Carl L Eggerding

US Patent:

7573698, Aug 11, 2009

Filed:

Sep 7, 2006

Appl. No.:

11/517536

Inventors:

Carl L. Eggerding - Murrells Inlet SC, US
Jason MacNeal - Danville KY, US
John L. Galvagni - Surfside Beach SC, US
Andrew P. Ritter - Surfside Beach SC, US

Assignee:

AVX Corporation - Myrtle Beach SC

International Classification:

H01G 4/228
H01G 4/06

US Classification:

3613063, 361311

Abstract:

A method of forming a window via capacitor comprises a first step of providing a plurality of interleaved dielectric layers and paired electrode layers to create a multilayered arrangement characterized by top and bottom surfaces and a plurality pf side surfaces. First and second transition layer electrode portions are provided on a top surface of the multilayered arrangement on top of which a cover layer formed to define openings, or windows, therein is provided. The cover layer may be provided before device firing or may be printed on after firing using polymer or glass. Peripheral terminations are subsequently formed on the device periphery to connect selected electrode layers to respective transition layer electrode portions. Via terminations are formed in the cover layer openings, on top of which solder balls may be applied. Some of the terminations may be formed in accordance with various plating techniques as disclosed.

US Patent:

7724496, May 25, 2010

Filed:

Oct 31, 2006

Appl. No.:

11/590681

Inventors:

Carl L. Eggerding - Murrells Inlet SC, US
Ronald S. Demcko - Raleigh NC, US
John L. Galvagni - Surfside Beach SC, US

Assignee:

AVX Corporation - Myrtle Beach SC

International Classification:

H01G 4/005
H01G 4/228

US Classification:

361303, 3613061

Abstract:

The present subject matter is directed to methods and apparatus for providing a multilayer array component with interdigitated electrode layer portions configured to selectively provide signal filtering characteristics, over-voltage transient suppression capabilities, and land grid array (LGA) terminations. Embodiments of the present subject matter may define a single capacitor, a capacitor array, or a multilayer vertically integrated array with configurable equivalent electrical characteristics including equivalent series inductance (ESL), equivalent series resistance (ESR), and configurable capacitance and voltage clamping and transient suppression capabilities.

US Patent:

8238116, Aug 7, 2012

Filed:

Apr 2, 2008

Appl. No.:

12/061150

Inventors:

Carl L. Eggerding - Murrells Inlet SC, US
Andrew P. Ritter - Surfside Beach SC, US

Assignee:

AVX Corporation - Fountain Inn SC

International Classification:

H05K 1/14
H05K 1/11

US Classification:

361794, 3613061, 3613014, 361782

Abstract:

Disclosed are apparatus and methodology for providing land grid feedthrough capacitor designs having broad applicability to signal and power filtering technologies. Such capacitor designs provide characteristics for use in decoupling applications involving both signal level and power level environments. Low equivalent series inductance (ESL) is provided by current cancellation techniques involving opposite current flow in power or signal and ground current paths through the device.

US Patent:

20080232032, Sep 25, 2008

Filed:

Mar 20, 2007

Appl. No.:

11/725983

Inventors:

Brady Jones - Myrtle Beach SC, US
Carl L. Eggerding - Murrells Inlet SC, US
Allen Butler - Pittsboro NC, US
Gang Ning - Myrtle Beach SC, US
Kaye Poole - Raleigh NC, US
Craig William Nies - Myrtle Beach SC, US

Assignee:

AVX Corporation - Myrtle Beach SC

International Classification:

H01G 9/042
H01G 9/145
H01R 43/16

US Classification:

361509, 29 2503, 361508, 361528, 361529, 29874

Abstract:

A capacitor anode that is formed from ceramic particles (e.g., NbO, TaO) capable of being chemically reduced to form an electrically conductive composition (e.g., NbO, Ta) is provided. For instance, a slip composition containing the ceramic particles may be initially formed and deposited onto a carrier substrate in the form of a thin layer. If desired, multiple layers may be formed to achieve the target thickness for the anode. Once formed, the layer(s) are subjected to a heat treatment to chemically reduce the ceramic particles and form the electrically conductive anode. Contrary to conventional press-formed anodes, the slip-formed anodes of the present invention may exhibit a small thickness, high aspect ratio (i.e., ratio of width to thickness), and uniform density, which may in turn may lead to an improved volumetric efficiency and equivalent series resistance (“ESR”).

US Patent:

20210166873, Jun 3, 2021

Filed:

Feb 10, 2021

Appl. No.:

17/172248

Inventors:

- Fountain Inn SC, US
Carl L. Eggerding - Greenville SC, US

International Classification:

H01G 2/06
H01G 4/224
H05K 3/34
H01G 4/30
H01G 4/232

Abstract:

Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

US Patent:

20190244755, Aug 8, 2019

Filed:

Jan 7, 2019

Appl. No.:

16/240860

Inventors:

- Fountain Inn SC, US
Carl L. Eggerding - Greenville SC, US

International Classification:

H01G 2/06
H01G 4/232
H01G 4/224
H01G 4/30
H05K 3/34

Abstract:

Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

US Patent:

20150380175, Dec 31, 2015

Filed:

Jun 25, 2015

Appl. No.:

14/749785

Inventors:

- Fountain Inn SC, US
Carl L. Eggerding - Greenville SC, US
Bob Knopsnyder - Simpsonville SC, US

Assignee:

AVX Corporation - Fountain Inn SC

International Classification:

H01G 11/60
H01G 11/72
H01G 11/74
H01G 11/86
H01G 11/80
H01G 11/52
H01G 11/22

Abstract:

An ultra-thin electrochemical energy storage device is provided which utilizes electrode material with multi-layer current collectors and with an organic electrolyte between the electrodes. Multiple cells may be positioned in a plurality of stacks and all of the cells may be in series, parallel or some combination thereof. The energy storage device can be constructed at less than 0.5 millimeters thick and exhibit very low ESR and higher temperature range capabilities.

US Patent:

20150364254, Dec 17, 2015

Filed:

Jun 8, 2015

Appl. No.:

14/733029

Inventors:

- Fountain Inn SC, US
Carl L. Eggerding - Greenville SC, US

Assignee:

AVX CORPORATION - Fountain Inn SC

International Classification:

H01G 2/06
H01G 4/228
H01G 4/12
H01G 4/224
H01G 4/30
H01G 4/01

Abstract:

Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.