Chee Seng Lai

US Patent:

8190110, May 29, 2012

Filed:

Feb 2, 2009

Appl. No.:

12/363978

Inventors:

Chee Hong Lai - Cupertino CA, US

Assignee:

Fujitsu Semiconductor Limited - Kanagawa

International Classification:

H04B 1/04

US Classification:

455129

Abstract:

According to one embodiment, a power combiner configured to receive at least two input signals and combine the input signals to generate an output signal. The power combiner may include at least two input layers and an output layer located between the input layers. Each layer may be in the shape of a slotted loop.