Chung H Ho

US Patent:

42544459, Mar 3, 1981

Filed:

May 7, 1979

Appl. No.:

6/036946

Inventors:

Chung W. Ho - Chappaqua NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 118

US Classification:

361392

Abstract:

A module for LSI chips includes an orthogonal array of sets of pads and fan-out metallization for a large number of chips. Running parallel to the sides of the chips and the fan-out area are several parallel prefabricated, thin film engineering change interconnection lines terminating in pads adjacent to the fan-out. The pads are arranged to permit discretionary connections of the fan-out pads to the engineering change pads with minimal crossovers by means of short fly wires. A staggered pad arrangement minimizes potential crossovers and maximizes the number of interconnection lines that can be fabricated.