Chao Liu - San Jose CA, US Anthonius Bakker - Morgan Hill CA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
G05F 1/00
US Classification:
323283
Abstract:
A digital current share bus interface connects to a power module which provides a signal representative of its output current, and adjusts the module's output current in response to a control signal received from the interface. A data formatting module receives the output current signal and generates a digital word that varies with the current; the bits of the word are coupled to a current share bus. A comparator module receives digital words conveyed via the bus and generated by the data formatting module at respective inputs, and provides the control signal to the power module so as to adjust its output current to match the current value represented by the digital word on the bus. In a typical implementation, multiple power modules are coupled to the current share bus via respective interfaces, with the output currents of all the power modules connected in parallel.
Methods And Devices For Forming Nanostructure Monolayers And Devices Including Such Monolayers
Xiangfeng Duan - Mountain View CA, US Chao Liu - San Jose CA, US
Assignee:
Nanosys, Inc. - Palo Alto CA
International Classification:
H01L 21/31
US Classification:
438758, 438128, 438507, 438509, 977891, 257E21209
Abstract:
Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, formation of arrays in spin-on-dielectrics, solvent annealing after nanostructure deposition, patterning using resist, and/or use of devices that facilitate array formation. Related devices for forming nanostructure arrays are also provided, as are devices including nanostructure arrays (e. g. , memory devices).
Methods And Devices For Forming Nanostructure Monolayers And Devices Including Such Monolayers
Jian Chen - Mountain View CA, US Xiangfeng Duan - Mountain View CA, US Chao Liu - San Jose CA, US Madhuri L. Nallabolu - Sunnyvale CA, US J. Wallace Parce - Palo Alto CA, US Srikanth Ranganathan - Mountain View CA, US
Assignee:
Nanosys, Inc. - Palo Alto CA
International Classification:
G03F 7/26
US Classification:
430311, 430328, 430394, 430330
Abstract:
Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, formation of arrays in spin-on-dielectrics, solvent annealing after nanostructure deposition, patterning using resist, and/or use of devices that facilitate array formation. Related devices for forming nanostructure arrays are also provided, as are devices including nanostructure arrays (e. g. , memory devices). Methods for protecting nanostructures from fusion during high temperature processing are also provided.
Srikanth Ranganathan - Mountain View CA, US Paul Bernatis - Sunnyvale CA, US Joel Gamoras - Vallejo CA, US Chao Liu - San Jose CA, US J. Wallace Parce - Palo Alto CA, US
Assignee:
Nanosys, Inc. - Palo Alto CA
International Classification:
C22C 5/04 B32B 15/02
US Classification:
148430, 420462, 428546
Abstract:
Methods for producing electronic grade metal nanostructures having low levels of contaminants are provided. Monolayer arrays, populations, and devices including such electronic grade nanostructures are described. In addition, novel methods and compositions for production of Group 10 metal nanostructures and for production of ruthenium nanostructures are provided, along with methods for recovering nanostructures from suspension.
Methods And Devices For Forming Nanostructure Monolayers And Devices Including Such Monolayers
Jian Chen - Sunnyvale CA, US Karen Chu Cruden - Pleasanton CA, US Xiangfeng Duan - Mountain View CA, US Chao Liu - San Jose CA, US J. Wallace Parce - Palo Alto CA, US
Assignee:
Sandisk Corporation - Milpitas CA
International Classification:
H01L 21/3105
US Classification:
438782, 438128, 438674, 977845, 977855, 257E21241
Abstract:
Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, formation of arrays in spin-on-dielectrics, solvent annealing after nanostructure deposition, patterning using resist, and/or use of devices that facilitate array formation. Related devices for forming nanostructure arrays are also provided, as are devices including nanostructure arrays (e. g. , memory devices).
Methods And Devices For Forming Nanostructure Monolayers And Devices Including Such Monolayers
Jian Chen - Sunnyvale CA, US Xiangfeng Duan - Los Angeles CA, US Chao Liu - San Jose CA, US Madhuri Nallabolu - Sunnyvale CA, US J. Wallace Parce - Palo Alto CA, US Srikanth Ranganathan - Mountain View CA, US
Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, formation of arrays in spin-on-dielectrics, solvent annealing after nanostructure deposition, patterning using resist, and/or use of devices that facilitate array formation. Related devices for forming nanostructure arrays are also provided, as are devices including nanostructure arrays (e. g. , memory devices). Methods for protecting nanostructures from fusion during high temperature processing are also provided.
Post-Deposition Encapsulation Of Nanostructures: Compositions, Devices And Systems Incorporating Same
Jeffery Whiteford - Belmont CA, US Rhett Brewer - Sunnyvale CA, US Mihai Buretea - San Francisco CA, US Jian Chen - Mountain View CA, US Karen Cruden - Pleasanton CA, US Xiangfeng Duan - Mountain View CA, US William Freeman - San Mateo CA, US David Heald - Solvang CA, US Francisco Leon - Palo Alto CA, US Chao Liu - San Jose CA, US Andreas Meisel - San Francisco CA, US Kyu Min - San Jose CA, US J. Parce - Palo Alto CA, US Erik Scher - San Francisco CA, US
Assignee:
NANOSYS, Inc. - Palo Alto CA
International Classification:
B32B 5/16
US Classification:
428403000
Abstract:
Ligand compositions for use in preparing discrete coated nanostructures are provided, as well as the coated nanostructures themselves and devices incorporating same. Methods for post-deposition shell formation on a nanostructure and for reversibly modifying nanostructures are also provided. The ligands and coated nanostructures of the present invention are particularly useful for close packed nanostructure compositions, which can have improved quantum confinement and/or reduced cross-talk between nanostructures.
Post-Deposition Encapsulation Of Nanostructures: Compositions, Devices And Systems Incorporating Same
Jeffery Whiteford - Belmont CA, US Rhett Brewer - Sunnyvale CA, US Mihai Buretea - San Francisco CA, US Jian Chen - Mountain View CA, US Karen Cruden - Pleasanton CA, US Xiangfeng Duan - Mountain View CA, US William Freeman - San Mateo CA, US David Heald - Solvang CA, US Francisco Leon - Palo Alto CA, US Chao Liu - San Jose CA, US Andreas Meisel - San Francisco CA, US Kyu Min - San Jose CA, US J. Parce - Palo Alto CA, US Erik Scher - San Francisco CA, US
Assignee:
NANOSYS, Inc. - Palo Alto CA
International Classification:
B32B 5/16 B32B 15/04 B32B 17/06
US Classification:
428402240
Abstract:
Ligand compositions for use in preparing discrete coated nanostructures are provided, as well as the coated nanostructures themselves and devices incorporating same. Methods for post-deposition shell formation on a nanostructure and for reversibly modifying nanostructures are also provided. The ligands and coated nanostructures of the present invention are particularly useful for close packed nanostructure compositions, which can have improved quantum confinement and/or reduced cross-talk between nanostructures.
University of Pennsylvania Philadelphia, PA 2012 to 2014 Master of Science in Engineering in Mechanical Engineering and Applied Mechanics(Focus on Robotics)Dalian Jiaotong University Dalian, China 2008 to 2012 Bachelor of Science in Mechanical Engineering and Automation
Skills:
C/C++, Python, Matlab, Simulink, AutoCAD, SolidWorks, Pro/E, Servo Motor, Circuit Design, Altium, PCB, Eagle, MS Suite
Feb 2012 to 2000 Senior ScientistNanosys Inc Palo Alto, CA Jul 2004 to Feb 2012 R&D ScientistSeagate Technology Pittsburgh, PA May 2001 to Jul 2004 Post Doctor Researcher & Research Staff MemberGeorgia Institute of Technology Atlanta, GA Jan 1997 to May 2001 Graduate Research AssistantShanghai Institute of Optics and Fine Mechanics
Jul 1993 to Dec 1996 Chinese Academy of Sciences, Research Scientist
Education:
Georgia Institute of Technology 1997 to 2001 Ph.D. in ChemistryUniversity of Science and Technology of China 1988 to 1993 B.S. in Chemistry
Skills:
problem solving, failure analysis, TEM, SEM, nanotechnology, coating
Jan 2013 to 2000 LMC consulting and accounting as an accountantCAM graphics co. Inc Amityville, NY Jun 2006 to Nov 2009 Amityville, NY as a bookkeeperBranford Industry company Levittown, PA May 2005 to Jun 2006 Levittown, PA as a bookkeeperI love my home Co. in Beijing
Sep 2000 to Mar 2003 Bookkeeper
Education:
State University of NY at Old Westbury 2006 to 2007 BS in accountingTemple University 2003 to 2005 accounting
Shenyin Wanguo Asset Management (Asia) Ltd., Central Hong Kong, Hong Kong Island Feb 2012 to Jun 2012 Asset Management InternWashington Mutual/JP Morgan Chase Cupertino, CA Sep 2008 to Dec 2008 Bank TellerVertical Marine Fighter Attack Squadron San Diego, CA Apr 2007 to Sep 2008 Production, Planning and Expediting ManagerMarine Aircraft Group San Diego, CA May 2005 to Apr 2007 Pre-Expended Branch Manager
Education:
FORDHAM UNIVERSITY New York, NY Feb 2012 B.A. in Leadership
Cisco System Inc Santa Clara, CA May 2011 to Aug 2011 InternSAP
Jan 2010 to May 2010 InternPwC
Jun 2009 to Jan 2010 (PricewaterhouseCoopers) Intern Shanghai, China
Education:
Tongji University Jun 2010 Bachelor of Science in Software EngineeringState University of New State at Buffalo Buffalo, NY Master of Science in Computer Science and Engineering
Googleplus
Chao Liu
Lived:
New York, NY Hong Kong Paris, France Cupertino, CA San Diego, CA Iwakuni, Japan Boston, MA
Work:
United States Marine Corps - Corporal (2004-2008)
Education:
Fordham University - Organizational Leadership, University of Paris VIII: Vincennes - Saint-Denis, De Anza College
His coauthors include fellow MIT postdoc Chao Liu; Pingchuan Ma PhD 25; Jack Eastman MEng 24; Dylan Randle and Yuri Ivanov of Amazon Robotics; MIT professors of electrical engineering and computer science Daniela Rus, who leads MITs Computer Science and Artificial Intelligence Laboratory (CSAIL);