Inc. - Minneapolis MN

International Classification:

A61N 1/02

US Classification:

607 36

Abstract:

Methods and apparatuses are provided for an electrical device that employs a feedthrough including a hermetic seal that seals an interior region of the electrical device. The electrical device includes an electrical contact disposed within the interior region of the electrical device, and a wire terminal that includes an encircled portion that is encircled by the feedthrough, and a first end that electrically connects with said electrical contact. When the electrical device is constructed, the first end of the wire terminal is coated with a conductive metal that is more resistant to oxidation than the wire terminal. The first end of the wire terminal is secured to the electrical contact using a mechanical device such as a crimping connector or a spring connector.

US Patent:

20070236861, Oct 11, 2007

Filed:

Apr 5, 2006

Appl. No.:

11/278773

Inventors:

Jeremy Burdon - Minneapolis MN, US
Joyce Yamamoto - Maple Grove MN, US
Lea Nygren - Bloomington MN, US
William Wolf - St. Louis Park MN, US

International Classification:

H01G 4/35

US Classification:

361302000

Abstract:

A hermetic interconnect for implantable medical devices is presented. In one embodiment, the hermetic interconnect includes a conductive material introduced to a via in a single layer. The conductive material includes a first end and a second end. A first bonding pad is coupled to the first end of the conductive material. A second bonding pad is coupled to the second end of the conductive material. The single layer and the conductive material undergo a co-firing process.

US Patent:

20070060969, Mar 15, 2007

Filed:

Sep 15, 2005

Appl. No.:

11/227342

Inventors:

Jeremy Burdon - Minneapolis MN, US
Joyce Yamamoto - Maple Grove MN, US
Lea Nygren - Bloomington MN, US
William Wolf - St. Louis Park MN, US

International Classification:

A61N 1/375

US Classification:

607037000

Abstract:

The invention includes a family of miniaturized, hermetic electrical feedthrough assemblies adapted for implantation within a biological system. An electrical feedthrough assembly according to the invention can be used as a component of an implantable medical device such as an implantable pulse generator, cardioverter-defibrillator, physiologic sensor, drug-delivery system and the like. Such assemblies require biocompatibility and resistance to degradation under applied bias current or voltage. Such an assembly is fabricated by interconnected electrical pathways, or vias, of a conductive metallic paste disposed between ceramic green-state material. The layers are stacked together and sintered to form a substantially monolithic dielectric structure with at least one embedded metallization pathway extending through the structure. The metallization pathway reliably conducts electrical signals even when exposed to body fluids and tissue and providing reliable electrical communication. After sintering the structure is hermetically diffusion bonded to a part of a ferrule and/or adjacent support member.

US Patent:

20060247713, Nov 2, 2006

Filed:

Apr 28, 2005

Appl. No.:

11/116965

Inventors:

John Nicholson - Blaine MN, US
James Strom - Arden Hills MN, US
William Wolf - St. Louis Park MN, US

International Classification:

A61N 1/375

US Classification:

607036000

Abstract:

An implantable medical device has one or more feedthrough/electrode assemblies positioned around an outer periphery of the device. Each of the assemblies includes a ferrule and a feedthrough conductor that extends longitudinally through the ferrule. Each of the assemblies also includes a cover having an insulative body and an electrical contact that is mounted to the plastic insulator. The plastic insulator is positioned over an inner end of the assembly such that the contact is operatively coupled to the feedthrough conductor of the assembly. The cover can be oriented so as to be freely accessible for purposes of electrically connecting circuitry within the implantable medical device to the contact, and in turn, the feedthrough conductor. In turn, the wiring used in connecting the circuitry and the contact can be routed within the implantable medical device as desired.

US Patent:

20060247714, Nov 2, 2006

Filed:

Apr 28, 2005

Appl. No.:

11/116968

Inventors:

William Taylor - Anoka MN, US
Zhi Fang - Maple Grove MN, US
William Wolf - St. Louis Park MN, US
Shawn Knowles - St. Francis MN, US

International Classification:

A61N 1/375

US Classification:

607036000

Abstract:

A hermetic implantable medical device (IMD) is provided with a single or multi-pin arrangement including selected glass to metal seals for a feedthrough including a ceramic disk member coupled to the sealing glass surface in potential contact with body fluids. By judicious selection of component materials (ferrule, seal insulator and pin) provides for either compression or match seals for electrical feedthroughs (having a single or multi-pin array) provide corrosion resistance and biocompatibility required in IMDs. The resultant feedthrough configuration accommodates one pin within a single ferrule or at least two pins in a single ferrule having a pin surrounded by insulator material (e.g., alumina ceramic, zirconia ceramic, zirconia silicate ceramic, mullite, each having higher melting points than the sealing glass distributed around the pin within the ferrule, or feldspar porcelain materials or alumino-silicate glasses having a lower melting point than the sealing glass) distributed around the pin within the ferrule.