Cheng Bin Wang

US Patent:

6454508, Sep 24, 2002

Filed:

May 1, 1998

Appl. No.:

09/070854

Inventors:

Masato M. Toshima - Sunnyvale CA
Phil M. Salzman - San Jose CA
Steven C. Murdoch - Palo Alto CA
Cheng Wang - San Jose CA
Mark A. Stenholm - San Jose CA
James Howard - San Jose CA
Leonard Hall - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B65G 4905

US Classification:

414217, 414940, 414939, 118719

Abstract:

A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

US Patent:

6599076, Jul 29, 2003

Filed:

Aug 19, 2002

Appl. No.:

10/223539

Inventors:

Masato M. Toshima - Sunnyvale CA
Phil M. Salzman - San Jose CA
Steven C. Murdoch - Palo Alto CA
Cheng Wang - San Jose CA
Mark A. Stenholm - San Jose CA
James Howard - San Jose CA
Leonard Hall - San Jose CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B65G 4907

US Classification:

414217, 414939

Abstract:

A workpiece loading interface is included within a workpiece processing system which processes workpieces, typically wafers, in a vacuum. The workpiece loading interface includes two separate chambers. Each chamber may be separately pumped down. Thus, while a first cassette of wafers, from a first chamber is being accessed, a second cassette of wafers may be loaded in the second chamber and the second chamber pumped down. Each chamber is designed to minimize intrusion to a clean room. Thus a door to each chamber has a mechanism which, when opening the door, first moves the door slightly away from an opening in the chamber and then the door is moved down parallel to the chamber. After the door is opened, a cassette of wafers is lowered through the opening in a motion much like a drawbridge. The cassette may be pivoted within the chamber when the position from which wafers are accessed from the cassette differs from the position from which the cassette is lowered out of the chamber.

US Patent:

6708045, Mar 16, 2004

Filed:

Apr 7, 2000

Appl. No.:

09/545228

Inventors:

Winston Hong Lieu - Holmdel NJ
Cheng Wang - Belle Mead NJ
David Kiley - Brick NJ
Charles Chia-Yi Pai - Cupertino CA

Assignee:

Mobicom, Inc. - Holmdel NJ

International Classification:

H04B 138

US Classification:

455557, 455418, 455558

Abstract:

A wireless terminal is described whose software are more easily upgradable than many in the prior art. Furthermore, the first illustrative embodiment of the present invention is an arrangement in which a user can easily: (1) upgrade the software in a wireless terminal, (2) change the parameters affecting the operation of the wireless terminal, (3) enable and disable features and options on the wireless terminal, (4) install software modules onto the wireless terminal and remove them, (5) reconfigure the reconfigurable hardware on the wireless terminal, (6) extract performance data from the wireless terminal for analysis and testing of the wireless terminal, and (7) load contact information (e. g. , names and associated telephone numbers, etc. ) onto the wireless terminal.

US Patent:

7041682, May 9, 2006

Filed:

Jul 2, 2003

Appl. No.:

10/612176

Inventors:

Neng-Yang Shih - North Caldwell NJ, US
Steven Wang - Jersey City NJ, US
Gregory Reichard - Ann Arbor MI, US
Dong Xiao - Warren NJ, US
Cheng Wang - Summit NJ, US

Assignee:

Schering Corporation - Kenilworth NJ

International Classification:

A61K 31/445
C07D 211/56

US Classification:

514326, 546207, 546208, 546209, 546210, 546212, 546214, 544124

Abstract:

Disclosed are NKantagonists having the formula:.

US Patent:

7049320, May 23, 2006

Filed:

Dec 17, 2002

Appl. No.:

10/321687

Inventors:

Sunil Paliwal - Scotch Plains NJ, US
Gregory A. Reichard - Ann Arbor MI, US
Cheng Wang - Summit NJ, US
Dong Xiao - Warren NJ, US
Neng-Yang Shih - North Caldwell NJ, US
Juan D. Arredondo - Montclair NJ, US
Michelle Laci Wrobleski - Whitehouse Station NJ, US
Anandan Palani - Bridgewater NJ, US

Assignee:

Schering Corporation - Kenilworth NJ

International Classification:

A61K 31/44
C07D 221/20

US Classification:

514278, 546 16, 546 19

Abstract:

A NKantagonist having the formula (I),.

US Patent:

7354922, Apr 8, 2008

Filed:

Dec 1, 2005

Appl. No.:

11/291363

Inventors:

Dong Xiao - Warren NJ, US
Anandan Palani - Bridgewater NJ, US
Cheng Wang - Summit NJ, US
Xianhai Huang - Warren NJ, US
Sapna S. Shah - Jamesburg NJ, US
Ashwin U. Rao - Avenel NJ, US
Xiao Chen - Edison NJ, US
Sunil Paliwal - Monroe Township NJ, US
Neng-Yang Shih - Warren NJ, US

Assignee:

Schering Corporation - Kenilworth NJ

International Classification:

A01N 43/58
A01N 43/60
C07D 245/00
C07D 241/36
C07D 471/00

US Classification:

514249, 540460, 544349

Abstract:

A compound having the general structure shown in Formula (I):.

US Patent:

7498438, Mar 3, 2009

Filed:

Apr 6, 2005

Appl. No.:

11/100226

Inventors:

Dong Xiao - Warren NJ, US
Anandan Palani - Bridgewater NJ, US
Cheng Wang - King of Prussia PA, US
Neng-Yang Shih - Warren NJ, US
Gregory A. Reichard - Ann Arbor MI, US

Assignee:

Schering Corporation - Kenilworth NJ

International Classification:

C07D 471/02
C07D 491/02

US Classification:

546116, 546118

Abstract:

A compound having the general structure shown in Formula 1:.

US Patent:

7506217, Mar 17, 2009

Filed:

Dec 30, 2005

Appl. No.:

11/325773

Inventors:

Edson Borin - Campinas, BR
Cheng C. Wang - San Jose CA, US
Youfeng Wu - Palo Alto CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 11/00

US Classification:

714 51, 714732

Abstract:

A method and apparatus for software-based control flow checking for soft error detection. In one embodiment, the method includes the instrumentation of one basic block of a target program to update a signature register with a successor basic block signature at an end of the basic block. In addition, the basic block is instrumented to verify that contents of the signature register match a basic block signature at a beginning of the basic block. In one embodiment, an instruction is inserted within the basic block to cause the signature register to store a predetermined value if the contents of the signature register match a basic block signature. In one embodiment, a basic block may be subdivided into a plurality of regions; each region is assigned a signature and instrumented to update the signature register at a beginning of each region. Other embodiments are described and claimed.