Werner Goetz - Palo Alto CA, US Michael Camras - Sunnyvale CA, US Changhua Chen - San Jose CA, US Xiaoping Chen - San Jose CA, US Gina Christenson - Sunnyvale CA, US R. Kern - San Jose CA, US Chihping Kuo - Milpitas CA, US Paul Martin - Pleasanton CA, US Daniel Steigerwald - Cupertino CA, US
International Classification:
H01L027/15
US Classification:
257/079000
Abstract:
P-type layers of a GaN based light-emitting device are optimized for formation of Ohmic contact with metal. In a first embodiment, a p-type GaN transition layer with a resistivity greater than or equal to about 7 cm is formed between a p-type conductivity layer and a metal contact. In a second embodiment, the p-type transition layer is any III-V semiconductor. In a third embodiment, the p-type transition layer is a superlattice. In a fourth embodiment, a single p-type layer of varying composition and varying concentration of dopant is formed.
Formation Of Ohmic Contacts In Iii-Nitride Light Emitting Devices
Werner Goetz - Palo Alto CA, US Michael Camras - Sunnyvale CA, US Changhua Chen - San Jose CA, US Xiaoping Chen - San Jose CA, US Gina Christenson - Sunnyvale CA, US R. Kern - San Jose CA, US Chihping Kuo - Milpitas CA, US Paul Martin - Pleasanton CA, US Daniel Steigerwald - Cupertino CA, US
International Classification:
H01L021/00 H01L033/00
US Classification:
257103000, 438022000
Abstract:
P-type layers of a GaN based light-emitting device are optimized for formation of Ohmic contact with metal. In a first embodiment, a p-type GaN transition layer with a resistivity greater than or equal to about 7 Ω cm is formed between a p-type conductivity layer and a metal contact. In a second embodiment, the p-type transition layer is any III-V semiconductor. In a third embodiment, the p-type transition layer is a superlattice. In a fourth embodiment, a single p-type layer of varying composition and varying concentration of dopant is formed.