Chung Puo Yang

US Patent:

6537846, Mar 25, 2003

Filed:

Mar 30, 2001

Appl. No.:

09/823550

Inventors:

Heon Lee - Sunnyvale CA
Chung Ching Yang - Saratoga CA

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L 2106

US Classification:

438102, 438455, 438456, 143 331, 143 336

Abstract:

A selenidation reaction for bonding one or more active substrates to a base substrate is disclosed. A bonded-substrate is fabricated by forming a first multi-stacked layer of selenium and indium on a bonding surface of an active substrate and forming a second multi-stacked layer of selenium and indium on a mounting surface of a base substrate. The first and second multi-stacked layers are placed into contact with each other with substantially no pressure. Then the active substrate and the base substrate are bonded to each other by annealing them in an inert ambient to form an indium-selenium compound bond layer that adhesively bonds the substrates to each other. The annealing can occur at a lower temperature than prior wafer-bonding processes and the first and second multi-stacked layers can be deposited over a wide range of relatively low temperatures including room temperature. Additionally, tellurium can be added to the selenium of either one or both of the first and second multi-stacked layers to reduce the annealing temperature and to form an indium-selenium-tellurium compound bond layer that adhesively bonds the substrates to each other. Elemental compounds or amorphous compounds can be used for the materials of the first and second multi-stacked layers to form a polycrystalline or amorphous compound bond layer respectively.

US Patent:

6930368, Aug 16, 2005

Filed:

Jul 31, 2003

Appl. No.:

10/630769

Inventors:

Peter G. Hartwell - Sunnyvale CA, US
Storrs T. Hoen - Brisbane CA, US
David Horsley - Berkeley CA, US
Chung Ching Yang - Saratoga CA, US
Paul P. Merchant - Belmont CA, US
Carl P. Taussig - Redwood City CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L029/82

US Classification:

257418, 257417

Abstract:

A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.

US Patent:

7185973, Mar 6, 2007

Filed:

Oct 1, 2004

Appl. No.:

10/954263

Inventors:

Gary A. Gibson - Palo Alto CA, US
Krzysztof Nauka - Redwood City CA, US
Chung Ching Yang - Saratoga CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

B41J 2/09
B41J 2/02

US Classification:

347 77, 347 73

Abstract:

An assembly for depositing material onto a substrate includes a reservoir containing the material. The reservoir also includes a nozzle through which the material is jetted and formed into droplets. The droplets travel through flight paths prior to deposition onto the substrate. The assembly includes a charging ring for inducing an electrical charge to one or more of the droplets and a plurality of deflection plates for controlling the flight paths of the droplets. In addition, the assembly also includes a droplet manipulating device configured to manipulate the droplets at least one of during the flight paths and after deposition of the droplets onto the substrate.

US Patent:

7391706, Jun 24, 2008

Filed:

Oct 31, 2003

Appl. No.:

10/698717

Inventors:

Krzysztof Nauka - Redwood City CA, US
Chung C. Yang - Saratoga CA, US

Assignee:

Samsung Electronics Co., Ltd. - Gyeonggi-do

International Classification:

G11B 7/00

US Classification:

369126, 369101

Abstract:

A data storage device includes a conductive probe having a tip; a substrate; and a data storage medium including a layer of poled ferroelectric material. The ferroelectric layer is between the tip and the substrate.

US Patent:

7869336, Jan 11, 2011

Filed:

Jun 2, 2008

Appl. No.:

12/131664

Inventors:

Krzysztof Nauka - Redwood City CA, US
Chung C. Yang - Saratoga CA, US

Assignee:

Samsung Electronics Co., Ltd. - Gyeonggi-do

International Classification:

G11B 7/00

US Classification:

369126, 369101

Abstract:

A data storage device includes a conductive probe having a tip; a substrate; and a data storage medium including a layer of poled ferroelectric material. The ferroelectric layer is between the tip and the substrate.

US Patent:

8003980, Aug 23, 2011

Filed:

Jan 30, 2007

Appl. No.:

11/700447

Inventors:

Xia Sheng - Palo Alto CA, US
Krzysztof Nauka - Palo Alto CA, US
Chung Ching Yang - Palo Alto CA, US

Assignee:

Hewlett-Packard Development Company, L.P. - Houston TX

International Classification:

H01L 29/08
H01L 35/24
H01L 51/00

US Classification:

257 40, 257E21024, 257E51001, 257E51002, 257E51003, 257E51004, 257E51005, 257E51006, 257E51008, 257E51009, 257E51022, 257E51023, 257E51024, 257E51025, 257E51026

Abstract:

The present invention is drawn to a layered organic device, and a method of forming the same. The method includes steps of applying a first solvent-containing organic layer to a substrate and removing solvent from the first solvent-containing organic layer to form a first solidified organic layer. Additional steps include applying a second solvent-containing organic layer to the first solidified organic layer and removing solvent from the second solvent-containing organic layer to form a second solidified organic layer. The first solidified organic layer can be crosslinked, which suppresses negative impact to components in the first solidified organic layer when the solvent of the second solvent-containing organic layer is deposited on the first solidified organic layer.

US Patent:

20060073337, Apr 6, 2006

Filed:

Oct 1, 2004

Appl. No.:

10/954476

Inventors:

Krzysztof Nauka - Redwood City CA, US
Chung Yang - Saratoga CA, US

International Classification:

B05D 5/12

US Classification:

428407000, 423403000, 524439000, 427100000

Abstract:

In a method of forming a conductive path on a substrate, a layer of metallic nanoparticles is printed on the substrate and a conductive organic material is also printed, such that the conductive organic material is interspersed with the layer of metallic nanoparticles to thereby enhance one or more electrical properties of the conductive path.

US Patent:

55575960, Sep 17, 1996

Filed:

Jul 12, 1995

Appl. No.:

8/501432

Inventors:

Gary Gibson - Palo Alto CA
Theodore I. Kamins - Palo Alto CA
Marvin S. Keshner - Mountain View CA
Craig M. Perlov - Belmont CA
Chung C. Yang - Saratoga CA

International Classification:

G11B 700
G11C 1142

US Classification:

369101

Abstract:

A storage device including many field emitters in close proximity to a storage medium, and a micromover, all in a partial vacuum. Each field emitter can generate an electron beam current. The storage medium has many storage areas on it, with each field emitter responsible for a number of storage areas. Also, each storage area can be in a number of different states to represent the information stored in that area. In storing information to the storage device, the power density of an electron beam current is increased to change the state of the storage area bombarded by the electron beam current. In reading information from the device, the power density of the electron beam current is reduced to generate a signal current from the storage area bombarded by the electron beam current. During reading, the power density is selected to be low enough so that no writing occurs. The magnitude of the signal current depends on the states of the storage area.